Patents by Inventor Ho-kyung KANG

Ho-kyung KANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210242595
    Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
    Type: Application
    Filed: June 3, 2020
    Publication date: August 5, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hak Gu KIM, Ho Kyung KANG, Seong Jong CHEON, Young Sik HUR, Jin Seon PARK, Yong Duk LEE
  • Patent number: 11033250
    Abstract: An ultrasound medical imaging method includes: displaying an ultrasound image on a screen; determining a view plane, on which the displayed ultrasound image is captured, among view planes; and setting a region of interest corresponding to the determined view plane on the ultrasound image.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: June 15, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Min-su Cheon, Ho-kyung Kang, Yu-mi Sohn, Jong-geun Park, Young-yoon Lee, Jin-woo Yim, Ki-won Sohn, Hojjat Alireza, Jae-young Choi
  • Publication number: 20210175637
    Abstract: An antenna module includes: an integrated circuit (IC) configured to generate a radio frequency (RF) signal; and a substrate including an antenna portion providing a first surface of the substrate, and a circuit pattern portion providing a second surface of the substrate. The antenna portion includes first antenna members configured to transmit the RF signal, cavities corresponding to the first antenna members, through vias respectively disposed in the cavities and respectively electrically connected to the first antenna members, and a plating member disposed in at least one cavity among the cavities. The circuit pattern portion includes a circuit pattern and an insulating layer forming, for each of the through vias, an electrical connection path to the IC.
    Type: Application
    Filed: February 18, 2021
    Publication date: June 10, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ho Kyung KANG, ThomasA KIM
  • Publication number: 20210143530
    Abstract: An antenna module includes a first antenna unit including at least one first patch antenna pattern, at least one first feed via, and at least one first dielectric layer, a second antenna unit including at least one second patch antenna pattern, at least one second feed via, and at least one second dielectric layer, a first connection portion, a first rigid substrate electrically connecting the first connection portion to the first antenna unit and having a first surface on which the first antenna unit is disposed, a base connection portion, a flexible substrate having a first surface on which the first connection portion is disposed and a second surface on which the base connection portion is disposed, and an IC electrically connected to the flexible substrate through the second surface of the flexible substrate or the first rigid substrate.
    Type: Application
    Filed: January 19, 2021
    Publication date: May 13, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ho Kyung KANG, Shin Haeng HEO, Hyung Ho SEO
  • Publication number: 20210143525
    Abstract: A radio-frequency device includes a radio-frequency module. The radio-frequency module includes a first substrate, a second substrate, a radio-frequency integrated circuit (RFIC), a front-end integrated circuit (FEIC), and a flexible substrate. The RFIC has at least a portion surrounded by a first core member and is configured to input or output a base signal and a first radio-frequency (RF) signal having a frequency higher than a frequency of the base signal. The FEIC has at least a portion surrounded by a second core member and is configured to input or output the first RF signal and a second RF signal having a power different from a power of the first RF signal. The flexible substrate is configured to connect the first and second substrates to each other, provide a transmission path for the first RF signal, and being more flexible than the first and second substrates.
    Type: Application
    Filed: July 24, 2020
    Publication date: May 13, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hak Gu KIM, Young Sik HUR, Yoo Sam NA, Won Gi KIM, Young Bal KIM, Soo Ki CHOI, Ho Kyung KANG, Young Kyoon IM, Seong Jong CHEON
  • Patent number: 10987089
    Abstract: Provided are an ultrasound imaging apparatus and method of generating an ultrasound image. The ultrasound imaging apparatus includes: a memory configured to store instructions; and at least one processor configured to execute the stored instructions to: generate, based on echo signals reflected from an object, a first image showing a tissue of the object and a second image showing a contrast medium injected into the object; generate a third image by removing at least a portion of the tissue from the second image based on the first image; and display the generated third image.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: April 27, 2021
    Assignee: SAMSUNG MEDISON CO., LTD.
