Abstract: A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and internal electrodes alternately disposed in a first direction, and a cover portion disposed on both surfaces of the capacitance formation portion opposing each other in the first direction; and an external electrode disposed on the body and connected to the internal electrode, wherein the cover portion includes polydopamine.

Abstract: A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and an internal electrode alternately disposed in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion opposing each other in the first direction, and an external electrode disposed on the outside of the body and connected to the internal electrode. The cover portion has a first region, adjacent to the capacitance formation portion, and a second region, adjacent to the outside of the cover portion. A content of fluorine (F) included in the second region is greater than a content of fluorine (F) included in the first region.

Abstract: A multilayer electronic component includes a body including a capacitance formation portion including a dielectric layer and an internal electrode, alternately disposed in a first direction, and a cover portion disposed on both end surfaces of the capacitance formation portion opposing each other in the first direction; and an external electrode disposed outside the body and connected to the internal electrode, wherein the cover portion contains fluorine (F), and A1 and A2 satisfy A2>A1, where A1 is an average size of a dielectric grain included in the cover portion, and A2 is an average size of a dielectric grain included in the dielectric layer.

Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and a cover portion disposed on end surfaces of the capacitance forming portion; and an external electrode disposed on the body, wherein a ratio of an average content of zirconium (Zr) included in the capacitance forming portion to an average content of zirconium (Zr) included in the cover portion satisfies 0.55 or more and 1.00 or less, wherein an average content of zirconium (Zr) included in the capacitance forming portion satisfies 1073 ppm or more and 1950 ppm or less, and wherein an average size of the dielectric grains included in a central region of the capacitance forming portion is 200 nm or more and 300 nm or less, and a standard deviation for a size is 100 nm or more and 130 nm or less.

Abstract: A film for manufacturing an electronic component includes a polymer layer and conductive nanowires and magnetic nanoparticles dispersed in the polymer layer.

Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes stacked in a first direction, and external electrodes, wherein the body includes an active portion, a side margin portion covering at least one of a first surface and a second surface of the active portion opposing each other in a second direction, and a cover portion covering the active portion in the first direction, respective dielectric layers among the plurality of dielectric layers include a barium titanate-based composition, the dielectric layer of the side margin portion includes Sn, and a content of Sn in the dielectric layer of the side margin portion is different from that of Sn in the dielectric layer of the active portion, and the dielectric layer of the side margin portion includes at least some grains having a core-shell structure.

Abstract: A method of manufacturing a dielectric slurry, includes supplying a dielectric slurry including dielectric particles and a solvent to a slurry supply module, dispersing the dielectric slurry by inserting the dielectric slurry into a particle dispersing module, classifying the dielectric particles according to particle size by inserting the dispersed dielectric slurry into a classifying module, recovering at least a portion of the dielectric particles to the slurry supply module, and redispersing the dielectric slurry including the dielectric particles recovered to the slurry supply module to the particle dispersing module.

Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes. The internal electrodes are exposed to fifth and sixth surfaces of the body, and first ends thereof are respectively exposed to third or fourth surfaces of the body. First and second side margin portions are respectively disposed on the fifth and sixth surfaces. The body includes an active portion, and upper and lower cover portions disposed respectively on a first surface and a second surface of the active portion in a first direction. The ratio of a dimension of the lower cover portion in the first direction C to a dimension of the first side margin portion in the third direction A, C/A?2.6, C/T is 0.080, where T is a dimension of the body in the first direction, and D<C where D is the dimension of the body in the first direction.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including an active portion having dielectric layers and first and second internal electrodes and first and second cover portions disposed on opposite surfaces of the active portion in a stacking direction, respectively; wherein when a region of the cover portion in contact with the first or second internal electrode is an inner region of the cover portion and a region of the active portion in contact with the inner region of the cover portion is an outer region of the active portion, 1.00<XA/XB?1.04 in which XA/XB is a ratio of a molar ratio (XA) of barium (Ba) to titanium (Ti) in the inner region of the cover portion to a molar ratio (XB) of barium (Ba) to titanium (Ti) in the outer region of the active portion.

Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes. The internal electrodes are exposed to fifth and sixth surfaces of the body, and first ends thereof are respectively exposed to third or fourth surfaces of the body. First and second side margin portions are respectively disposed on the fifth and sixth surfaces. The body includes an active portion, and upper and lower cover portions disposed respectively on a first surface and a second surface of the active portion in a first direction. The ratio of a dimension of the lower cover portion in the first direction C to a dimension of the first side margin portion in the third direction A, C/A?2.6, C/T is 0.080, where T is a dimension of the body in the first direction, and D<C where D is the dimension of the body in the first direction.

Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes stacked in a first direction, and external electrodes, wherein the body includes an active portion, a side margin portion covering at least one of a first surface and a second surface of the active portion opposing each other in a second direction, and a cover portion covering the active portion in the first direction, respective dielectric layers among the plurality of dielectric layers include a barium titanate-based composition, the dielectric layer of the side margin portion includes Sn, and a content of Sn in the dielectric layer of the side margin portion is different from that of Sn in the dielectric layer of the active portion, and the dielectric layer of the side margin portion includes at least some grains having a core-shell structure.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including an active portion having dielectric layers and first and second internal electrodes and first and second cover portions disposed on opposite surfaces of the active portion in a stacking direction, respectively; wherein when a region of the cover portion in contact with the first or second internal electrode is an inner region of the cover portion and a region of the active portion in contact with the inner region of the cover portion is an outer region of the active portion, 1.00<XA/XB<1.04 in which XA/XB is a ratio of a molar ratio (XA) of barium (Ba) to titanium (Ti) in the inner region of the cover portion to a molar ratio (XB) of barium (Ba) to titanium (Ti) in the outer region of the active portion.

Abstract: A multilayer capacitor includes a capacitor body including first and second internal electrodes alternately stacked with dielectric layers interposed therebetween. The first and second internal electrodes are exposed at a mounting surface of the capacitor body. The capacitor body includes first and second groove parts at the mounting surface, spaced apart in a length direction of the capacitor body, and contacting exposed portions of the first and second internal electrodes, respectively. The multilayer capacitor includes first and second external electrodes in the first and second groove parts, respectively, and electrically connected to the exposed portions of the first and second internal electrodes, respectively.

Abstract: A multilayer capacitor includes a capacitor body having an active region and cover layers disposed on upper and lower surfaces of the active region. The active region includes a plurality of dielectric layers and first and second internal electrodes alternately disposed with the plurality of dielectric layers interposed therebetween. The first and second internal electrodes are respectively exposed to opposite surfaces of the capacitor body. First and second external electrodes electrically are connected to the exposed portions of the first and second internal electrodes on the capacitor body, respectively. A phosphor (P) is dispersed among a non-phosphor material in the cover layers of the capacitor body. In some examples, the phosphor (P) has a content of 1 to 2 wt %, based on a total weight of a ceramic powder of the cover layers not including the phosphor (P).

Abstract: A multilayer capacitor includes a capacitor body including first and second internal electrodes alternately stacked with dielectric layers interposed therebetween. The first and second internal electrodes are exposed at a mounting surface of the capacitor body. The capacitor body includes first and second groove parts at the mounting surface, spaced apart in a length direction of the capacitor body, and contacting exposed portions of the first and second internal electrodes, respectively. The multilayer capacitor includes first and second external electrodes in the first and second groove parts, respectively, and electrically connected to the exposed portions of the first and second internal electrodes, respectively.

Abstract: A ceramic composition includes a ceramic powder and a phosphor (P). The phosphor (P) has a content of 1 to 2 wt %, based on a total weight of the ceramic powder not including the phosphor (P).

Abstract: The present invention relates to a method for manufacturing tempered glass and, more specifically, to a method for manufacturing alkali-free glass which has the thickness of 2.0 mm or less into tempered glass by means of heat treatment and surface treatment using fluosilicic acid. To this end, the present invention provides a method for manufacturing tempered glass, the method comprising: a preparation step for preparing alkali-free glass; a surface treatment step for surface-treating the alkali-free glass by means of a surface treatment solution comprising fluosilicic acid and thereby generating on the surface of the alkali-free glass a porous SiO2-rich layer of which the coefficient of thermal expansion (CTE) is smaller than the CTE of the inner part of the alkali-free glass; and a heat treatment step for heat-treating the alkali-free glass that has been surface-treated and thereby generating compressive stress on the surface of the alkali-free glass.

Abstract: The present invention relates to a method for manufacturing chemically strengthened glass and, more specifically, to a method for manufacturing chemically strengthened glass that can enhance the strength of glass. To this end, the present invention provides a method of manufacturing chemically strengthened glass comprising: a primary chemical strengthening step for chemically strengthening a mother glass; a cutting step for cutting the chemically strengthened mother glass into a predetermined size; a paste applying step for applying paste to a cutting plane formed by the cutting step; and a secondary chemical strengthening step for chemically strengthening only the cutting plane by heating the paste, wherein the paste includes alkaline ions having a larger ionic radius than those included in the mother glass.

Abstract: A method of cutting chemically toughened glass which is chemically toughened in a chemical toughening process of creating compressive stress in the surface of glass by exchanging first alkali ions in the glass with second alkali ions. The method includes the steps of applying a paste on a portion of the chemically toughened glass that is to be cut, heating the paste, and cutting the chemically toughened glass along the portion on which the paste is applied. The paste contains alkali ions. The ion radius of the alkali ions in the paste is smaller than an ion radius of the second alkali ions which substitute the first ions in the chemical toughening process.

Abstract: A method of cutting chemically toughened glass which is chemically toughened in a chemical toughening process of creating compressive stress in the surface of glass by exchanging first alkali ions in the glass with second alkali ions. The method includes the steps of applying a paste on a portion of the chemically toughened glass that is to be cut, heating the paste, and cutting the chemically toughened glass along the portion on which the paste is applied. The paste contains alkali ions. The ion radius of the alkali ions in the paste is smaller than an ion radius of the second alkali ions which substitute the first ions in the chemical toughening process.