Abstract: A gate in a semiconductor device is formed to have a dummy gate pattern that protects a gate. Metal lines are formed to supply power for a semiconductor device and transfer a signal. A semiconductor device includes a quad coupled receiver type input/output buffer. The semiconductor device is formed with a gate line that extends over an active region, and a gate pad located outside of the active region. The gate line and the gate pad are adjoined such that the gate line and a side of the gate pad form a line. Dummy gates may also be applied. The semiconductor device includes a first metal line patterns supplying power to a block having a plurality of cells, a second metal line pattern transferring a signal to the cells, and dummy metal line patterns divided into in a longitudinal direction.

Abstract: A gate in a semiconductor device is formed to have a dummy gate pattern that protects a gate. Metal lines are formed to supply power for a semiconductor device and transfer a signal. A semiconductor device includes a quad coupled receiver type input/output buffer. The semiconductor device is formed with a gate line that extends over an active region, and a gate pad located outside of the active region. The gate line and the gate pad are adjoined such that the gate line and a side of the gate pad form a line. Dummy gates may also be applied. The semiconductor device includes a first metal line patterns supplying power to a block having a plurality of cells, a second metal line pattern transferring a signal to the cells, and dummy metal line patterns divided into in a longitudinal direction.

Abstract: A gate in a semiconductor device is formed to have a dummy gate pattern that protects a gate. Metal lines are formed to supply power for a semiconductor device and transfer a signal. A semiconductor device includes a quad coupled receiver type input/output buffer. The semiconductor device is formed with a gate line that extends over an active region, and a gate pad located outside of the active region. The gate line and the gate pad are adjoined such that the gate line and a side of the gate pad form a line. Dummy gates may also be applied. The semiconductor device includes a first metal line patterns supplying power to a block having a plurality of cells, a second metal line pattern transferring a signal to the cells, and dummy metal line patterns divided into in a longitudinal direction.

Abstract: An integrated circuit memory interface device includes a debug controller for generating debug control signals in response to memory access control signals, and individual address and data boundary-scan registers. Each of the address and data boundary-scan registers has a predetermined number of cells which are daisy-chained from cell to cell. The address and data registers are placed between a memory device and a core logic which performs normal interface operations with respect to the devices during a normal mode. The interface device includes a test access port (TAP) controller which operates in synchronism with a test clock signal during test and debugging modes, and an instruction register. The TAP controller receives a test mode select signal and generates register control signals in response to the test clock and mode select signals.

Abstract: The present invention provides a test method of SOA (Single-Order Addressed) memory utilizing address data backgrounds applied to memory circuits. A memory test operation is performed using a total of (log.sub.2 N+1) address data backgrounds on an SOA memory having N mutually different addresses. Each address data background is written and read, then the inversion is written and read. Finally the address data background is again written and read for a total of 6 N(log.sub.2 N+1) operations.