Patents by Inventor Ho-Cheng LEE
Ho-Cheng LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11600509Abstract: A micro pick-up array used to pick up a micro device is provided. The micro pick-up array includes a substrate, a pick-up structure, and a soft polymer layer. The pick-up structure is located on the substrate. The pick-up structure includes a cured photo sensitive material. The soft polymer layer covers the pick-up structure. A manufacturing method of a micro pick-up array is also provided.Type: GrantFiled: October 9, 2018Date of Patent: March 7, 2023Assignee: Au Optronics CorporationInventors: Ze-Yu Yen, Yi-Fen Lan, Ho-Cheng Lee, Tsung-Tien Wu
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Patent number: 11545472Abstract: A bi-directional optical module includes a substrate, at least one first light-emitting diode (LED), and at least one second LED. The first LED is disposed on a surface of the substrate. The first LED has a first reflection surface and a first light-outlet surface that are opposite to each other, and the first light-outlet surface is away from the substrate relative to the first reflection surface. The second LED is disposed on the same surface of the substrate. The second LED has a second reflection surface and a second light-outlet surface that are opposite to each other, and the second light-outlet surface is close to the substrate relative to the second reflection surface. The substrate has at least one light-transparent area that is not occupied by the first LED and the second LED.Type: GrantFiled: February 7, 2020Date of Patent: January 3, 2023Assignee: AU OPTRONICS CORPORATIONInventors: Ting-Wei Guo, Chen-Chi Lin, Pin-Miao Liu, Cheng-Chieh Chang, Ho-Cheng Lee, Wen-Wei Yang
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Patent number: 11069638Abstract: An electronic component includes a circuit substrate, a connecting electrode, a micro-element, and a solder. The connecting electrode is located on the circuit substrate. The connecting electrode has a first transparent conductive layer. A surface of the first transparent conductive layer is located opposite the circuit substrate, and has a plurality of micrometers or nanometer particles. The micro-element is electrically connected to the connecting electrode. The solder is located between the connecting electrode and the micro-element, and fixes the micro-element on the connecting electrode.Type: GrantFiled: August 2, 2019Date of Patent: July 20, 2021Assignee: AU OPTRONICS CORPORATIONInventors: Yi-Cheng Liu, Ho-Cheng Lee, Chung-Chan Liu
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Publication number: 20200176425Abstract: A bi-directional optical module includes a substrate, at least one first light-emitting diode (LED), and at least one second LED. The first LED is disposed on a surface of the substrate. The first LED has a first reflection surface and a first light-outlet surface that are opposite to each other, and the first light-outlet surface is away from the substrate relative to the first reflection surface. The second LED is disposed on the same surface of the substrate. The second LED has a second reflection surface and a second light-outlet surface that are opposite to each other, and the second light-outlet surface is close to the substrate relative to the second reflection surface. The substrate has at least one light-transparent area that is not occupied by the first LED and the second LED.Type: ApplicationFiled: February 7, 2020Publication date: June 4, 2020Inventors: Ting-Wei GUO, Chen-Chi LIN, Pin-Miao LIU, Cheng-Chieh CHANG, Ho-Cheng LEE, Wen-Wei YANG
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Patent number: 10600941Abstract: The present invention provides an electronic device and a method for fabricating the same. The electronic device includes a driving-circuit substrate, light-emitting elements, an optical layer, and an adhesive layer. The light-emitting elements are disposed on the driving-circuit substrate, and the optical layer is disposed on the light-emitting elements. The adhesive layer is disposed between the optical layer and the light-emitting elements. The optical layer includes a first surface and a second surface that are opposite to each other. The first surface of the optical layer has a plurality of first convex lens structures, and at least a part of the first convex lens structures are at least partially overlapped with the light-emitting elements in the vertical projection direction.Type: GrantFiled: February 21, 2019Date of Patent: March 24, 2020Assignee: AU OPTRONICS CORPORATIONInventors: Yi-Cheng Liu, Ho-Cheng Lee, Wen-Wei Yang
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Publication number: 20190355685Abstract: An electronic component includes a circuit substrate, a connecting electrode, a micro-element, and a solder. The connecting electrode is located on the circuit substrate. The connecting electrode has a first transparent conductive layer. A surface of the first transparent conductive layer is located opposite the circuit substrate, and has a plurality of micrometers or nanometer particles. The micro-element is electrically connected to the connecting electrode. The solder is located between the connecting electrode and the micro-element, and fixes the micro-element on the connecting electrode.Type: ApplicationFiled: August 2, 2019Publication date: November 21, 2019Inventors: Yi-Cheng LIU, Ho-Cheng LEE, Chung-Chan LIU
