Patents by Inventor Ho-chan Lee

Ho-chan Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240123630
    Abstract: One aspect of the gripping apparatus for gripping a gripping object provided with a head unit, in which a fitting groove is formed, of the present invention for achieving the above object comprises a base unit made of a frame, plate, box, or a combination thereof; a first gripper including a first distal end unit bent corresponding to the fitting groove, wherein a separation distance of the first distal end unit is adjusted at the base unit, and a plurality of first grippers facing each other are provided; a second gripper located outside the first gripper and including a second distal end unit bent toward a lower edge of the gripping object, wherein a separation distance of the second distal end unit is adjusted at the base unit, and a plurality of a second grippes facing each other are provided; an adjusting unit provided in the base unit and for adjusting a separation distance of the first distal end units of the plurality of first grippers and a separation distance of the second end units of the plurality
    Type: Application
    Filed: December 16, 2022
    Publication date: April 18, 2024
    Inventors: Seung Chan LEE, Ho Young LEE
  • Publication number: 20240083384
    Abstract: A vehicle seat reinforcement device includes a leg portion mounted on a floor panel, a seat cushion frame slidably mounted on the leg portion, and a load reinforcing structure connected between the leg portion and the seat cushion frame, wherein when a seat belt anchorage load is transferred to the seat cushion frame, the seat cushion frame is locked to the leg portion by the load reinforcing structure.
    Type: Application
    Filed: February 3, 2023
    Publication date: March 14, 2024
    Applicants: Hyundai Motor Company, Kia Corporation, Daechang Seat Co.,LTD-Dongtan, Hyundai Transys Inc.
    Inventors: Sang Soo LEE, Chan Ho JUNG, Mu Young KIM, Sang Hark LEE, Ho Suk JUNG, Deok Soo LIM, Sang Do PARK, In Sun BAEK, Sin Chan YANG, Chan Ki CHO, Myung Soo LEE, Jae Yong JANG, Jun Sik HWANG, Ho Sung KANG, Hae Dong KWAK, Hyun Tak KO
  • Publication number: 20230369596
    Abstract: An electrode has a current collector and an active material layer, which can provide an electrode capable of ensuring high levels of adhesion force between particles, and adhesion force between the active material layer and the current collector compared with a binder content in the active material layer. An electrochemical element and a secondary battery having the electrode are also provided.
    Type: Application
    Filed: September 27, 2021
    Publication date: November 16, 2023
    Applicant: LG Energy Solution, Ltd.
    Inventors: Geun Sung Lee, Il Ha Lee, In Taek Song, Jin Woo Park, Ki Hwan Kim, Ho Chan Lee
  • Publication number: 20230317955
    Abstract: An electrode has a current collector and an active material layer, which can provide an electrode capable of ensuring high levels of adhesion force between particles, and adhesion force between the active material layer and the current collector compared with a binder content in the active material layer. An-electrochemical element and a secondary battery comprising the electrode are also provided.
    Type: Application
    Filed: September 27, 2021
    Publication date: October 5, 2023
    Applicant: LG Energy Solution, Ltd.
    Inventors: Geun Sung Lee, Il Ha Lee, In Taek Song, Ki Hwan Kim, Yeong Bong Mok, Ho Chan Lee
  • Publication number: 20230133865
    Abstract: A substrate transfer system capable of performing efficient distribution exchange between fabricating facilities is provided. The substrate transfer system includes a lower rail, an upper rail which is located above the lower rail from a ground plane, and extends to be parallel to the lower rail, a conveyor which extends to intersect the lower rail and the upper rail, below the lower rail, a first lower transport unit which transports a first carrier along the lower rail and unloads the first carrier onto the conveyor, and a first upper transport unit which transports a second carrier along the upper rail and unloads the second carrier onto the conveyor, wherein the conveyor includes a linear module which moves the first carrier and the second carrier in a linear direction, and a turning module which turns the first carrier and the second carrier.
    Type: Application
    Filed: May 16, 2022
    Publication date: May 4, 2023
    Inventors: YOUN GON OH, JI HUN KIM, SEUNG GU BANG, SUNG-HOON LEE, HO CHAN LEE, HYEONG SEOK CHOO
  • Publication number: 20230107043
    Abstract: Provided is an equipment front end module (EFEM) including a base configured to communicate with a processor, a tray port on the base, the tray port being configured to load a tray including a stub and a grid holder, a working robot configured to move in a direction on the base, and grasp and convey the stub in the tray and the grid holder in the tray, and a shuttle port on the base, the shuttle port including a first groove configured to fix the stub, and a second groove configured to fix the grid holder, wherein the working robot is further configured to convey the stub to the first groove and convey the grid holder to the second groove.
