Abstract: A method for abating effluent from an electronic device manufacturing process is provided, including abating the effluent in a thermal abatement tool to form abated effluent; determining whether the abated effluent contains one or more chemical species of interest; and changing one or more operating parameters of the thermal abatement tool based upon the determination. Numerous other embodiments are provided.

Abstract: A cable structure includes a conductor, a shielding layer wrapping the conductor, a knit layer surrounding the shielding layer, an absorbing layer enclosing the knit layer and made of efficient absorbing materials, and an insulating layer bounding round the absorbing layer. In use, the shielding layer and the knit layer shield electromagnetic waves produced by the conductor from diffusing outward and further shield outside electromagnetic waves from diffusing inward. The absorbing layer is capable of absorbing the electromagnetic waves which fail to be shielded by the shielding layer and the knit layer.

Abstract: A flame sensor apparatus for use with a flame heated thermal abatement reactor is provided, including a flame sensor adapted to sense a flame within the thermal abatement reactor; and a shutter adapted to selectively block the transmission of radiation from the flame to the flame sensor.

Abstract: The present invention relates to systems and methods for controlled combustion and decomposition of gaseous pollutants while reducing deposition of unwanted reaction products from within the treatment systems. The systems include a novel thermal reaction chamber design having stacked reticulated ceramic rings through which fluid, e.g., gases, may be directed to form a boundary layer along the interior wall of the thermal reaction chamber, thereby reducing particulate matter buildup thereon. The systems further include the introduction of fluids from the center pilot jet to alter the aerodynamics of the interior of the thermal reaction chamber.

Abstract: The present invention relates to systems and methods for controlled combustion and decomposition of gaseous pollutants while reducing deposition of unwanted reaction products from within the treatment systems. The systems include a novel thermal reaction chamber design having stacked reticulated ceramic rings through which fluid, e.g., gases, may be directed to form a boundary layer along the interior wall of the thermal reaction chamber, thereby reducing particulate matter buildup thereon. The systems further include the introduction of fluids from the center pilot jet to alter the aerodynamics of the interior of the thermal reaction chamber.

Abstract: The present invention relates to a thermal reactor apparatus used to treat industrial effluent fluids, for example waste effluent produced in semiconductor and liquid crystal display manufacturing processes. Specifically, the present invention relates to improved monitoring and control features for the thermal reactor apparatus, including a flame sensing device, an intrinsically safe flammable gas sensing device, and a sequential mode of operation having built-in safety redundancy. The improved monitoring and control features ensure the safe and efficient abatement of waste effluent within the thermal reactor apparatus.

Abstract: A method for abating effluent from an electronic device manufacturing process is provided, including abating the effluent in a thermal abatement tool to form abated effluent; determining whether the abated effluent contains one or more chemical species of interest; and changing one or more operating parameters of the thermal abatement tool based upon the determination. Numerous other embodiments are provided.

Abstract: A flame sensor apparatus for use with a flame heated thermal abatement reactor is provided, including a flame sensor adapted to sense a flame within the thermal abatement reactor; and a shutter adapted to selectively block the transmission of radiation from the flame to the flame sensor.

Abstract: An apparatus that includes a rotatable single wafer holding bracket with one or more wafer supports disposed on the single wafer holding bracket, wherein the one or more wafer supports position a center of a wafer to be off-center from an axis of rotation of the single wafer holding bracket.

Abstract: A single wafer cleaning chamber that includes a rotatable bracket that can place a wafer beneath an upper end of a catch cup during a wafer cleaning process, a gutter positioned above a wafer transfer slit; where the catch cup can mate with the gutter to create a gap, and with the upper end of the catch cup positioned at a height equal to or higher than the gutter.

Abstract: An apparatus that includes a rotatable single wafer holding bracket with one or more wafer supports disposed on the single wafer holding bracket, wherein the one or more wafer supports position a center of a wafer to be off-center from an axis of rotation of the single wafer holding bracket.

Abstract: A single wafer cleaning chamber that includes a rotatable bracket that can place a wafer beneath an upper end of a catch cup during a wafer cleaning process, a gutter positioned above a wafer transfer slit; where the catch cup can mate with the gutter to create a gap, and with the upper end of the catch cup positioned at a height equal to or higher than the gutter.