Abstract: A printed circuit board includes a first insulating layer with a through-hole and a capacitor disposed along a side surface of the through-hole. The capacitor has first and second electrode layers arranged with a dielectric layer between them. A first interconnection layer is positioned on an upper side of the through-hole and includes first and second metal layers respectively contacting the first and second electrode layers. Portions of the first and second metal layers are removed to form cut-out regions that facilitate electrical routing while maintaining the layered capacitor structure within the through-hole.

Abstract: A printed circuit board includes a plurality of insulating layers, a dielectric via disposed in at least one of the plurality of insulating layers, a first electrode layer and a second electrode layer disposed to oppose each other with the dielectric via interposed therebetween, a first through-via passing through at least one of the plurality of insulating layers, the first through-via connected to the first electrode layer, and a second through-via passing through at least one of the plurality of insulating layers, the second through-via connected to the second electrode layer.

Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes: a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body; wherein the dielectric layer may include a plurality of dielectric particles and a polyvinylidene fluoride (PVDF)-based polymer. The dielectric layer may include the PVDF-based polymer in an amount of more than 0 and less than 42.86 parts by weight based on 100 parts by weight of the dielectric particles.

Abstract: A multilayer electronic component includes a body having first and second surfaces opposing each other in a thickness direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a length direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a width direction. The body includes a dielectric layer and multiple internal electrodes alternately arranged with the dielectric layer in the width direction. Each internal electrode includes a main portion and a lead-out portion extending from the main portion and exposed at the first surface. A slot is formed on the first surface and extends in the width direction, and a connection electrode is disposed within the slot and electrically connected to the lead-out portions to reduce overall thickness and improve connection stability when mounted on a circuit board.

Abstract: An electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body, connected to the internal electrode, and including a low-reflection layer. Brightness of a surface of the low-reflection layer is lower than brightness of a surface of the body.

Abstract: A multilayer electronic component includes a body including a first external electrode including a first base plating layer disposed on a third surface of the body and connected to the first internal electrode and a first electrode layer disposed on the first base plating layer, and a second external electrode including a second base plating layer disposed on a fourth surface of the body and connected to the second internal electrode and a second electrode layer disposed on the second base plating layer, wherein the first and second electrode layers include conductive metal and glass, and a 30 ?m×5 ?m region selected from a cross-section of the first base plating layer in the first and second directions includes three or more Ni grains having a grain size of 4 ?m or greater.

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately arranged in a first direction with the dielectric layer interposed therebetween, an extension portion disposed on the body, and an external electrode arranged on the extension portion, wherein the extension portion includes a plurality of lead electrodes spaced apart in a second direction, perpendicular to the first direction, a plurality of via electrodes connecting the plurality of lead electrodes, and an insulating portion covering the plurality of lead electrodes.

Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer and including first to fourth portions, first and second external electrodes disposed on the first and second portions, respectively and connected to the first internal electrodes, third and fourth external electrodes disposed on the third and fourth portions, respectively and connected to the second internal electrodes, and a connection electrode disposed in at least one of the first to fourth portions, penetrating the dielectric layer, connecting two first internal electrodes or two internal electrodes adjacent to each other in the first direction. The connection electrode has a plurality of via electrodes laminated in the first direction, and via electrodes adjacent to each other in the first direction among the plurality of via electrodes, are shifted from each other in a direction perpendicular to the first direction.

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes disposed alternately with the dielectric layer, solder layers disposed on ends of the internal electrodes and each including a Zn-based solder, and external electrodes disposed on the solder layer, wherein the solder layer includes a first alloy layer disposed on an interfacial surface with the internal electrode and including Zn—Ni alloy, and a second alloy layer disposed on an interfacial surface with the external electrode and including Zn—Cu alloy.

Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction; a first external electrode disposed on at least one surface among the first, second, fifth and sixth surfaces; a second external electrode disposed on at least one surface among the first, second, third and fourth surfaces; and a first connection electrode penetrating the dielectric layer and connecting two first internal electrodes adjacent to each other in the first direction. In the first connection electrode, a plurality of first via electrodes shifted from each other in a direction perpendicular to the first direction are laminated in the first direction.

Abstract: A multilayer electronic component includes: a body including a stacked portion including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, first and second connection electrodes connected to opposing respective ends of the first and second internal electrodes in two orthogonal directions, and margin portions respectively disposed on the first and second connection electrodes; and first and second external electrodes respectively disposed on the body and connected to the first and second connection electrodes. The first connection electrode includes a first main portion in contact with at least a portion of the first internal electrode and a first lead-out portion extending from the first main portion, and the second connection electrode includes a second main portion in contact with at least a portion of the second internal electrode and a second lead-out portion extending from the second main portion.

Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes disposed alternately in a first direction with the dielectric layer therebetween; first and second external electrodes disposed on the body and connected to the first and second internal electrodes, respectively; a first via electrode penetrating the dielectric layer and connecting two first internal electrodes adjacent to each other in the first direction; and a second via electrode penetrating the dielectric layer and connecting two second internal electrodes adjacent to each other in the first direction, wherein the two first via electrodes adjacent to each other in the first direction are shifted from each other, and the two second via electrodes adjacent to each other in the first direction are shifted from each other.

Abstract: A multilayer electronic component includes: a body including a plurality of dielectric layers and internal electrodes disposed to face each other with each of the plurality of dielectric layers interposed therebetween; and external electrodes connected to the internal electrodes and disposed on outer surfaces of the body, wherein each of the plurality of dielectric layers includes a BaTiO3-based base material main component and an accessory component including dysprosium (Dy) and terbium (Tb), a content of terbium (Tb) is 0.2 mol or more and less than 1.0 mol based on 100 mol of the base material main component, and the dielectric layer includes a plurality of dielectric crystal grains having a particle size of 60 nm or more and 250 nm or less at a point (D50) at which a cumulative volume is 50% in a cumulative particle size distribution according to a particle size distribution system.

Abstract: An electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body, connected to the internal electrode, and including a low-reflection layer. Brightness of a surface of the low-reflection layer is lower than brightness of a surface of the body.

Abstract: Provided is a multilayer electronic component according to an example embodiment of the present disclosure including: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction, and including Ni; and an external electrode disposed on the body and connected to the internal electrode, wherein the external electrode includes a base electrode layer including Ni and Pd, and the internal electrode includes a first region, and a content of Pd included in the first region is greater than a content of Pd included in a remaining region, excluding the first region in the internal electrode.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.

Abstract: A multilayer electronic component includes a body including a first external electrode including a first base plating layer disposed on a third surface of the body and connected to the first internal electrode and a first electrode layer disposed on the first base plating layer, and a second external electrode including a second base plating layer disposed on a fourth surface of the body and connected to the second internal electrode and a second electrode layer disposed on the second base plating layer, wherein the first and second electrode layers include conductive metal and glass, and a 30 ?m×5 ?m region selected from a cross-section of the first base plating layer in the first and second directions includes three or more Ni grains having a grain size of 4 ?m or greater.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.

Abstract: A multilayer electronic component includes: a body including a plurality of dielectric layers and internal electrodes disposed to face each other with each of the plurality of dielectric layers interposed therebetween; and external electrodes connected to the internal electrodes and disposed on outer surfaces of the body, wherein each of the plurality of dielectric layers includes a BaTiO3-based base material main component and an accessory component including dysprosium (Dy) and terbium (Tb), a content of terbium (Tb) is 0.2 mol or more and less than 1.0 mol based on 100 mol of the base material main component, and the dielectric layer includes a plurality of dielectric crystal grains having a particle size of 60 nm or more and 250 nm or less at a point (D50) at which a cumulative volume is 50% in a cumulative particle size distribution according to a particle size distribution system.