Patents by Inventor HO GIL JUNG

HO GIL JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10325922
    Abstract: A semiconductor device includes a substrate, a stacked structure of insulating layers and gate electrodes alternately and repeatedly stacked on the substrate, and a pillar passing through the stacked-layer structure. The insulating layers include lower insulating layers, intermediate insulating layers disposed on the lower insulating layers, and upper insulating layers disposed on the intermediate insulating layers. The lower insulating layers have a hardness less than that of the intermediate insulating layers, and the upper insulating layers have a hardness greater than that of the intermediate insulating layers.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: June 18, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yeong Dae Lim, Seung Jae Jung, Jin Young Bang, Il Woo Kim, Ho Gil Jung
  • Publication number: 20180350830
    Abstract: A semiconductor device includes a substrate, a stacked structure of insulating layers and gate electrodes alternately and repeatedly stacked on the substrate, and a pillar passing through the stacked-layer structure. The insulating layers include lower insulating layers, intermediate insulating layers disposed on the lower insulating layers, and upper insulating layers disposed on the intermediate insulating layers. The lower insulating layers have a hardness less than that of the intermediate insulating layers, and the upper insulating layers have a hardness greater than that of the intermediate insulating layers.
    Type: Application
    Filed: November 17, 2017
    Publication date: December 6, 2018
    Inventors: YEONG DAE LIM, SEUNG JAE JUNG, JIN YOUNG BANG, IL WOO KIM, HO GIL JUNG