Abstract: In some embodiments, a memory system includes a memory device and a host configured to transmit, to the memory device, a command and address (C/A) signal and a clock signal, and to transmit or receive data signals to or from the memory device. Each command that is configured to access the memory device is associated with an access timing parameter. The memory device includes an access parameter timer configured to measure an actual timing value of the access timing parameter, a spec register configured to provide a spec timing value defining an effective timing of the access timing parameter, a comparison circuit configured to compare the actual timing value and the spec timing value, and a mode register configured to store an access timing violation flag that is read by the host when the actual timing value deviates from the spec timing value by exceeding a predetermined range.

Abstract: Disclosed is a substrate treating apparatus including a coating module, an exposure module, a plurality of developing modules, and a transfer unit that performs transfer of a substrate between the modules. The plurality of developing modules include a plurality of post-exposure bake units that perform a bake process on a substrate on which an exposure process is completely performed in the exposure module. The substrate treating apparatus further includes a controller that controls the transfer of the substrate by the transfer unit. When transferring a substrate from the exposure module to the plurality of post-exposure bake units, the controller performs control to select a post-exposure bake unit in which the least delay time occurs, among the plurality of post-exposure bake units and to transfer the substrate to the selected post-exposure bake unit.

Abstract: Provided is a method of a substrate treatment. The method includes providing an operation module with substrates contained in a lot and performing an operation treatment thereon and performing a test treatment on the substrates completed with the operation treatment in a test module. The performing of the test treatment includes determining a substrate to be tested, which is provided to the test module, to allow the test treatment to be completed within an operation treatment time for the substrates in a unit lot.

Abstract: Provided is a method of a substrate treatment. The method includes providing an operation module with substrates contained in a lot and performing an operation treatment thereon and performing a test treatment on the substrates completed with the operation treatment in a test module. The performing of the test treatment includes determining a substrate to be tested, which is provided to the test module, to allow the test treatment to be completed within an operation treatment time for the substrates in a unit lot.