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Patent number: 10438911Abstract: An electronic component includes a circuit substrate, a connecting electrode, a micro-element, and a solder. The connecting electrode is located on the circuit substrate. The connecting electrode has a first transparent conductive layer. A surface of the first transparent conductive layer is located opposite the circuit substrate, and has a plurality of micrometer or nanometer particles. The micro-element is electrically connected to the connecting electrode. The solder is located between the connecting electrode and the micro-element, and fixes the micro-element on the connecting electrode.Type: GrantFiled: January 8, 2018Date of Patent: October 8, 2019Assignee: AU OPTRONICS CORPORATIONInventors: Yi-Cheng Liu, Ho-Cheng Lee, Chung-Chan Liu
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Publication number: 20190189872Abstract: The present invention provides an electronic device and a method for fabricating the same. The electronic device includes a driving-circuit substrate, light-emitting elements, an optical layer, and an adhesive layer. The light-emitting elements are disposed on the driving-circuit substrate, and the optical layer is disposed on the light-emitting elements. The adhesive layer is disposed between the optical layer and the light-emitting elements. The optical layer includes a first surface and a second surface that are opposite to each other. The first surface of the optical layer has a plurality of first convex lens structures, and at least a part of the first convex lens structures are at least partially overlapped with the light-emitting elements in the vertical projection direction.Type: ApplicationFiled: February 21, 2019Publication date: June 20, 2019Inventors: Yi-Cheng LIU, Ho-Cheng LEE, Wen-Wei YANG
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Publication number: 20190115242Abstract: A micro pick-up array used to pick up a micro device is provided. The micro pick-up array includes a substrate, a pick-up structure, and a soft polymer layer. The pick-up structure is located on the substrate. The pick-up structure includes a cured photo sensitive material. The soft polymer layer covers the pick-up structure. A manufacturing method of a micro pick-up array is also provided.Type: ApplicationFiled: October 9, 2018Publication date: April 18, 2019Applicant: Au Optronics CorporationInventors: Ze-Yu Yen, Yi-Fen Lan, Ho-Cheng Lee, Tsung-Tien Wu
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Patent number: 10256381Abstract: The present invention provides an electronic device and a method for fabricating the same. The electronic device includes a driving-circuit substrate, light-emitting elements, an optical layer, and an adhesive layer. The light-emitting elements are disposed on the driving-circuit substrate, and the optical layer is disposed on the light-emitting elements. The adhesive layer is disposed between the optical layer and the light-emitting elements. The optical layer includes a first surface and a second surface that are opposite to each other. The first surface of the optical layer has a plurality of first convex lens structures, and at least a part of the first convex lens structures are at least partially overlapped with the light-emitting elements in the vertical projection direction.Type: GrantFiled: September 8, 2017Date of Patent: April 9, 2019Assignee: AU OPTRONICS CORPORATIONInventors: Yi-Cheng Liu, Ho-Cheng Lee, Wen-Wei Yang
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Publication number: 20190043842Abstract: A bi-directional optical module includes a substrate, at least one first light-emitting diode (LED), and at least one second LED. The first LED is disposed on a surface of the substrate. The first LED has a first reflection surface and a first light-outlet surface that are opposite to each other, and the first light-outlet surface is away from the substrate relative to the first reflection surface. The second LED is disposed on the same surface of the substrate. The second LED has a second reflection surface and a second light-outlet surface that are opposite to each other, and the second light-outlet surface is close to the substrate relative to the second reflection surface. The substrate has at least one light-transparent area that is not occupied by the first LED and the second LED.Type: ApplicationFiled: May 16, 2018Publication date: February 7, 2019Inventors: Ting-Wei GUO, Chen-Chi LIN, Pin-Miao LIU, Cheng-Chieh CHANG, Ho-Cheng LEE, Wen-Wei YANG
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Publication number: 20180323181Abstract: A fabricating method of a light-emitting apparatus including the following steps is provided. An adhesive layer having first adhesive bump groups including first adhesive bumps is provided. A transfer stamp picks up first light-emitting device groups including first light-emitting devices. The transfer stamp approaches the adhesive layer such that the first light-emitting devices of one first light-emitting device group are in contact with the first adhesive bumps of one corresponding first adhesive bump group. When the first light-emitting devices are in contact with the first adhesive bumps, the remaining first light-emitting devices on the transfer stamp are staggered with the first adhesive bumps and are not in contact with the adhesive layer. The transfer stamp is kept away from the adhesive layer such that the first light-emitting devices stay on the first adhesive bumps of the corresponding first adhesive bump group.Type: ApplicationFiled: July 13, 2018Publication date: November 8, 2018Applicant: Au Optronics CorporationInventors: Tsung-Tien Wu, Ho-Cheng Lee
