Abstract: An electronic device may include: a first temperature sensor configured to measure a first temperature of a skin surface when a user comes into contact with a main body of the electronic device; a first heating element spaced apart from the first temperature sensor by a first predetermined distance; a second temperature sensor spaced apart from the first heating element by a second predetermined distance and configured to measure a second temperature inside the main body; and a processor configured to: estimate heat flux based on the first temperature and the second temperature; estimate a blood perfusion rate of the user based on a temperature of the first heating element and the first temperature, and estimate a core body temperature of a user based on the first temperature, the estimated heat flux, and the estimated blood perfusion rate.

Abstract: A pad liner includes a first pad clip that surrounds and is coupled to a side protrusion protruding in a lateral direction from a brake pad, and a torque support located under the first pad clip and between a side surface of the brake pad and the caliper body. The torque support supports a braking torque. The first pad clip includes a reference surface located on one of a top surface and a bottom surface of the side protrusion, a vertical elastic portion located on an opposite side from the reference surface that pressurizes the side protrusion in a direction of the reference surface, and a clip side portion that connects the reference surface and the vertical elastic portion and surrounds a side surface of the side protrusion. The pad liner minimizes a vertical gap and movement of the brake pad.

Abstract: A display panel including a circuit board having pads, light emitting devices electrically connected to the pads and arranged on the circuit board, each light emitting device having a first surface facing the circuit board and a second surface opposite to the first surface, a buffer material layer disposed between the circuit board and the light emitting devices to fill a space between the circuit board and the light emitting devices, and a cover layer covering the second surface of the light emitting devices, in which the buffer material layer is disposed under the first surfaces of the light emitting devices and has grooves in a region between adjacent light emitting devices, a portion of a top surface of the buffer material layer is disposed between adjacent light emitting devices, and the cover layer fills the grooves of the buffer material layer.

Abstract: Disclosed herein is a method of printing a nanostructure including: preparing a template substrate on which a pattern is formed; forming a replica pattern having an inverse phase of the pattern by coating a polymer thin film on an upper portion of the template substrate, adhering a thermal release tape to an upper portion of the polymer thin film, and separating the polymer thin film from the template substrate; forming a nanostructure by depositing a functional material on the replica pattern; and printing the nanostructure deposited on the replica pattern to a substrate by positioning the nanostructure on the substrate, applying heat and pressure to the nanostructure, and weakening an adhesive force between the thermal release tape and the replica pattern by the heat.

Abstract: Provided is a cluster node recommendation system. A method of controlling the cluster node recommendation system includes: inputting user selection information from a user, the user selection information including at least one of a cloud vendor, an Information Technology (IT) resource size, and a free resource size; checking resource requirements of a designated application; outputting a node configuration by inputting the input user selection information and the checked resource requirements of the application to an artificial intelligence module; verifying validity by arranging a container in which the application is executed, in the output node configuration; and providing a final node configuration in which validity verification is made, to the user.

Abstract: A semiconductor chip may include: a body portion with a front surface and a rear surface; a pair of through electrodes penetrating the body portion; an insulating layer disposed over the rear surface of the body portion and the pair of through electrodes; and a rear connection electrode disposed over the insulating layer and connected simultaneously with the pair of through electrodes, wherein a distance between the pair of through electrodes is greater than twice a thickness of the insulating layer.

Abstract: A successive approximation analog/digital converter includes a sample & hold part sampling and holding an intensity of an analog input signal using a single clock cycle of a clock signal; a first comparator comparing the intensity of the analog input signal with comparison voltages determined according to estimated digital values per clock cycle following an operating clock cycle of the sample & hold part; a second comparator comparing the intensity of the analog input signal with a value equal to ½ of a preset reference voltage in the latter half of the operating clock cycle of the sample & hold part; a successive approximation register determining a value of an MSB of a digital value to be converted according to the comparison result of the second comparator and values of bits successive to the MSB according to the comparison result of the first comparator, and generating the estimated digital values by applying estimated values to undetermined bits; and a digital/analog converter generating the

Abstract: A successive approximation analog/digital converter includes a sample & hold part sampling and holding an intensity of an analog input signal using a single clock cycle of a clock signal; a first comparator comparing the intensity of the analog input signal with comparison voltages determined according to estimated digital values per clock cycle following an operating clock cycle of the sample & hold part; a second comparator comparing the intensity of the analog input signal with a value equal to ½ of a preset reference voltage in the latter half of the operating clock cycle of the sample & hold part; a successive approximation register determining a value of an MSB of a digital value to be converted according to the comparison result of the second comparator and values of bits successive to the MSB according to the comparison result of the first comparator, and generating the estimated digital values by applying estimated values to undetermined bits; and a digital/analog converter generating the

Abstract: A conductive coating composition and a method for producing coating layer using the same are disclosed. The conductive coating composition is capable of forming an antistatic coating layer on the protective film surface of display device. The conductive coating composition includes: 1 to 30 wt % of polyethylene dioxythiophene aqueous-dispersed solution; 5 to 15 wt % of water-soluble binder resin; 0.2 to 10 wt % of melamine resin; 6 to 40 wt % of alcohol solvent; 5 to 30 wt % of organic solvent selected from the group consisting of dimethyl sulfoxide, propyleneglycol methylether, N-methylpyrrolidone, ethyl-3-ethoxypropionate, propyleneglycol monomethyletheracetate, butylcarbitol and the mixtures thereof; and 10 to 50 wt % of water. The method for producing the conductive coating layer includes the steps of coating the conductive coating composition on a substrate; and drying the coating composition.

Abstract: A conductive coating composition and a method for producing coating layer using the same are disclosed. The conductive coating composition is capable of forming an antistatic coating layer on the protective film surface of display device. The conductive coating composition includes: 1 to 30 wt % of polyethylene dioxythiophene aqueous-dispersed solution; 5 to 15 wt % of water-soluble binder resin; 0.2 to 10 wt % of melamine resin; 6 to 40 wt % of alcohol solvent; 5 to 30 wt % of organic solvent selected from the group consisting of dimethyl sulfoxide, propyleneglycol methylether, N-methylpyrrolidone, ethyl-3-ethoxypropionate, propyleneglycol monomethyletheracetate, butylcarbitol and the mixtures thereof; and 10 to 50 wt % of water. The method for producing the conductive coating layer includes the steps of coating the conductive coating composition on a substrate; and drying the coating composition.