Abstract: A multilayer electronic component includes: a body including a plurality of dielectric layers and internal electrodes disposed to face each other with each of the plurality of dielectric layers interposed therebetween; and external electrodes connected to the internal electrodes and disposed on outer surfaces of the body, wherein each of the plurality of dielectric layers includes a BaTiO3-based base material main component and an accessory component including dysprosium (Dy) and terbium (Tb), a content of terbium (Tb) is 0.2 mol or more and less than 1.0 mol based on 100 mol of the base material main component, and the dielectric layer includes a plurality of dielectric crystal grains having a particle size of 60 nm or more and 250 nm or less at a point (D50) at which a cumulative volume is 50% in a cumulative particle size distribution according to a particle size distribution system.

Abstract: An electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body, connected to the internal electrode, and including a low-reflection layer. Brightness of a surface of the low-reflection layer is lower than brightness of a surface of the body.

Abstract: Provided is a multilayer electronic component according to an example embodiment of the present disclosure including: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction, and including Ni; and an external electrode disposed on the body and connected to the internal electrode, wherein the external electrode includes a base electrode layer including Ni and Pd, and the internal electrode includes a first region, and a content of Pd included in the first region is greater than a content of Pd included in a remaining region, excluding the first region in the internal electrode.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.

Abstract: A multilayer electronic component includes a body including a first external electrode including a first base plating layer disposed on a third surface of the body and connected to the first internal electrode and a first electrode layer disposed on the first base plating layer, and a second external electrode including a second base plating layer disposed on a fourth surface of the body and connected to the second internal electrode and a second electrode layer disposed on the second base plating layer, wherein the first and second electrode layers include conductive metal and glass, and a 30 ?m×5 ?m region selected from a cross-section of the first base plating layer in the first and second directions includes three or more Ni grains having a grain size of 4 ?m or greater.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.

Abstract: A multilayer electronic component includes: a body including a plurality of dielectric layers and internal electrodes disposed to face each other with each of the plurality of dielectric layers interposed therebetween; and external electrodes connected to the internal electrodes and disposed on outer surfaces of the body, wherein each of the plurality of dielectric layers includes a BaTiO3-based base material main component and an accessory component including dysprosium (Dy) and terbium (Tb), a content of terbium (Tb) is 0.2 mol or more and less than 1.0 mol based on 100 mol of the base material main component, and the dielectric layer includes a plurality of dielectric crystal grains having a particle size of 60 nm or more and 250 nm or less at a point (D50) at which a cumulative volume is 50% in a cumulative particle size distribution according to a particle size distribution system.

Abstract: A multilayer electronic component includes: a body including first and second dielectric layers alternately disposed in a first direction; and external electrodes disposed on opposing end surfaces, respectively. A first internal electrode exposed to a first end surface and a first dummy pattern spaced apart from the first internal electrode and exposed to a second end surface are disposed on the first dielectric layer. A second internal electrode exposed to the second end surface and a second dummy pattern spaced apart from the second internal electrode and exposed to the first end surface are disposed on the second dielectric layer. The first and second internal electrodes include first and second main portions, respectively, and the first main portion and the second main portion are arranged in a staggered manner in a width direction.

Abstract: A multilayer electronic component includes a body including a dielectric layer and a plurality of internal electrodes laminated with the dielectric layer interposed therebetween; and an external electrode disposed on the body and connected to the plurality of internal electrodes. The plurality of internal electrodes includes two or more internal electrodes having different thicknesses, a most thick internal electrode having a greatest thickness and a least thick internal electrode having a lowest thickness among the plurality of internal electrodes are disposed on first and second outermost sides opposing each other in a lamination direction of the plurality of internal electrodes. Each internal electrode disposed between the most thick internal electrode and the least thick internal electrode has a thickness the same as or greater than a thickness of an adjacent internal electrode, which is adjacent to that internal electrode in the lamination direction toward the second outermost side.