    Type: Application
    Filed: April 1, 2022
    Publication date: April 6, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Youn Gon OH, Sae Yun Ko, Gil Ho Gu, Dong Su Kim, Ji Hun Kim, Sang Hyuk Park, Eun Hee Lee, Ho Chan Lee, Seong Sil Jeong, Seong Pyo Hong
  • Publication number: 20230099713
    Abstract: Disclosed is a method for manufacturing a dry electrode. In the method, a conductive primer layer and an insulating protective layer are formed in a single step, or the insulating protective layer is formed first before an electrode active material layer is formed and after the conductive primer layer is formed. In this manner, there is no gap between the insulating protective layer and the conductive primer layer, thereby providing further improved insulation property. In addition, since the dry electrode is manufactured by laminating the current collector having the conductive primer layer and the insulating protective layer with the dry electrode film, an electrode having excellent adhesion and improved stability can be obtained advantageously.
    Type: Application
    Filed: September 30, 2022
    Publication date: March 30, 2023
    Applicant: LG Energy Solution, Ltd.
    Inventors: Sang-Min Kwak, Koo-Seung Chung, Nam-Jeong Lee, Ho-Chan Lee, Dong-Oh Shin, Kwang-Ho Yoo
  • Publication number: 20230101674
    Abstract: Provided is a tray including a plate including a first region and a second region, a first groove on the first region of the plate and to which a stub is fixed, and a second groove on the second region of the plate and to which a grid holder is fixed, wherein the stub is configured to store test wafer pieces, and wherein the grid holder is configured to store a test sample.
    Type: Application
    Filed: April 12, 2022
    Publication date: March 30, 2023
    Applicant: SAMSUNG ELECTRONICS Co., LTD.
    Inventors: Youn Gon OH, Ji Hun KIM, SaeYun KO, Gil Ho GU, Dong Su KIM, Eun Hee LEE, Ho Chan LEE, Seong Sil JEONG, Seong Pyo HONG
  • Publication number: 20230067060
    Abstract: A substrate analysis apparatus is provided. The substrate analysis includes: an interlayer conveying module configured to transport a first FOUP; an exchange module which is connected to the interlayer conveying module, and configured to transfer a wafer from the first FOUP to a second FOUP; a pre-processing module configured to form a test wafer piece using the wafer inside the second FOUP; an analysis module configured to analyze the test wafer piece; and a transfer rail configured to transport the second FOUP containing the wafer and a tray containing the test wafer piece. The wafer includes a first identifier indicating information corresponding to the wafer, the test wafer piece includes a second identifier indicating information generated by the pre-processing module which corresponds to the test wafer piece, and the analysis module is configured to analyze the first identifier and the second identifier in connection with each other.
    Type: Application
    Filed: March 9, 2022
    Publication date: March 2, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Youn Gon OH, Ji Hun KIM, Sae Yun KO, Gil Ho GU, Dong Su KIM, Eun Hee LEE, Ho Chan LEE, Seong Sil JEONG, Seong Pyo HONG
  • Publication number: 20230059162
    Abstract: Provided are a learning processing system, and an apparatus and method for determining a number of local parameters. A method of determining a number of local parameters may include receiving a number of local parameters less than or equal to a number of local parameters to be aggregated from at least one distributed learning processing apparatus; acquiring a T-th global parameter using the number of local parameters less than or equal to the number of local parameters to be aggregated; and updating or maintaining the number of local parameters to be aggregated depending on whether signs are different between a (T?1)-th global parameter and the T-th global parameter.
    Type: Application
    Filed: August 16, 2022
    Publication date: February 23, 2023
    Applicant: Korea University Research And Business Foundation
    Inventors: Sangheon PACK, Ho-Chan LEE, HeeWon KIM, Haneul KO
  • Patent number: 10435593
    Abstract: At least one example embodiment relates to a thermoresponsive smart adhesive pad. Provided is a thermoresponsive smart adhesive pad that includes a polymer layer including a plurality of concave grooves; a hydrophilic surface layer formed on the polymer layer; and a coating layer including a hydrogel and formed on the hydrophilic surface layer. Also, provided is a method of manufacturing a thermoresponsive smart adhesive pad, including forming a plurality of convex structures on a substrate; forming a plurality of concave grooves in a polymer layer using the substrate on which the plurality of convex structures are formed; forming a hydrophilic surface layer by performing a hydrophilic treatment of a surface of the polymer layer in which the plurality of concave grooves are formed; forming, on the hydrophilic surface layer, a coating layer including a mixed solution containing a hydrogel monomer; and irradiating ultraviolet (UV) rays to the coating layer.
