Patents by Inventor Ho Hyung Ham
Ho Hyung Ham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11737211Abstract: A connection structure embedded substrate includes: a printed circuit board including a plurality of first insulating layers and a plurality of first wiring layers, respectively disposed on or between the plurality of first insulating layers; and a connection structure disposed in the printed circuit board and including a plurality of internal insulating layers and a plurality of internal wiring layers, respectively disposed on or between the plurality of internal insulating layers. Among the plurality of internal wiring layers, an internal wiring layer disposed in one surface of the connection structure is in contact with one surface of a first insulating layer, among the plurality of first insulating layers.Type: GrantFiled: July 9, 2021Date of Patent: August 22, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae Hong Min, Ho Hyung Ham, Yong Soon Jang, Ki Suk Kim, Hyung Ki Lee, Chi Won Hwang
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Publication number: 20230262891Abstract: A connection structure embedded substrate includes: a printed circuit board including a plurality of first insulating layers and a plurality of first wiring layers, respectively disposed on or between the plurality of first insulating layers; and a connection structure disposed in the printed circuit board and including a plurality of internal insulating layers and a plurality of internal wiring layers, respectively disposed on or between the plurality of internal insulating layers. Among the plurality of internal wiring layers, an internal wiring layer disposed in one surface of the connection structure is in contact with one surface of a first insulating layer, among the plurality of first insulating layers.Type: ApplicationFiled: April 25, 2023Publication date: August 17, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Hong Min, Ho Hyung Ham, Yong Soon Jang, Ki Suk Kim, Hyung Ki Lee, Chi Won Hwang
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Patent number: 11659665Abstract: A connection structure-embedded substrate includes: a printed circuit board including a plurality of first insulating layers of which at least one has a cavity provided therein, a plurality of first wiring layers disposed as at least one of an outer portion and an inner portion of the plurality of first insulating layers, and a first build-up insulating layer disposed on an upper surface of the plurality of first insulating layers; and a connection structure at least partially disposed in the cavity. The first build-up insulating layer is disposed in the cavity, and each of a lower surface of the connection structure and a lower surface of the cavity is in contact with at least a portion of the first build-up insulating layer, respectively.Type: GrantFiled: March 30, 2021Date of Patent: May 23, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ho Hyung Ham, Won Seok Lee, Jae Sung Sim
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Publication number: 20220322527Abstract: A connection structure embedded substrate includes: a printed circuit board including a plurality of first insulating layers and a plurality of first wiring layers, respectively disposed on or between the plurality of first insulating layers; and a connection structure disposed in the printed circuit board and including a plurality of internal insulating layers and a plurality of internal wiring layers, respectively disposed on or between the plurality of internal insulating layers. Among the plurality of internal wiring layers, an internal wiring layer disposed in one surface of the connection structure is in contact with one surface of a first insulating layer, among the plurality of first insulating layers.Type: ApplicationFiled: July 9, 2021Publication date: October 6, 2022Inventors: Tae Hong Min, Ho Hyung Ham, Yong Soon Jang, Ki Suk Kim, Hyung Ki Lee, Chi Won Hwang
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Publication number: 20220301975Abstract: An electronic component-embedded substrate includes a core layer, a first cavity formed in the core layer, a heat dissipating member disposed in the first cavity and having a second cavity, and an electronic component disposed in the second cavity. The heat dissipating member includes a carbon fiber reinforced polymer (CFRP).Type: ApplicationFiled: June 4, 2021Publication date: September 22, 2022Inventors: Ho Hyung HAM, Gun Hwi HYUNG, Jun Hyeong JANG, Tae Hong MIN
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Patent number: 11430737Abstract: Provided is a printed circuit board including a laminate that is formed by vertically stacking a plurality of insulating layers including a rigid insulating layer, a flexible insulating layer having a first region in vertical contact with at least one of the plurality of insulating layers and a second region located on an outer side of the laminate, and a first electronic element embedded in the flexible insulating layer.Type: GrantFiled: August 12, 2019Date of Patent: August 30, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho-Hyung Ham, Sa-Yong Lee, Ju-Ho Kim
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Publication number: 20220210921Abstract: A connection structure-embedded substrate includes: a printed circuit board including a plurality of first insulating layers of which at least one has a cavity provided therein, a plurality of first wiring layers disposed as at least one of an outer portion and an inner portion of the plurality of first insulating layers, and a first build-up insulating layer disposed on an upper surface of the plurality of first insulating layers; and a connection structure at least partially disposed in the cavity. The first build-up insulating layer is disposed in the cavity, and each of a lower surface of the connection structure and a lower surface of the cavity is in contact with at least a portion of the first build-up insulating layer, respectively.Type: ApplicationFiled: March 30, 2021Publication date: June 30, 2022Inventors: Ho Hyung HAM, Won Seok LEE, Jae Sung SIM
