Patents by Inventor Ho C. Kong

Ho C. Kong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for preparing a urea-formaldehyde resin having a very low mole ratio of formaldehyde to urea
    Patent number: 4603191
    Abstract: Urea and formaldehyde are mixed in a mole ratio of about 1:2. The mixture is condensed for 30 minutes at a pH of 7.0 to 7.4 and a temperature between 80.degree. and 85.degree. C. The condensation is continued at a pH of 4.8 to 5.8 at the same temperature until the viscosity reaches values between 15 and 50 mPa.s. The mole ratio of urea to formaldehyde is adjusted to a value of 1:1.80 to 1:1.90 by adding urea. The condensation is continued under acidic conditions at the same temperature, until the viscosity reaches values of 35 to 80 mPa.s. At a pH of 5.8 to 6.5, the mole ratio of urea to formaldehyde is adjusted to a value between 1.0:1.0 and 1.0:1.30 by adding urea. The temperature is allowed to drop freely. When the temperature has dropped to below 50.degree. C., the pH is adjusted to a value of 7.0 to 8.0.
    Type: Grant
    Filed: November 27, 1984
    Date of Patent: July 29, 1986
    Assignee: Enigma N.V.
    Inventor: Ho C. Kong
  • Cordless telephone base housing
    Patent number: D369799
    Type: Grant
    Filed: January 5, 1995
    Date of Patent: May 14, 1996
    Assignee: Vtech Communications Ltd.
    Inventors: Pang C. Kong, Ho C. Kong, Wong F. Shan