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: October 8, 2019
    Assignee: UNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyun Hyub Ko, Ho Chan Lee
  • Patent number: 10140247
    Abstract: Methods and apparatuses are provided for compressing configuration data. The configuration data, which includes control data corresponding to at least one processing unit used in each of a plurality of cycles, is stored. A plurality of processing units of a reconfigurable processor is divided into a plurality of groups. The configuration data is partitioned into a plurality of pieces of sub-configuration data. Each piece of sub-configuration data corresponding to a respective one of the plurality of groups. If a plurality of adjacent cycles include identical control data, the configuration data is compressed by deleting control data of all but one of the plurality of adjacent cycles, for each sub-configuration data.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: November 27, 2018
    Assignees: Samsung Electronics Co., Ltd, Seoul National University R&DB Foundation
    Inventors: Bernhard Egger, Ho-chan Lee, Yeon-bok Lee, Suk-jin Kim
  • Publication number: 20180194974
    Abstract: At least one example embodiment relates to a thermoresponsive smart adhesive pad. Provided is a thermoresponsive smart adhesive pad that includes a polymer layer including a plurality of concave grooves; a hydrophilic surface layer formed on the polymer layer; and a coating layer including a hydrogel and formed on the hydrophilic surface layer. Also, provided is a method of manufacturing a thermoresponsive smart adhesive pad, including forming a plurality of convex structures on a substrate; forming a plurality of concave grooves in a polymer layer using the substrate on which the plurality of convex structures are formed; forming a hydrophilic surface layer by performing a hydrophilic treatment of a surface of the polymer layer in which the plurality of concave grooves are formed; forming, on the hydrophilic surface layer, a coating layer including a mixed solution containing a hydrogel monomer; and irradiating ultraviolet (UV) rays to the coating layer.
    Type: Application
    Filed: December 2, 2016
    Publication date: July 12, 2018
    Inventors: Hyun Hyub KO, Ho Chan LEE
  • Publication number: 20180067895
    Abstract: Methods and apparatuses are provided for compressing configuration data. The configuration data, which includes control data corresponding to at least one processing unit used in each of a plurality of cycles, is stored. A plurality of processing units of a reconfigurable processor is divided into a plurality of groups. The configuration data is partitioned into a plurality of pieces of sub-configuration data. Each piece of sub-configuration data corresponding to a respective one of the plurality of groups. If a plurality of adjacent cycles include identical control data, the configuration data is compressed by deleting control data of all but one of the plurality of adjacent cycles, for each sub-configuration data.
    Type: Application
    Filed: September 6, 2017
    Publication date: March 8, 2018
    Inventors: Bernhard EGGER, Ho-chan LEE, Yeon-bok LEE, Suk-jin KIM
  • Publication number: 20120107512
    Abstract: The invention relates to a binder for binding RBSC (reaction-bonded silicon carbide), which is used to prepare RBSC assembly, wherein it includes a sintered body obtained by sintering a mixed powder of at least one substance selected from the group having Al, Ti, Fe, Mg, Cu and Ge, and silicon, or a powder obtained by milling the sintered body; and with regard to the mixing ratio of the mixed powder, the maximum amount of silicon is an amount rendering the complete melting temperature of phase in phase diagram of the mixed powder to be at most 1400° C., and the minimum amount of silicon is a larger value of either 50 at % or the minimum amount of silicon in silicon+liquid phase zone of the phase diagram, and a method of binding RBSC using the same.
    Type: Application
    Filed: December 23, 2011
    Publication date: May 3, 2012
    Applicant: SKC Solmics co.,Ltd
    Inventors: Sung-sic HWANG, Soo-hwan An, Seok-ho Jang, Hyung-woo Jun, Ho-chan Lee, Kwang-il Ju
  • Publication number: 20100031605
    Abstract: A composite concrete column comprising: upper and lower concrete column portions extending in the lengthwise direction and having an exposed portion between the upper and lower concrete column portions; an H-beam connected between the upper and lower concrete column portions to be exposed at the exposed portion; and a plurality of reinforcement bars embedded in the upper and lower concrete column portions around the H-beam to extend in the lengthwise direction.
    Type: Application
    Filed: April 25, 2008
    Publication date: February 11, 2010
    Inventors: Won-Kee Hong, Ho-Chan Lee, Jum-Han Kim
  • Patent number: 6824712
    Abstract: A selectively light-absorptive material for a color display, comprising a tetrazaporphyrine derivative having the formula: where R1, R2, R3, R4, R5, R6, R7 and R8 are independently selected from the group consisting of hydrogen; an unsubstituted phenyl group, an alkyl group; an alkoxy group; a nitro group; halogen atoms; a halide; a cyano group; an alkylamino group; an aminoalkyl group; and a phenyl group having a substitutent selected from an alkyl group, an alkoxy group, a nitro group, halogen atoms, a halide, an alkylamino group, an aminoalkyl group and a cyano group, or two neighboring substituents among R1, R2, R3, R4, R5, R6, R7 and R8 are fused and substituted with 1 to 3 aromatic cyclic compounds, and unsubstituted groups among R1, R2, R3, R4, R5, R6, R7 and R8 are independently selected from the group consisting of hydrogen, an alkyl group, an alkoxy group, an allyl group, halogen atoms, a halide, a cyano group and a nitro group.
    Type: Grant
    Filed: January 29, 2002
    Date of Patent: November 30, 2004
    Assignee: SKC Co. Ltd.
    Inventors: Seung-gak Yang, Jin-bum Park, Geun-taek Bae, Ho-chan Lee