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Publication number: 20180240767Abstract: An electronic component includes a circuit substrate, a connecting electrode, a micro-element, and a solder. The connecting electrode is located on the circuit substrate. The connecting electrode has a first transparent conductive layer. A surface of the first transparent conductive layer is located opposite the circuit substrate, and has a plurality of micrometer or nanometer particles. The micro-element is electrically connected to the connecting electrode. The solder is located between the connecting electrode and the micro-element, and fixes the micro-element on the connecting electrode.Type: ApplicationFiled: January 8, 2018Publication date: August 23, 2018Inventors: Yi-Cheng LIU, Ho-Cheng LEE, Chung-Chan LIU
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Publication number: 20180114886Abstract: The present invention provides an electronic device and a method for fabricating the same. The electronic device includes a driving-circuit substrate, light-emitting elements, an optical layer, and an adhesive layer. The light-emitting elements are disposed on the driving-circuit substrate, and the optical layer is disposed on the light-emitting elements. The adhesive layer is disposed between the optical layer and the light-emitting elements. The optical layer includes a first surface and a second surface that are opposite to each other. The first surface of the optical layer has a plurality of first convex lens structures, and at least a part of the first convex lens structures are at least partially overlapped with the light-emitting elements in the vertical projection direction.Type: ApplicationFiled: September 8, 2017Publication date: April 26, 2018Inventors: Yi-Cheng LIU, Ho-Cheng Lee, Wen-Wei Yang
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Publication number: 20170294416Abstract: A fabricating method of a light-emitting apparatus including the following steps is provided. An adhesive layer having first adhesive bump groups including first adhesive bumps is provided. A transfer stamp picks up first light-emitting device groups including first light-emitting devices. The transfer stamp approaches the adhesive layer such that the first light-emitting devices of one first light-emitting device group are in contact with the first adhesive bumps of one corresponding first adhesive bump group. When the first light-emitting devices are in contact with the first adhesive bumps, the remaining first light-emitting devices on the transfer stamp are staggered with the first adhesive bumps and are not in contact with the adhesive layer. The transfer stamp is kept away from the adhesive layer such that the first light-emitting devices stay on the first adhesive bumps of the corresponding first adhesive bump group.Type: ApplicationFiled: July 19, 2016Publication date: October 12, 2017Inventors: Tsung-Tien Wu, Ho-Cheng Lee
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Patent number: 9721823Abstract: A method of transferring micro-devices is provided. A carrying unit including a carrying substrate, a plurality of electrodes, a dielectric layer covering the electrodes, and a plurality of micro-devices disposed on the electrodes, including a first micro-device and a second micro-device, are also provided. A voltage is applied to an electrode corresponding to the first micro-device, so that an electrostatic force generated on the first micro-device by the carrying unit is larger than a force generated on the second micro-device by the carrying unit. A transfer stamp contacts the first micro-device and the second micro-device, and moves when the transfer stamp contacts the first micro-device and the second micro-device and the electrostatic force is greater than the force generated by the carrying unit, so that the second micro-device is picked up by the transfer stamp and transferred to a receiving unit, and the first micro-device remains on the carrying unit.Type: GrantFiled: August 26, 2016Date of Patent: August 1, 2017Assignee: AU OPTRONICS CORPORATIONInventors: Tsung-Tien Wu, Ho-Cheng Lee, Kang-Hung Liu, Chih-Che Kuo
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Publication number: 20170133257Abstract: A method of transferring micro-devices is provided. A carrying unit including a carrying substrate, a plurality of electrodes, a dielectric layer covering the electrodes, and a plurality of micro-devices disposed on the electrodes, including a first micro-device and a second micro-device, are also provided. A voltage is applied to an electrode corresponding to the first micro-device, so that an electrostatic force generated on the first micro-device by the carrying unit is larger than a force generated on the second micro-device by the carrying unit. A transfer stamp contacts the first micro-device and the second micro-device, and moves when the transfer stamp contacts the first micro-device and the second micro-device and the electrostatic force is greater than the force generated by the carrying unit, so that the second micro-device is picked up by the transfer stamp and transferred to a receiving unit, and the first micro-device remains on the carrying unit.Type: ApplicationFiled: August 26, 2016Publication date: May 11, 2017Inventors: Tsung-Tien WU, Ho-Cheng LEE, Kang-Hung LIU, Chih-Che KUO