Abstract: A display apparatus includes display unit; a processing unit configured to extract an object included in the input image and generate object information based on the extracted object; a communication unit configured to communicate with an external server via a network; and a controller configured to control the communication unit to transmit the object information to the server receive recommendation information generated by an analysis of the object information from the server.

Abstract: The present disclosure is directed toward a compound relief tap, and more specifically, to a compound relief tap with domains made of a plurality of consecutive threads where each domain has different properties associated with variable thread parameters and variable geometrical arrangements such a variation of a taper angle and relief angles for different portions of domain threads or between domains. In a first embodiment, all of the threads in a domain have a given geometrical arrangement. In a second embodiment, several of the threads of the domain possess the geometrical arrangement. In a third embodiment, only the thread of the domain possesses the geometrical arrangement. And in a fourth embodiment, alternative threads in the domain possess the geometrical arrangement. What is also contemplated is a variation in geometrical arrangement between successive domains for any of these threaded domains.

Abstract: It is the object of the present disclosure to provide an improved end mill that can be easily manufactured, reduces cutting forces on the driving tool, limits chatter at high rotation speeds, has better stability, produces smoother cutting surfaces, and has less natural resonating frequencies while in use to permit operation of the end mill over a wider range of operating conditions. The end mill is equipped with a series of sinusoidal cutting edges with a single long pitch arranged regularly or irregularly along the circumferential cutting surface. In another embodiment, the pitch, the cutting angle of the datum line of the sinusoidal cutting edges and the amplitude of the sinusoidal function can be varied.

Abstract: A tray transferring apparatus for transferring a handling tray on which semiconductor devices are mounted prevents the semiconductor devices from being scattered or separated from the handling tray. The tray transferring apparatus includes a fixing means installed on a main frame for supporting a fixed tray, a correcting means installed on the main frame for correcting the position of the fixed tray, a gripping means installed on the main frame for gripping a handling tray, and at least one sensor for sensing gripper plates and the handling tray. A fixed tray is held by the fixing means, and right/left inclination of the fixed tray is corrected by the correcting means. An upper portion of a handling tray holding semiconductors is covered by the bottom of the fixed tray and is gripped by the gripping means.

Abstract: The present disclosure is directed toward a compound relief tap, and more specifically, to a compound relief tap with domains made of a plurality of consecutive threads where each domain has different properties associated with variable thread parameters and variable geometrical arrangements such a variation of a taper angle and relief angles for different portions of domain threads or between domains. In a first embodiment, all of the threads in a domain have a given geometrical arrangement. In a second embodiment, several of the threads of the domain possess the geometrical arrangement. In a third embodiment, only the thread of the domain possesses the geometrical arrangement. And in a fourth embodiment, alternative threads in the domain possess the geometrical arrangement. What is also contemplated is a variation in geometrical arrangement between successive domains for any of these threaded domains.

Abstract: A transfer device of a handler for testing semiconductor devices is provided in which a pitch between each of a plurality of picker heads may be adjusted without replacing a cam plate. The transfer device may include a base part, a plurality of picker heads movably mounted on the base part, and a cam plate movably mounted on the base part and having a plurality of inclined cam grooves formed therein. Each picker head is connected to a corresponding cam groove by a connection part extending therebetween, with an end of each connection part movably coupled to its respective cam groove. A driving unit reciprocates the cam plate so that, as the ends of the connection parts move within the cam grooves, a position of the picker heads may be varied.

Abstract: A socket assembly for testing semiconductor devices includes a socket board electrically connected to an outside testing device, and a socket guide which covers the socket board. The socket guide has an open part to receive the semiconductor device and allows pins on the semiconductor device to couple with connection pins on the socket board. A spacer may be interposed between the socket board and the socket guide to maintain a predetermined distance between the semiconductor device and the socket board. In this manner, the balls or the leads of each semiconductor device may be pressed onto connection pins of the socket to a predetermined depth, even when the semiconductor devices have different thicknesses.

