Abstract: Provided is a snap fit heatsink lug configured to be fixed without soldering, and in case of soldering, configured to be soldered without swell or distortion. The snap fit heatsink lug includes a lug base where a heatsink is configured to be mounted on a top thereof, and a lug fixator provided at two ends of the lug base to fix the lug base to a printed circuit board, wherein the lug fixator includes a lug fixator base and a fixing pin which protrudes downward from a bottom of the lug fixator base and is inserted into the printed circuit board, the fixing pin includes a first fixing pin and a second fixing pin, and at least one of the first fixing pin or the second fixing pin has a stopper at an exposed location below the printed circuit board when inserted into the printed circuit board.