    Inventors: Ho-kyung Kang, Jong-geun Park, Ki-won Sohn, Won-chul Bang
  • Patent number: 10976882
    Abstract: An electronic device according to various examples comprises: a housing, in an unfolded state, including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction and including at least one flexible portion; a touch screen display arranged between the first surface and the second surface of the housing, exposed through the first surface of the housing, and when viewed from above the first surface, including at least one flexible portion at a position corresponding to the flexible portion of the housing; and a pressure sensor arranged between the touch screen display and the second surface of the housing, and when viewed from above the first surface, including at least one flexible portion at a position corresponding to the flexible portion of the housing.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: April 13, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyungwan Park, Han-Vit Kang, Ho-Kyung Kang, Byeong-Cheol Kim, Jung Won Kim, Jeongsik Jeong, Kwang-Tai Kim, Hyungsup Byeon, Hyun-Ju Hong
  • Patent number: 10971825
    Abstract: An antenna module includes: an integrated circuit (IC) configured to generate a radio frequency (RF) signal; and a substrate including an antenna portion providing a first surface of the substrate, and a circuit pattern portion providing a second surface of the substrate. The antenna portion includes first antenna members configured to transmit the RF signal, cavities corresponding to the first antenna members, through vias respectively disposed in the cavities and respectively electrically connected to the first antenna members, and a plating member disposed in at least one cavity among the cavities. The circuit pattern portion includes a circuit pattern and an insulating layer forming, for each of the through vias, an electrical connection path to the IC.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: April 6, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ho Kyung Kang, ThomasA Kim
  • Patent number: 10957013
    Abstract: A method of synthesizing medical images includes acquiring image data of an object; generating first medical image frames of the object based on the image data; selecting, from among the first medical image frames, second medical image frames corresponding to points of time that have the same electrocardiogram (ECG) signal information of the object; generating a panoramic image by synthesizing the second medical image frames; and displaying the panoramic image on a display.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: March 23, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin-woo Yim, Ho-kyung Kang, Ki-won Sohn
  • Patent number: 10949637
    Abstract: Disclosed is an electronic device including a housing including a transparent cover including a first region and a second region adjacent to the first region, a touchscreen display interposed between the first region and a second surface of the housing and exposed through the first region, an opaque layer interposed between the second region of the transparent cover and the second surface and exposed through the second region, a fingerprint sensor interposed between the opaque layer and the second surface, and a pressure sensor interposed between the fingerprint sensor and the second surface and sensing a pressure of an external object against the opaque layer. The pressure sensor includes a first electrode substantially in parallel with the opaque layer, a second electrode spaced from the first electrode layer and extending substantially in parallel in the second direction, and a dielectric layer interposed between the first electrode and the second electrode.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: March 16, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ho Kyung Kang, Young Tae Jeong, Han Vit Kang, Byeong Cheol Kim, Jung Won Kim, Jeong Sik Jeong, Kwang Tai Kim, Hyung Sup Byeon, Hyun Ju Hong
  • Patent number: 10931000
    Abstract: An antenna module includes a first antenna unit including at least one first patch antenna pattern, at least one first feed via, and at least one first dielectric layer, a second antenna unit including at least one second patch antenna pattern, at least one second feed via, and at least one second dielectric layer, a first connection portion, a first rigid substrate electrically connecting the first connection portion to the first antenna unit and having a first surface on which the first antenna unit is disposed, a base connection portion, a flexible substrate having a first surface on which the first connection portion is disposed and a second surface on which the base connection portion is disposed, and an IC electrically connected to the flexible substrate through the second surface of the flexible substrate or the first rigid substrate.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: February 23, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ho Kyung Kang, Shin Haeng Heo, Hyung Ho Seo
  • Publication number: 20210044001
    Abstract: An antenna module includes a first antenna unit including at least one first patch antenna pattern, at least one first feed via, and at least one first dielectric layer, a second antenna unit including at least one second patch antenna pattern, at least one second feed via, and at least one second dielectric layer, a first connection portion, a first rigid substrate electrically connecting the first connection portion to the first antenna unit and having a first surface on which the first antenna unit is disposed, a base connection portion, a flexible substrate having a first surface on which the first connection portion is disposed and a second surface on which the base connection portion is disposed, and an IC electrically connected to the flexible substrate through the second surface of the flexible substrate or the first rigid substrate.
