Abstract: Disclosed herein is a method of printing a nanostructure including: preparing a template substrate on which a pattern is formed; forming a replica pattern having an inverse phase of the pattern by coating a polymer thin film on an upper portion of the template substrate, adhering a thermal release tape to an upper portion of the polymer thin film, and separating the polymer thin film from the template substrate; forming a nanostructure by depositing a functional material on the replica pattern; and printing the nanostructure deposited on the replica pattern to a substrate by positioning the nanostructure on the substrate, applying heat and pressure to the nanostructure, and weakening an adhesive force between the thermal release tape and the replica pattern by the heat.

Abstract: Provided is a skateboard. The skateboard includes front and rear boards each including a foot placing unit, a directional caster including at least two connectors respectively disposed on bottom surfaces of the front and rear boards at a predetermined distance, rotating arms rotatably coupled to the connectors respectively, and wheels respectively supported by the rotating arms and rollingly contacting the ground, and a connection unit having both ends axial-rotatably and pivotally connected to one sides of the front and rear boards.

Abstract: A plasma display panel is disclosed, which includes a first panel provided with an address electrode, a first dielectric, and a phosphor on a first substrate, and a second panel bonded to the first panel by interposing a barrier therebetween, including a transparent electrode, a bus electrode, a second dielectric provided with high dielectric particles, and a protective layer on a second substrate.

Abstract: An anisotropic conductive adhesive material and a display panel unit having the same is disclosed. The anisotropic conductive adhesive material may comprise a binder; and a conductive filler which is uniformly distributed inside the binder and is not distorted by thermal adhesion. Accordingly, the conductive filler may be uniformly distributed, thereby enhancing an electric contact quality between an electrode of a glass substrate and an FPC and reducing contact resistance.