Patents by Inventor Ho Seng

Ho Seng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060084240
    Abstract: Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.
    Type: Application
    Filed: November 17, 2005
    Publication date: April 20, 2006
    Inventors: Chia Poo, Boon Jeung, Low Waf, Chan Yu, Neo Loo, Eng Koon, Ser Leng, Chua Kwang, So Chung, Ho Seng
  • Publication number: 20050268763
    Abstract: Improperly mounted wafer saw blades can damage wafers cut or diced with the blades. Embodiments of this invention employ sensors to measure a distance to the blade to help indicate if the blade is improperly mounted. In one method of the invention, a the distance to the blade face is measured as the blade is rotated and a variance in this measured distance is determined. If the variance is no greater than a predetermined maximum, the blade may be used to cut the wafer. In one apparatus of the invention, a wafer saw include a blade and a sensor. The sensor is adapted to monitor a distance to a face of the rotating blade. A processor coupled to the sensor may indicate if the distance to the face of the blade as it rotates deviates too far from a baseline position of the blade face.
    Type: Application
    Filed: July 28, 2005
    Publication date: December 8, 2005
    Inventors: Neo Peng, Tan Chuan, Ho Seng, Chew Chye, Lim Har, Tan Chua
  • Publication number: 20050029668
    Abstract: Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each edge contact is connected to one bond pad of each die adjacent the saw street. The edge contact is divided into contacts for each adjacent die when the dies are separated. In an embodiment, a recess is formed in the saw street. In an embodiment, the recess is formed by scribing the saw street with a mechanical cutter. The recess is patterned and contact material is deposited to form the edge contacts.
    Type: Application
    Filed: August 30, 2004
    Publication date: February 10, 2005
    Inventors: Chia Poo, Boon Jeung, Low Waf, Chan Yu, Neo Loo, Eng Koon, Ser Leng, Chua Kwang, So Chung, Ho Seng