Abstract: A handler for testing semiconductor devices is disclosed which is capable of simplifying the process carried out in an exchanging station, namely, the process of loading/unloading semiconductor devices in/from test trays, and greatly increasing the number of simultaneously testable semiconductor devices.

Abstract: It is the object of the present disclosure to provide an improved end mill that can be easily manufactured, reduces cutting forces on the driving tool, limits chatter at high rotation speeds, has better stability, produces smoother cutting surfaces, and has less natural resonating frequencies while in use to permit operation of the end mill over a wider range of operating conditions. The end mill is equipped with a series of sinusoidal cutting edges with a single long pitch arranged regularly or irregularly along the circumferential cutting surface. In another embodiment, the pitch, the cutting angle of the datum line of the sinusoidal cutting edges and the amplitude of the sinusoidal function can be varied.

Abstract: A test tray for a handler for testing semiconductor devices is disclosed which is capable of reducing the costs and time taken for replacement of carrier modules, and achieving an enhancement in workability.

Abstract: A handler for testing semiconductor devices is disclosed which is capable of simplifying the process carried out in an exchanging station, namely, the process of loading/unloading semiconductor devices in/from test trays, and greatly increasing the number of simultaneously testable semiconductor devices.

Abstract: Provided are an IC sorter, a method for sorting a burn-in IC, an IC sorted using the method.

Abstract: A device for compensating for heat generation in a modular IC test handler is provided which includes at least one supporting member positioned adjacent to a press unit of the handler, and having a cooling fluid flow passage formed therein for flow of cooling fluid, and a plurality of cooling fluid spraying units for spraying the cooling fluid supplied through the cooling fluid flow passage toward faces of modular ICs in an oblique direction from a position between adjacent push bars of the press unit, thereby spraying cooling fluid directly onto ICs attached to a surface of modular ICs during testing and enhancing an efficiency of heat compensation.

Abstract: A handler for testing semiconductor devices is disclosed which is capable of simplifying the process carried out in an exchanging station, namely, the process of loading/unloading semiconductor devices in/from test trays, and greatly increasing the number of simultaneously testable semiconductor devices.

Abstract: Carrier module including a carrier module body for seating a semiconductor device on an underside thereof, having a pass through hole from an upper part to the underside the semiconductor device is seated thereon, a housing over the carrier module body, a supplementary housing fitted in a lower part of the housing to be movable in up/down directions, for elastic contact with the carrier module body by a first elastic member fitted inside of the housing, a vacuum tube in the supplementary housing so as to be in communication with the pass through hole in the carrier module body, at least one pair of latches in a lower part of the carrier module body to move apart or close in an outer or inner side, for holding or releasing the semiconductor device seated on the carrier module body, a latch button fitted in an upper part of the carrier module body so as to be movable in up/down directions, and coupled to the latch with a connection pin for moving in up/down directions by an external force, to making the latch t

Abstract: Carrier module for a semiconductor device test handler including a carrier module body, a device seating part in an underside part of the carrier module body, at least one pair of first latches at opposite sides of the device seating part arranged opposite to, and movable away from, or close to, each other, for holding, or releasing opposite side parts of the semiconductor device seated on the device seating part, at least one pair of second latches rotatably fitted on opposite sides of the first latch, for holding an underside part of the semiconductor device seated on the device seating part, and releasing the semiconductor device interlocked with a releasing action of the first latch, a latch button fitted in an upper part of the carrier module to move in up/down directions and coupled to one end of the first latch, for moving up and down to make the first latch to move, and a first elastic member, and a second elastic member for elastic supporting of the first latch, and the second latch, thereby securely

Abstract: A device for compensating for heat generation in a modular IC test handler is provided which includes at least one supporting member positioned adjacent to a press unit of the handler, and having a cooling fluid flow passage formed therein for flow of cooling fluid, and a plurality of cooling fluid spraying units for spraying the cooling fluid supplied through the cooling fluid flow passage toward faces of modular ICs in an oblique direction from a position between adjacent push bars of the press unit, thereby spraying cooling fluid directly onto ICs attached to a surface of modular ICs during testing and enhancing an efficiency of heat compensation.