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Patent number: 11076488Abstract: A board having an electronic component embedded therein, includes a core layer having a groove with a bottom surface, an electronic component disposed above the bottom surface of the groove and spaced apart from the bottom surface of the groove, and an insulating layer disposed on the core layer and covering at least a portion of the electronic component. The insulating layer is disposed in at least a portion of a space between the bottom surface of the groove and the electronic component.Type: GrantFiled: November 12, 2019Date of Patent: July 27, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ho Hyung Ham, Jae Sung Sim
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Publication number: 20210068259Abstract: A board having an electronic component embedded therein, includes a core layer having a groove with a bottom surface, an electronic component disposed above the bottom surface of the groove and spaced apart from the bottom surface of the groove, and an insulating layer disposed on the core layer and covering at least a portion of the electronic component. The insulating layer is disposed in at least a portion of a space between the bottom surface of the groove and the electronic component.Type: ApplicationFiled: November 12, 2019Publication date: March 4, 2021Inventors: Ho Hyung Ham, Jae Sung Sim
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Patent number: 10939556Abstract: An electronic component embedded substrate includes first insulating layer having a first through portion; a first electronic component disposed in the first through portion; a second insulating layer disposed on the first insulating layer and having a second through portion; a second electronic component disposed in the second through portion; and an insulating material covering at least a portion of each of the first electronic component and the second electronic component. The first through portion and the second through portion intersect, such that a portion of the first through portion and a portion of the second through portion overlap each other, on a plane.Type: GrantFiled: February 27, 2020Date of Patent: March 2, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Sung Sim, Ho Hyung Ham, Won Seok Lee
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Patent number: 10932368Abstract: A substrate-embedded electronic component includes a first core layer, a first through-portion penetrating the first core layer, a first electronic component disposed in the first through-portion, an encapsulant disposed in at least a portion of the first through-portion, and covering at least a portion of the first electronic component, a second core layer disposed on the encapsulant, and a first through-via penetrating the second core layer, wherein the first through-via is connected to the first electronic component.Type: GrantFiled: February 26, 2020Date of Patent: February 23, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ha Yong Jung, Ho Hyung Ham, Jae Sung Sim, Won Seok Lee
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Publication number: 20200176386Abstract: Provided is a printed circuit board including a laminate that is formed by vertically stacking a plurality of insulating layers including a rigid insulating layer, a flexible insulating layer having a first region in vertical contact with at least one of the plurality of insulating layers and a second region located on an outer side of the laminate, and a first electronic element embedded in the flexible insulating layer.Type: ApplicationFiled: August 12, 2019Publication date: June 4, 2020Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ho-Hyung HAM, Sa-Yong LEE, Ju-Ho KIM
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Patent number: 9907182Abstract: A method of manufacturing an insulation film includes: coating a resin composite on a lower protective film, the resin composite including an inorganic filler dispersed therein; forming an insulating layer by drying the resin composite such that the inorganic filler is precipitated in the coated resin composite; and laminating an upper protective film on the insulating layer.Type: GrantFiled: March 9, 2016Date of Patent: February 27, 2018Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho-Hyung Ham, Hwa-Young Lee, Jae-Kul Lee, Ok-Seon Yoon
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Publication number: 20170086303Abstract: A method of manufacturing an insulation film includes: coating a resin composite on a lower protective film, the resin composite including an inorganic filler dispersed therein; forming an insulating layer by drying the resin composite such that the inorganic filler is precipitated in the coated resin composite; and laminating an upper protective film on the insulating layer.Type: ApplicationFiled: March 9, 2016Publication date: March 23, 2017Applicant: Samsung Electro-Mechanic Co., Ltd.Inventors: Ho-Hyung HAM, Hwa-Young LEE, Jae-Kul LEE, Ok-Seon YOON
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Publication number: 20150014028Abstract: Disclosed herein are an insulating film for a printed circuit board, a resin coated copper (RCC), a flexible copper clad laminate (FCCL), and a printed circuit board manufactured by using the same. More specifically, the RCC, the FCCL, and the printed circuit board manufactured by using the insulating film for the printed circuit board according to the preferred embodiment of the present invention, the insulating film including an insulating layer, and a primer layer formed on one surface of the insulating layer and including a benzocyclobutene (BCB)-based resin, may have a low coefficient of thermal expansion and high peel strength.Type: ApplicationFiled: December 2, 2013Publication date: January 15, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hwa Young Lee, Ho Hyung Ham, Jun Ho Bae, Ki Seok Kim, Eui Jung Jung, Ji Hye Shim