Patents by Inventor Ho Il Jeong

Ho Il Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Suspension for a sound transducer
    Patent number: 9277305
    Abstract: An object of the present invention is to provide a suspension for a sound transducer which has a central portion serving as a center diaphragm and which has a cover layer and a copper pattern partially removed to prevent a decrease in sound pressure from being caused by an increase in weight of a vibration system. According to the present invention, there is provided a suspension for a sound transducer which includes a central portion, a peripheral portion, and a support portion for connecting the central portion to the peripheral portion, the suspension comprising: a base film, a conductive film attached on the base film by means of an adhesive, and a cover layer attached on the conductive film by an adhesive, wherein at least part of the cover layer disposed on the central portion is removed.
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: March 1, 2016
    Assignee: EM-TECH. Co., Ltd.
    Inventors: Joong Hak Kwon, Ho Il Jeong, Kyu Dong Choi, In Ho Jeong
  • SUSPENSION FOR A SOUND TRANSDUCER
    Publication number: 20140029784
    Abstract: An object of the present invention is to provide a suspension for a sound transducer which has a central portion serving as a center diaphragm and which has a cover layer and a copper pattern partially removed to prevent a decrease in sound pressure from being caused by an increase in weight of a vibration system. According to the present invention, there is provided a suspension for a sound transducer which includes a central portion, a peripheral portion, and a support portion for connecting the central portion to the peripheral portion, the suspension comprising: a base film, a conductive film attached on the base film by means of an adhesive, and a cover layer attached on the conductive film by an adhesive, wherein at least part of the cover layer disposed on the central portion is removed.
    Type: Application
    Filed: July 29, 2013
    Publication date: January 30, 2014
    Applicant: EM-TECH. CO., LTD.
    Inventors: Joong Hak Kwon, Ho Il Jeong, Kyu Dong Choi, In Ho Jeong