Abstract: The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a package electrode pattern formed in their order on the lower metal layer. The LED package also includes a spacer having a cavity, formed on the electrode pattern. The LED package further includes an LED mounted in the cavity by flip-chip bonding to the electrode patterns, and an optical element attached to the upper surface of the spacer.

Abstract: An ice dispenser and a refrigerator having the ice dispenser. The ice dispenser includes a spiral conveying unit to convey the ice cubes to the outlet of the ice bucket while rotating, and a rotating blade unit rotatably equipped at the other side within the ice bucket to fluctuate the ice cubes located at a side of the spiral conveying unit, such that the ice cubes located far from the spiral conveying unit are moved. Thus, agglomeration of the ice cubes in the ice bucket which has an increased width can be prevented.

Abstract: There are provided an LED package using a Si substrate and a fabricating method of the LED package. In the LED package, a supporting structure includes a Si substrate and an insulating layer formed on top and bottom surfaces of the Si substrate, and the supporting structure defines at least one groove in a bottom surface by partially removing the Si substrate and the insulating layer. A plurality of upper electrodes is formed on a top surface of the supporting structure. At least one LED is mounted on the top surface of the supporting structure, and the LED includes both terminals electrically connected to the upper electrodes. A metal filler is filled in the groove defined in the bottom surface of the supporting structure.

Abstract: The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a package electrode pattern formed in their order on the lower metal layer. The LED package also includes a spacer having a cavity, formed on the electrode pattern. The LED package further includes an LED mounted in the cavity by flip-chip bonding to the electrode patterns, and an optical element attached to the upper surface of the spacer.

Abstract: The present invention provides an LED package having an MEMS switch operated by electrostatic force, capable of continuously protecting an LED from excessive current due to electrostatic discharge. The invention includes a submount with first and second electrode patterns formed thereon; an LED mounted on the submount, having an n-electrode electrically connected to the first electrode pattern and a p-electrode electrically connected to the second electrode pattern; and an MEMS switch including a first conductive plate and a second conductive plate bent to have an area over and vertically apart from the first conductive plate, wherein the first and second conductive plates are electrically connected to the first and second electrode patterns, and the second conductive plate comes in contact with the first conductive plate by electrostatic force upon being applied with voltage higher than a predetermined level of voltage.

Abstract: The invention relates to a flip-chip nitride semiconductor LED. In the LED, a light emitting structure has first and second conductivity type nitride semiconductor layers and an active layer interposed therebetween. Each of plurality of first and second electrodes has a bonding pad placed adjacent to a top corner of the light emitting structure and at least one electrode finger extended from the bonding pad. The first and second electrodes are connected to the first and second conductivity type nitride semiconductor layers, respectively. Also, bonding pads are arranged alternately along edges of the light emitting structure with different polarity, in a substantially symmetric configuration with respect to the center of the light emitting structure. In addition, each of electrode fingers is extended from a corresponding pad and bent at least once toward the center of the light emitting structure to adjoin the electrode finger having different polarity.

Abstract: The present invention relates to an LED package including photo diode. The LED package includes a silicon substrate, and a photo diode is formed in an upper part thereof. Also, an insulation layer is formed on the silicon substrate excluding at least a light-receiving area of the photodiode. In the LED package, an LED terminal is formed on the insulation layer to be connected to the photo diode. First and second LED connecting pads are formed on the insulation layer, and arranged on both sides of the photo diode. In addition, an LED chip is mounted on the silicon substrate, and connected to the first and second LED connecting pads.

Abstract: The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer.

Abstract: A platform-independent system and method for remotely controlling home devices and a computer-readable recording medium in which a program capable of executing the method is recorded are disclosed. The method includes installing a device control application to be used for the management of a home device when the home device is connected to the home network system, bring state information of the home device through the installed device control application, controlling a specified home device from an outside, receiving a report of an event occurring in the home device, and using a SOAP so that the above operations are performed irrespective of the middleware of a home gateway. Accordingly, the home devices connected to the home network through the home gateway can be controlled from the outside irrespective of the middleware supported by the home gateway.

