Patents by Inventor Ho Jin YUN
Ho Jin YUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250046509Abstract: A low-loss spiral coil includes a conducting wire wound N turns of which a width of each of wires corresponding to each of sections of the conducting wire is determined by setting an entire width of the conducting wire to be a width of M sections of the conducting wire, and then determining the width of each of the wires such that a resistance of the spiral coil formed based on the width of the M sections is minimized.Type: ApplicationFiled: October 17, 2024Publication date: February 6, 2025Inventors: Jung Ick MOON, In Kui CHO, Sang-Won KIM, Seong-Min KIM, Ho Jin LEE, Je Hoon YUN, Dong Won JANG
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Patent number: 12212779Abstract: A method of processing an immersive video includes classifying view images into a basic image and an additional image, performing pruning with respect to view images by referring to a result of classification, generating atlases based on a result of pruning, generating a merged atlas by merging the atlases into one atlas, and generating configuration information of the merged atlas.Type: GrantFiled: June 4, 2021Date of Patent: January 28, 2025Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Jun Young Jeong, Kug Jin Yun, Gwang Soon Lee, Hong Chang Shin, Ho Min Eum
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Patent number: 12065734Abstract: The present disclosure relates to an apparatus and method for cleaning a chamber, and more particularly, to an apparatus and method for cleaning a chamber, which are capable of cleaning the chamber which is contaminated while depositing a thin film on a substrate. The chamber cleaning method in accordance with an exemplary embodiment is a method for cleaning a chamber configured to deposit a zinc oxide, the method comprising: supplying a chlorine (Cl)-containing gas and a hydrogen (H)-containing gas into a chamber; activating and reacting the separately supplied gases with each other inside the chamber to generate a reaction gas; and firstly cleaning the chamber with the reaction gas.Type: GrantFiled: July 21, 2022Date of Patent: August 20, 2024Assignee: JUSUNG ENGINEERING CO., LTD.Inventors: Dong Hwan Lee, Jae Ho Kim, Hyun Il Kim, Ho Jin Yun, Jae Wan Lee, Byung Gwan Lim
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Publication number: 20230343870Abstract: Disclosed is a high voltage semiconductor device. More particularly, a high voltage semiconductor device is disclosed, including a slope compensating structure on at least a portion of an outermost surface of a gate spacer defining a sidewall of a gate structure, thereby reducing or preventing electric field concentration in a corner of a gate field plate, and thus improving reliability of the device.Type: ApplicationFiled: March 8, 2023Publication date: October 26, 2023Inventor: Ho Jin YUN
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Publication number: 20220356569Abstract: The present disclosure relates to an apparatus and method for cleaning a chamber, and more particularly, to an apparatus and method for cleaning a chamber, which are capable of cleaning the chamber which is contaminated while depositing a thin film on a substrate. The chamber cleaning method in accordance with an exemplary embodiment is a method for cleaning a chamber configured to deposit a zinc oxide, the method comprising: supplying a chlorine (Cl)-containing gas and a hydrogen (H)-containing gas into a chamber; activating and reacting the separately supplied gases with each other inside the chamber to generate a reaction gas; and firstly cleaning the chamber with the reaction gas.Type: ApplicationFiled: July 21, 2022Publication date: November 10, 2022Inventors: Dong Hwan LEE, Jae Ho KIM, Hyun Il KIM, Ho Jin YUN, Jae Wan LEE, Byung Gwan LIM
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Patent number: 11427906Abstract: The present disclosure relates to an apparatus and method for cleaning a chamber, and more particularly, to an apparatus and method for cleaning a chamber, which are capable of cleaning the chamber which is contaminated while depositing a thin film on a substrate. The chamber cleaning method in accordance with an exemplary embodiment is a method for cleaning a chamber configured to deposit a zinc oxide, the method comprising: supplying a chlorine (Cl)-containing gas and a hydrogen (H)-containing gas into a chamber; activating and reacting the separately supplied gases with each other inside the chamber to generate a reaction gas; and firstly cleaning the chamber with the reaction gas.Type: GrantFiled: February 7, 2019Date of Patent: August 30, 2022Inventors: Dong Hwan Lee, Jae Ho Kim, Hyun Il Kim, Ho Jin Yun, Jae Wan Lee, Byung Gwan Lim
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Publication number: 20210040610Abstract: The present disclosure relates to an apparatus and method for cleaning a chamber, and more particularly, to an apparatus and method for cleaning a chamber, which are capable of cleaning the chamber which is contaminated while depositing a thin film on a substrate. The chamber cleaning method in accordance with an exemplary embodiment is a method for cleaning a chamber configured to deposit a zinc oxide, the method comprising: supplying a chlorine (Cl)-containing gas and a hydrogen (H)-containing gas into a chamber; activating and reacting the separately supplied gases with each other inside the chamber to generate a reaction gas; and firstly cleaning the chamber with the reaction gas.Type: ApplicationFiled: February 7, 2019Publication date: February 11, 2021Inventors: Dong Hwan LEE, Jae Ho KIM, Hyun Il KIM, Ho Jin YUN, Jae Wan LEE, Byung Gwan LIM
