Patents by Inventor Ho-Hsing Chiang

Ho-Hsing Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8760864
    Abstract: A heat-dissipation structure for a portable folding electronic apparatus includes a hinge support and a heat-conducting device. The portable folding electronic apparatus includes a first casing, a second casing, a hinge, a panel module, and the heat-dissipation structure. The first casing and the second casing are pivotally connected by the hinge. The panel module includes a frame and a light source disposed at a corner of the frame. The hinge support is connected to the hinge and the frame. The heat-conducting device is fixed on the hinge support near the light source. Therefore, heat produced by the light source can be dissipated through the heat-conducting device for improving the optical effect of the panel module; deformation of the heat-conducting device can be reduced by use of the stiffness of the hinge support.
    Type: Grant
    Filed: April 29, 2012
    Date of Patent: June 24, 2014
    Assignee: AU Optronics Corp.
    Inventor: Ho-Hsing Chiang
  • Publication number: 20130021806
    Abstract: A heat-dissipation structure and a portable folding electronic apparatus therewith are disclosed. The heat-dissipation structure includes a hinge support and a heat-conducting device. The portable folding electronic apparatus includes a first casing, a second casing, a hinge, a panel module, and the heat-dissipation structure. The first casing and the second casing are pivotally connected by the hinge. The panel module includes a frame and a light source disposed at a corner of the frame. The hinge support is connected to the hinge and the frame. The heat-conducting device is fixed on the hinge support near the light source. Therefore, heat produced by the light source can be dissipated through the heat-conducting device for improving the optical effect of the panel module; deformation of the heat-conducting device can be reduced by use of the stiffness of the hinge support.
    Type: Application
    Filed: April 29, 2012
    Publication date: January 24, 2013
    Inventor: Ho-Hsing Chiang