Patents by Inventor Ho-Jeong Mun

Ho-Jeong Mun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a solder ball on a board and the board
    Patent number: 7213329
    Abstract: In the method, a conductive pad of the board is etched to a depth that is greater than 50% and less than 100% of a thickness of the conductive pad. Subsequently, a solder ball may be formed on the etched conductive pad. For example, the conductive pad may be copper.
    Type: Grant
    Filed: August 4, 2005
    Date of Patent: May 8, 2007
    Assignee: Samsung Electronics, Co., Ltd.
    Inventors: Seung-Woo Kim, Pyeong-Wan Kim, Sang-Ho Ahn, Bo-Seong Kim, Ho-Jeong Mun, Tae-Seong Park, Hee-Guk Choi