Abstract: Provided herein are methods and uses for preventing and treating age-associated functional changes by administering a glucagon-like peptide 1 receptor (GLP-1R) agonist to a subject in need thereof. The functional changes involve multiple organs throughout the body.

Abstract: Provided herein are methods to treat brain functional decline during aging, which involve administration of glucagon-like peptide-1 receptor (GLP-1R) agonists (GLP-1RAs) that treat the aging-associated changes of the brain. The GLP-1R agonist is exenatide, liraglutide, lixisenatide, albiglutide, dulaglutide, semaglutide, taspoglutide, PF-06882961, OWL-833, TTP-273, or any other molecule that activates GLP-1R.

Abstract: The subject invention pertains to methods and compositions to stabilize antibodies for deep immunolabeling and tissue imaging. The antibodies can be stabilized with the addition of antigen-binding fragments of immunoglobulins and cross-linkers and incubated in appropriate buffered conditions.

Abstract: Provided are DNA-barcoding reagents, DNA-barcoded antibodies, and methods of using DNA-barcoding reagents, and DNA-barcoded antibodies. The DNA-barcoding reagents comprise an affinity moiety that is specific towards antibodies, and covalently linked to one or more DNA sequences, optionally, by a linker. Also provided are methods of using the DNA-barcoded antibodies, for example, multiplexed tissue antigen imaging and profiling, multiplexed biomolecule detection, and affinity purification and sorting of marker-positive cells.

Abstract: An electrode assembly connected to a radio frequency electrical power source transforms process gas into plasma for processing a semiconductor substrate. The electrode assembly includes a first and a second electrode made of aluminum (Al), and a third electrode made of silicon (Si). A plurality of first bolts connect the first electrode to the second electrode, and a plurality of second bolts connect the second electrode with the third electrode. The bolts are either mad of or coated with a metal having an electric conductivity that is no less than that of the aluminum (Al). Furthermore, a conductive film and/or adhesive is interposed between the first electrode and the second electrode. The conductive film includes metal having an electric conductivity more than the aluminum (Al). The conductive film and the bolts reduce the electrical resistance throughout the assembly, and the adhesive fills minute apertures in the surfaces of the electrodes.

Abstract: A method of forming a low-k dielectric insulating layer includes forming the dielectric insulating layer and then removing hydrogen bonds in the dielectric insulating layer. The dielectric layer as formed is preferably a HSQ film which contains the structure Si--O--H. Hydrogen is removed from the dielectric layer by either: a heat treatment in plasma, an ozone reduction process, an ion implantation process, or electron beam bombardment.