Abstract: There is provided a spanner comprising: a head portion fastening and loosening an object: a pair of slide pieces symmetrically positioned inside the head portion in a wedge shape, each slide piece being coupled to the head portion to be externally slidable between the head portion and the object; and a coil spring disposed between an inner bottom surface of the head portion and one end of each slide piece opposed to the inner bottom surface, the coil spring elastically supporting each slide piece so as to elastically bias the slide piece in a direction opposite to an opening direction of the head portion. Because the spanner having the above-mentioned construction is provided with the slidable slide piece, it is possible to continuously fasten and loosen a bolt without pulling out the spanner even in a small space.

Abstract: A refrigerator including improved shelves that are capable of being rapidly assembled and disassembled and providing an aesthetically beautiful appearance. To both sides of each shelf are attached a pair of supporting members. To both sides of a storage compartment are attached a pair of frames. Each supporting member includes a first fixing protrusion and a second fixing protrusion, which are inserted through a first fixing hole and a second fixing hole formed at each frame, respectively. The first fixing protrusion includes an insertion part extended from the upper end of the supporting member, the insertion part being inserted through the first fixing hole, and a hooking part extended downward from the insertion part, the hooking part being caught in the first fixing hole. To the first and second fixing protrusions is attached a reinforcing member for increasing the supporting strength of the supporting member.

Abstract: The present invention relates to a mobile phone, which allows a user to input a phone number by simply moving the body of the mobile phone without manipulating the buttons of a key pad, thus providing the user with convenience.

Abstract: Disclosed is an accelerometer capable of compensating initial capacitance. In the accelerometer, support beams are extended from a beam-fixing section to elastically support both ends of a horizontally movable floating mass. Movable electrodes are extended outward from both sides of the mass to a predetermined length. Fixed electrodes are extended from electrode-fixing sections to a predetermined length, and alternate with the movable electrodes with a predetermined gap. Compensation electrode sections displace the mass in a moving direction of the mass to equalize an initial capacitance between the movable and fixed electrodes at one side with that between the movable and fixed electrodes at the other side. The invention can simply displace the mass compensation electrodes to equalize initial capacitances at the both ends.

Abstract: Disclosed is a capacitance accelerometer comprising a fixed electrode, a movable electrode and support beams. The fixed electrode has rectangular fixed electrode plates arranged parallel with a top surface of an insulation board. The fixed electrode plates are placed one above another via posts, and arranged on an electrode-fixing section of the insulation board. The movable electrode has rectangular movable electrode plates alternating with the fixed electrode plates. The movable electrode plates are placed one above another via connector posts placed within guide holes perforated through the fixed electrode plates. The support beams connect the movable electrode with beam-fixing sections to elastically support the movable electrode. The capacitance z-axis accelerometer can be integrated together with x- and y-axis accelerometers into a single chip, maximize the change of capacitance to achieve excellent acceleration sensitivity, and utilize an amplifier and a filter of low cost.

Abstract: The present invention relates to a novel fungus of Metarhizium genus and a method for controlling soil pests using the same, more particularly to a novel Metarhizium anisopliae HY-2 and a microbial insecticide comprising the same and a method for controlling soil pests using the same. The Metarhizium anisopliae HY-2 can effectively be used to control the soil pests such as Scarabaeidae.

Abstract: The present invention relates to a paecilomyces genus microorganism and microbial Mixing insecticide for controlling the soil pests using the same, more particularly to a paecilomyces genus microorganism having insecticidal activity to soil pests and a microbial insecticide for controlling the soil pests containing the same. Since the microbial insecticide of the present invention shows excellent insecticidal activity to harmful soil pests, it can effectively be used as a environment-compatible insecticide to prevent the soil pests from farmland crops.