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Patent number: 10490337Abstract: A coil component includes a body part containing a magnetic material, a coil part disposed in the body part, and an electrode part disposed on the body part. The coil part includes a support member, a first coil layer disposed on at least one surface of the support member, a first insulating layer stacked on at least one surface of the support member and covering the first coil layer, and a second coil layer disposed on the first insulating layer. The first and second coil layers are electrically connected to each other, and the second coil layer has a larger number of coil turns than the first coil layer. Additionally or alternatively, a conductor of the first coil layer has an aspect ratio less than 1. Methods of manufacturing such coil components are also provided.Type: GrantFiled: March 4, 2019Date of Patent: November 26, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Woo Jin Lee, Youn Soo Kim, Dong Hwan Lee, Ho Jin Yun, Ji Hyun Eom, Chan Yoon
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Patent number: 10340073Abstract: A coil component includes a body part containing a magnetic material, a coil part disposed in the body part, and an electrode part disposed on the body part. The coil part includes a support member, a first coil layer disposed on at least one surface of the support member, a first insulating layer stacked on at least one surface of the support member and covering the first coil layer, and a second coil layer disposed on the first insulating layer. The first and second coil layers are electrically connected to each other, and the second coil layer has a larger number of coil turns than the first coil layer. Additionally or alternatively, a conductor of the first coil layer has an aspect ratio less than 1. Methods of manufacturing such coil components are also provided.Type: GrantFiled: July 20, 2016Date of Patent: July 2, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Woo Jin Lee, Youn Soo Kim, Dong Hwan Lee, Ho Jin Yun, Ji Hyun Eom, Chan Yoon
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Publication number: 20190198233Abstract: A coil component includes a body part containing a magnetic material, a coil part disposed in the body part, and an electrode part disposed on the body part. The coil part includes a support member, a first coil layer disposed on at least one surface of the support member, a first insulating layer stacked on at least one surface of the support member and covering the first coil layer, and a second coil layer disposed on the first insulating layer. The first and second coil layers are electrically connected to each other, and the second coil layer has a larger number of coil turns than the first coil layer. Additionally or alternatively, a conductor of the first coil layer has an aspect ratio less than 1. Methods of manufacturing such coil components are also provided.Type: ApplicationFiled: March 4, 2019Publication date: June 27, 2019Inventors: Woo Jin Lee, Youn Soo Kim, Dong Hwan Lee, Ho Jin Yun, Ji Hyun Eom, Chan Yoon
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Patent number: 9633773Abstract: Disclosed herein are a thin film common mode filter and a method of manufacturing the same. The thin film common mode filter according to the exemplary embodiment of the present invention includes a magnetic substrate made of a magnetic ceramic material; and coil patterns formed on the magnetic substrate, wherein external electrodes connected with the coil patterns are sequentially stacked and insulating layers formed on and beneath the coil pattern are made of a composite of ferrite powder and thermosetting resin.Type: GrantFiled: March 24, 2014Date of Patent: April 25, 2017Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong Min Cho, Won Chul Sim, Ho Jin Yun, Ju Hwan Yang, Young Seuck Yoo
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Publication number: 20170032885Abstract: A coil component includes a body part containing a magnetic material, a coil part disposed in the body part, and an electrode part disposed on the body part. The coil part includes a support member, a first coil layer disposed on at least one surface of the support member, a first insulating layer stacked on at least one surface of the support member and covering the first coil layer, and a second coil layer disposed on the first insulating layer. The first and second coil layers are electrically connected to each other, and the second coil layer has a larger number of coil turns than the first coil layer. Additionally or alternatively, a conductor of the first coil layer has an aspect ratio less than 1. Methods of manufacturing such coil components are also provided.Type: ApplicationFiled: July 20, 2016Publication date: February 2, 2017Inventors: Woo Jin LEE, Youn Soo KIM, Dong Hwan LEE, Ho Jin YUN, Ji Hyun EOM, Chan YOON
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Patent number: 9245685Abstract: Disclosed herein is a common mode filter including: a body element including an insulating member enclosing a coil electrode pattern and a magnetic member disposed on one surface or both surfaces of the insulating member; and an insulating layer disposed on at least one side of the body element, thereby increasing an interlayer adhesion between the respective components configuring the common mode filter.Type: GrantFiled: October 11, 2013Date of Patent: January 26, 2016Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong Min Cho, Sung Kwon Wi, Chan Yoon, Ho Jin Yun, Young Seuck Yoo
