Abstract: An emitting device of wide-angle LED which comprises at least one wide-angle LED that emits at an angle between 140° and 160°, extending the distance between each wide-angle LED in the emitting device and reducing the number needed for construction. Also, the device has the lights emitted in uniformity and has no dark area. The luminance is improved as well. Besides, the wide-angle LED was applied twice packaging procedures to avoid the sealant body separating from the concavity due to damp environment. The emitting device of wide-angle LED therefore has improved quality and lower prime costs.

Abstract: Modular PCB and method of replacing one of a plurality of modules of a first PCB are provided. One embodiment of the method includes checking each module of the first PCB and each of a plurality of modules of a second PCB, cutting a malfunctioned module from the first PCB to leave a rectangular vacant area if the malfunctioned module is found, forming a plurality of indents on each side of the vacant area, cutting a good module from the second PCB if the good module is found, forming a plurality of projections on each side of the good module, placing the good module in the vacant area for coupling the indents and the projections, and applying adhesive (e.g., resin) into the coupled indents and projections for fastening the good module in the vacant area.

Abstract: Modular PCB and method of replacing one of a plurality of modules of a first PCB are provided. One embodiment of the method includes checking each module of the first PCB and each of a plurality of modules of a second PCB, cutting a malfunctioned module from the first PCB to leave a rectangular vacant area if the malfunctioned module is found, forming a plurality of indents on each side of the vacant area, cutting a good module from the second PCB if the good module is found, forming a plurality of projections on each side of the good module, placing the good module in the vacant area for coupling the indents and the projections, and applying adhesive (e.g., resin) into the coupled indents and projections for fastening the good module in the vacant area.

Abstract: A pre-casting multi-layer PCB process has steel plate mold engraved with circuitry and the epoxy coated on the mold for the epoxy to cover up a fiber glass substrate; conductive material coated on the epoxy to insert molding the former into the latter to form recessed circuitry; then baked and solidified, sandblasted to remove film for the conductive material to become conducted circuitry; the lamination made by layer for achieving even thinner PBC circuitry while maintaining sufficient structural strength.

Abstract: A PCB solder masking process allowing easier process, reduced production cost and improved PCB quality involves dispensing low hardness resin on contacts to be exposed on the PCB, resin being solidified, non-solidified area covered with mask, UV exposed, non-solidified area removed, PCB sprayed insulation varnish, solidified, varnish and resin on surface of contact removed, either sanded or sandblasted, and finally cleaned and rinsed.

Abstract: A pre-casting multi-layer PCB process has steel plate mold engraved with circuitry and the epoxy coated on the mold for the epoxy to cover up a fiber glass substrate; conductive material coated on the epoxy to insert molding the former into the latter to form recessed circuitry; then baked and solidified, sandblasted to remove film for the conductive material to become conducted circuitry; the lamination made by layer for achieving even thinner PBC circuitry while maintaining sufficient structural strength.

Abstract: A dispensable capacitor manufacturing process allowing easier process, capacity correction facilitating, and reduced production cost essentially involves dispensing conductive epoxy between two soldering points on a PCB, use of laser to cut on the surface of solidified epoxy spaced grooves in different forms, heated dielectric material then permeated, insulation layer coated on surface after solidification, test and correction to constitute capacitor.