Patents by Inventor Ho Cheol Kwak

Ho Cheol Kwak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor integrated circuit chip, multilayer chip capacitor and semiconductor integrated circuit chip package
    Patent number: 8304854
    Abstract: Disclosed are a semiconductor integrated circuit chip, a multilayer chip capacitor, and a semiconductor integrated circuit chip package. The semiconductor integrated circuit chip includes a semiconductor integrated circuit chip body, an input/output terminal disposed on the outside of the semiconductor integrated circuit chip body, and a decoupling capacitor disposed at a side face of the semiconductor integrated circuit chip body and electrically connected to the input/output terminal. The semiconductor integrated circuit chip cab be obtained, which can maintain an impedance of a power distribution network below a target impedance in a wide frequency range, particularly at a high frequency, by minimizing an inductance between a decoupling capacitor and a semiconductor integrated circuit chip.
    Type: Grant
    Filed: November 13, 2008
    Date of Patent: November 6, 2012
    Assignees: Samsung Electro-Mechanics Co., Ltd., Clemson University
    Inventors: Byoung Hwa Lee, Min Cheol Park, Ho Cheol Kwak, Haixin Ke, Todd Harvey Hubing
  • SEMICONDUCTOR INTEGRATED CIRCUIT CHIP, MULTILAYER CHIP CAPACITOR AND SEMICONDUCTOR INTEGRATED CIRCUIT CHIP PACKAGE
    Publication number: 20100117192
    Abstract: Disclosed are a semiconductor integrated circuit chip, a multilayer chip capacitor, and a semiconductor integrated circuit chip package. The semiconductor integrated circuit chip includes a semiconductor integrated circuit chip body, an input/output terminal disposed on the outside of the semiconductor integrated circuit chip body, and a decoupling capacitor disposed at a side face of the semiconductor integrated circuit chip body and electrically connected to the input/output terminal. The semiconductor integrated circuit chip cab be obtained, which can maintain an impedance of a power distribution network below a target impedance in a wide frequency range, particularly at a high frequency, by minimizing an inductance between a decoupling capacitor and a semiconductor integrated circuit chip.
    Type: Application
    Filed: November 13, 2008
    Publication date: May 13, 2010
    Inventors: Byoung Hwa Lee, Min Cheol Park, Ho Cheol Kwak, Haixin Ke, Todd Harvey Hubing