Abstract: A multilayer electronic component includes a body including a dielectric layer and a plurality of internal electrodes laminated with the dielectric layer interposed therebetween; and an external electrode disposed on the body and connected to the plurality of internal electrodes. The plurality of internal electrodes includes two or more internal electrodes having different thicknesses, a most thick internal electrode having a greatest thickness and a least thick internal electrode having a lowest thickness among the plurality of internal electrodes are disposed on first and second outermost sides opposing each other in a lamination direction of the plurality of internal electrodes. Each internal electrode disposed between the most thick internal electrode and the least thick internal electrode has a thickness the same as or greater than a thickness of an adjacent internal electrode, which is adjacent to that internal electrode in the lamination direction toward the second outermost side.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.

Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.

Abstract: A multilayer electronic component includes: a body including first and second dielectric layers alternately disposed in a first direction; and external electrodes disposed on opposing end surfaces, respectively. A first internal electrode exposed to a first end surface and a first dummy pattern spaced apart from the first internal electrode and exposed to a second end surface are disposed on the first dielectric layer. A second internal electrode exposed to the second end surface and a second dummy pattern spaced apart from the second internal electrode and exposed to the first end surface are disposed on the second dielectric layer. The first and second internal electrodes include first and second main portions, respectively, and the first main portion and the second main portion are arranged in a staggered manner in a width direction.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and a plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween; and an external electrode, wherein the ceramic body comprises an active portion including a plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween to form capacitance and a cover portion formed in upper and lower portions of the active portion, wherein a plurality of internal electrodes in the upper region and the lower region of the active portion is disposed inwardly of an outer side surface of the ceramic body to be spaced apart by a predetermined distance from the body portion, and the plurality of internal electrodes in the central region of the active portion and the internal electrodes having the same polarities are connected to each other via vias.

Abstract: A multi-layered ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween; and first and second external electrodes disposed outside of the ceramic body and electrically connected to the first and second internal electrodes, respectively. The first internal electrode is exposed from a first surface of the ceramic body and the second internal electrode is exposed from a second surface opposing the first surface. The first internal electrode has a notch portion disposed inwardly of a portion facing the first surface and, and the second internal electrode has a notch portion disposed inwardly of a portion facing the second surface. Each of the notch portions and a margin portion of the ceramic body in a second direction and in a third direction are provided with a step absorption layer, respectively.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers disposed therebetween to be exposed to first and second external surfaces of the ceramic body, and first and second external electrodes disposed on the first and second external surfaces of the ceramic body and connected to corresponding internal electrodes, among the first and second internal electrodes, respectively. The dielectric layer includes a portion, disposed between the first and second external electrodes, having a thickness of 3.5 micrometers or more to 3.7 micrometers or less.

Abstract: A method for manufacturing a capacitor component includes an operation of sintering under a moderately-or-more reducing atmosphere for hydrogen, a body in which a plurality of dielectric layers having internal electrodes printed thereon are laminated,; a first reoxidation operation of subjecting the sintered body to a first reoxidation heat treatment under an oxidizing atmosphere; and a second reoxidation operation of subjecting the body having undergone the first reoxidation heat treatment to a second reoxidation heat treatment under an oxidizing atmosphere.

Abstract: A multilayer ceramic capacitor includes a ceramic body including a plurality of dielectric layers stacked therein in a stacking direction; first and second external electrodes disposed externally on the ceramic body; first and second internal electrodes alternately stacked with the plurality of dielectric layers, forming an internal active layer of the ceramic body, and respectively connected to the first and second external electrodes; a dummy layer, including a conductive material and having a mesh shape, disposed in at least one of an upper cover layer or a lower cover layer respectively disposed above or below the internal active layer of the ceramic body in the stacking direction.

Abstract: A multilayer ceramic electronic component includes: a ceramic body having a dielectric layer, and a plurality of first and second internal electrodes facing each other with the dielectric layer interposed therebetween; and first and second external electrodes disposed on an outer surface of the ceramic body, respectively. The ceramic body includes an active portion including a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween to form capacitance, and cover portions formed on upper and lower portions of the active portion. A buffer region is disposed between at least one pair of first and second internal electrodes among the plurality of first and second internal electrodes disposed inside the active portion, and satisfies the relation 0<tb<150 ?m+td, where td is a thickness of the dielectric layer, and tb is a thickness of the buffer region.