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Patent number: 9230727Abstract: Disclosed herein is a common mode filter including an internal electrode manufactured in a coil electrode form and provided with a simultaneous coil pattern in which two coil electrodes are overlapped with each other in a single layer in a direction in which a coil is wound, wherein a height of a second insulating layer formed on the internal electrode is higher than an interval between the coils. Therefore, a portion at which a parasitic capacitance is generated may be basically blocked, and a self resonant frequency (SRF) may be increased while filtering performance as the common mode filter is maintained.Type: GrantFiled: March 14, 2013Date of Patent: January 5, 2016Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Seuck Yoo, Kang Heon Hur, Sung Kwon Wi, Ho Jin Yun, Jong Yun Lee, Ju Hwan Yang, Jin Hyuck Yang, Young Do Kweon, Eun Ha Kim
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Publication number: 20140333406Abstract: The present invention relates to a common mode filter. A common mode filter in accordance with the present invention includes a magnetic substrate formed of a magnetic ceramic material; a first coil pattern and a second coil pattern sequentially formed on the magnetic substrate; an external electrode laminated on the second coil pattern; a via for connecting the first coil pattern and the second coil pattern; and a second insulating layer formed between the first coil pattern and the second coil pattern, wherein the height of the second insulating layer is 5 ?m to 20 ?m while being proportional to the height of the via and thus it is possible to improve SRF and insertion loss characteristics by adjusting the height of the second insulating layer.Type: ApplicationFiled: May 6, 2014Publication date: November 13, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Hyuck YANG, Kang Heon HUR, Sung Kwon WI, Ho Jin YUN, Hye Won BANG, Young Do KWEON, Won Chul SIM
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Publication number: 20140285303Abstract: Disclosed herein are a thin film common mode filter and a method of manufacturing the same. The thin film common mode filter according to the exemplary embodiment of the present invention includes a magnetic substrate made of a magnetic ceramic material; and coil patterns formed on the magnetic substrate, wherein external electrodes connected with the coil patterns are sequentially stacked and insulating layers formed on and beneath the coil pattern are made of a composite of ferrite powder and thermosetting resin.Type: ApplicationFiled: March 24, 2014Publication date: September 25, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong Min CHO, Won Chul SIM, Ho Jin YUN, Ju Hwan YANG, Young Seuck YOO
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Publication number: 20140218150Abstract: Disclosed herein is a common mode filter including: a body element including an insulating member enclosing a coil electrode pattern and a magnetic member disposed on one surface or both surfaces of the insulating member; and an insulating layer disposed on at least one side of the body element, thereby increasing an interlayer adhesion between the respective components configuring the common mode filter.Type: ApplicationFiled: October 11, 2013Publication date: August 7, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong Min CHO, Sung Kwon WI, Chan YOON, Ho Jin YUN, Young Seuck YOO
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Publication number: 20140062644Abstract: Disclosed herein is a common mode filter including an internal electrode manufactured in a coil electrode form and provided with a simultaneous coil pattern in which two coil electrodes are overlapped with each other in a single layer in a direction in which a coil is wound, wherein a height of a second insulating layer formed on the internal electrode is higher than an interval between the coils. Therefore, a portion at which a parasitic capacitance is generated may be basically blocked, and a self resonant frequency (SRF) may be increased while filtering performance as the common mode filter is maintained.Type: ApplicationFiled: March 14, 2013Publication date: March 6, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Seuck Yoo, Kang Heon Hur, Sung Kwon Wi, Ho Jin Yun, Jong Yun Lee, Ju Hwan Yang, Jin Hyuck Yang, Young Do Kweon, Eun Ha Kim
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Patent number: 8465554Abstract: Provided is a method of manufacturing a lithium ion capacitor. The method includes the steps of: contacting a lithium supplying source to an anode directly; pre-doping lithium ions into the anode by immerging the anode and the lithium supplying source into a doping electrolyte solution; forming an electrode cell by sequentially stacking the lithium ions on the pre-doped anode and a cathode with placing a separator therebetween; cleaning the doping electrolyte solution absorbed to terminals of the electrode cell; fusing the terminals; and sealing the electrode cell with exposing the fused terminal.Type: GrantFiled: February 11, 2011Date of Patent: June 18, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Dong Hyeok Choi, Bae Kyun Kim, Hak Kwan Kim, Ho Jin Yun, Hong Seok Min
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Publication number: 20130128412Abstract: The present invention relates to an electrode for an energy storage and a method for manufacturing the same and provides a useful effect of improving resistance characteristics of an electrode for an energy storage and strengthening adhesion by forming trenches of predetermined dimensions on a surface of a current collector, forming a conductive layer, which includes a conductive agent as much as possible, on the surface of the current collector, and forming a bonding layer including an active material, a conductive agent, and a binder and an electrode layer including an active material and a binder on the conductive layer.Type: ApplicationFiled: March 1, 2012Publication date: May 23, 2013Inventors: Jun Hee Bae, Bae Kyun Kim, Ho Jin Yun, Yeong Su Cho, Chang Ryul Jung, Hak Kwan Kim