    Type: Application
    Filed: January 14, 2020
    Publication date: February 11, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ho Kyung KANG, Shin Haeng HEO, Hyung Ho SEO
  • Publication number: 20200403321
    Abstract: An antenna module includes: an integrated circuit (IC) package including an IC, first and second antenna parts including first and second patch antenna patterns, first and second feed vias, and first and second dielectric layers, respectively; a connection member having a laminated structure having a first surface on which the first and second antenna parts are disposed, and a second surface, on which the IC package is disposed, the connection member further including an electrical connection path between the IC and the first and second feed vias. The connection member has a first region and a second region that is more flexible than the first dielectric layer. The first and second antenna parts are disposed on the first and second regions, respectively. Either one or both of the first and second antenna parts further includes a connection structure having a lower melting point than the first or second feed via.
    Type: Application
    Filed: October 22, 2019
    Publication date: December 24, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ho Kyung KANG, Gil Ha LEE, Shin Haeng HEO, Hyung Ho SEO, Hong Cheol KIM
  • Patent number: 10842466
    Abstract: Provided is an ultrasound apparatus including a first display configured to display an ultrasound image; a control panel including a second display that is different from the first display and configured to display a plurality of control items related to the ultrasound image; and a controller configured to select at least one control item from among the plurality of control items based on a location of an input tool located on the second display, and to control the first display to display the selected at least one control item and an indicator representing the location of the input tool together with the ultrasound image.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: November 24, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ho-kyung Kang, Jin-woo Yim, Ki-won Sohn
  • Publication number: 20200335851
    Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.
    Type: Application
    Filed: June 30, 2020
    Publication date: October 22, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong In KIM, Thomas A. KIM, Ho Kyung KANG
  • Patent number: 10809835
    Abstract: An electronic device according to an embodiment of the present invention comprises: a housing that comprises a first surface which faces a first direction and a second surface which faces a second direction opposite to the first direction, and that comprises a first transparent plate which forms at least a portion of the first surface of the housing; a display that is disposed between the first transparent plate and the second face of the housing, and comprises a second transparent plate which faces the first direction, and a third transparent plate which faces the second direction; a first electrode, a second electrode, a third electrode, and a fourth electrode that are disposed between the second transparent plate and the third transparent plate; and a control circuit that is electrically connected to the first electrode, the second electrode, the third electrode, and the fourth electrode, wherein the control circuit may be configured to detect the position of touch input with respect to the first transpare
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: October 20, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyung-Sup Byeon, Jung-Won Kim, Han-Vit Kang, Ho-Kyung Kang, Kwang-Tai Kim, Byeong-Cheol Kim, Kyung-Wan Park, Yo-Han Lee, Jeong-Sik Jeong, Eun-Sung Cho, Hyun-Ju Hong
  • Patent number: 10782817
    Abstract: According to one or more embodiments, an electronic device includes a housing including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction, where a transparent cover forms at least one part of the first surface. The electronic device also includes a touch screen display disposed between the first surface and second surface of the housing and exposed through the transparent cover, a pressure sensor disposed between the touch screen display and the second surface of the housing, and having an active area for sensing pressure placed on the first surface by an external object and an inactive area disposed around the active area, a Printed Circuit Board (PCB) disposed between the pressure sensor and the second surface of the housing, and an electrically conductive connection member for electrically connecting the pressure sensor and the PCB.
    Type: Grant
    Filed: August 9, 2017
    Date of Patent: September 22, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Han-Vit Kang, Ho-Kyung Kang, Byeong-Cheol Kim, Jung Won Kim, Kyungwan Park, Jeongsik Jeong, Kwang-Tai Kim, Hyungsup Byeon, Hyun-Ju Hong
  • Patent number: 10784564
    Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: September 22, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong In Kim, Thomas A. Kim, Ho Kyung Kang
  • Patent number: 10707556
    Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: July 7, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong In Kim, Thomas A. Kim, Ho Kyung Kang
  • Publication number: 20200091585
    Abstract: An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.
    Type: Application
    Filed: November 25, 2019
    Publication date: March 19, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong In KIM, Thomas A. KIM, Ho Kyung KANG