Patents by Inventor Ho-Hsiang Wang

Ho-Hsiang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11740504
    Abstract: A curved panel includes a first curved substrate, a second curved substrate, a curved coverlens, and an adhesive structure. The first curved substrate and the second curved substrate are overlapped with each other. First to fourth sidewalls of the first curved substrate correspond to fifth to eighth sidewalls of the second curved substrate, respectively. The first to third sidewalls of the first curved substrate extend beyond the fifth to seventh sidewalls of the second curved substrate, respectively. The second curved substrate is located between the curved coverlens and the first curved substrate. The second curved substrate is bonded to the curved coverlens through an adhesive layer. The adhesive structure is located between the first curved substrate and the curved coverlens and is laterally located between the first sidewall and the fifth sidewall, between the second sidewall and the sixth sidewall, and between the third sidewall and the seventh sidewall.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: August 29, 2023
    Assignee: AUO Corporation
    Inventors: Chun-Yu Lee, Sheng-Yuan Chiu, Yen-Chang Chen, Po-Shu Huang, Ho-Hsiang Wang
  • Publication number: 20090236772
    Abstract: A pattern transfer mold is suitable for transferring at least one decorative pattern of a film to at least one workpiece. The pattern transfer mold includes a mold base and a mold core. The mold base has a mold cavity and an air vent associated with the mold cavity. The mold core is inserted in the mold cavity of the mold base and has an upper surface and a plurality of upper air grooves on the upper surface. The mold cavity and the mold core have a plurality of mold air channels located between the mold cavity and the mold core. The upper air grooves are associated with the air vent via the mold air channels.
    Type: Application
    Filed: December 1, 2008
    Publication date: September 24, 2009
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chien-Min Chang, Jung-Chin Wu, Wan-Li Chuang, Ho-Hsiang Wang
  • Publication number: 20090194908
    Abstract: A mold for injection molding and an injection molding device/method with surface quality improvement ability are disclosed, in which the injection molding device comprises: a mold including a first mold piece and a second mold piece; and a film feeder. In an exemplary embodiment, the second mold piece is configured with a suction unit in a manner that the film feeder is enabled to provide a film to the suction unit.
    Type: Application
    Filed: June 2, 2008
    Publication date: August 6, 2009
    Applicant: CHUNG YUAN CHRISTIAN UNIVERSITY
    Inventors: SHIA-CHUNG CHEN, Jen-An Chang, Ho-Hsiang Wang, Ping-Shun Hsu