Abstract: A semiconductor device includes a substrate with a conductive pattern. A semiconductor die is electrically connected to the substrate and both the semiconductor die and the substrate are at least partially covered by a package body. In some examples, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In some examples, through-mold vias are included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body. In some examples, an interposer is electrically connected to the through-mold vias and may be covered by the package body and/or disposed in spaced relation thereto. In some examples, the interposer may not be electrically connected to the through-mold vias but may have one or more semiconductor dies of the semiconductor device electrically connected thereto.

Abstract: Disclosed herein is a touch sensor. The touch sensor includes: a window substrate; a base substrate having one surface formed so as to be bonded to the window substrate and the other surface having a first electrode pattern formed thereon; a bezel formed along an edge of the base substrate; an insulating layer applying the electrode pattern while filling between the bezel and the bezel; and a second electrode pattern formed on the insulating layer.

Abstract: Disclosed herein is provided with a touch sensor, including: a window substrate; a first bezel layer formed at an edge portion of the window substrate and formed of at least one layer; and a resin layer disposed on the first bezel layer and the window substrate. The touch sensor further includes a second bezel layer disposed on the resin layer, at a position corresponding to the first bezel layer and the resin layer is made of a transparent material having a refractive index lower than that of the first bezel layer and the second bezel layer. As described above, the plurality of bezel layers and the resin layer are stacked together to form a difference in refractive index, thereby implementing a clear color even by the thinner bezel layer.

Abstract: Embodiments of the invention provide a touch sensor, including a window substrate, and bezel layers formed along an outer circumference on the window substrate. The bezel layer includes a photochromic compound or a thermochromic compound expressing at least two colors.

Abstract: An electric double layer capacitor package includes a package body including a groove region formed by removing a portion from a surface thereof, an electric double layer capacitor disposed in the groove region of the package body, and including first and second electrodes and an ion permeable separator disposed between the first and second electrodes, and first and second conductive vias each disposed in an inner portion of the package body and each having one end connected to one of the first and second electrodes, respectively and the other end extending from the one end toward a bottom surface of the package body in the case that the surface is defined as an upper region of the package body. The electric double layer capacitor package can be surface-mounted without using an additional structure. The use of the electric double layer capacitor package achieves a reduction in thickness and mounting area, thereby contributing to the production of lighter and smaller products.