Patents by Inventor Ho-Sik Park

Ho-Sik Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136697
    Abstract: The present invention relates to a mounting apparatus for an antenna device and, specifically, comprises: a horizontal mounting panel coupled to the bottom surface of an antenna device; and an antenna installation unit on which the horizontal mounting panel is coupled and in which a hollow cable installation space is provided, wherein the antenna device enable left-right steering adjustment and up-down tilting adjustment by means of the horizontal mounting panel, and thus installation convenience and regulatory standards can be satisfied.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Hee KIM, Min Sik PARK, Kyo Sung JI, Chi Back RYU, In Ho KIM
  • Publication number: 20240131178
    Abstract: The present disclosure relates to a novel antibody-drug conjugate (ADC) targeting claudin 18 isoform 2 (CLDN18.2), an active metabolite of the ADC, a method of producing the ADC, use of the ADC for the treatment and/or prevention of diseases, and use of the ADC for producing a drug for the treatment and/or prevention of diseases, more specifically hyperproliferative and/or angiogenic diseases, for example, cancer, and more particularly, to an antibody-drug conjugate including a novel antibody or antigen-binding fragment thereof that binds to CLDN18.2, and a pharmaceutical composition including the same.
    Type: Application
    Filed: March 30, 2022
    Publication date: April 25, 2024
    Applicants: LEGOCHEM BIOSCIENCES, INC., NONA BIOSCIENCES (SUZHOU) CO., LTD.
    Inventors: Chang Sik PARK, Ho Young SONG, Tae Ik JANG, Chul-Woong CHUNG, Ming-jin JHENG
  • Publication number: 20240136707
    Abstract: The present invention relates to a mounting apparatus for an antenna device and, specifically, comprises: a horizontal mounting panel coupled to the bottom surface of an antenna device; and an antenna installation unit on which the horizontal mounting panel is coupled and in which a hollow cable installation space is provided, wherein the antenna device enable left-right steering adjustment and up-down tilting adjustment by means of the horizontal mounting panel, and thus installation convenience and regulatory standards can be satisfied.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 25, 2024
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Hee KIM, Min Sik PARK, Kyo Sung JI, Chi Back RYU, In Ho KIM
  • Publication number: 20240128631
    Abstract: The present invention relates to a mounting apparatus for an antenna device on a rooftop corner. In particular, the mounting apparatus is installed on a railing on a corner side of a rooftop, and includes: a floor support part which is disposed on the inner bottom surface of the railing of the roof top and has a part that extends upward in parallel to the railing; a pair of railing support parts extending horizontally from the upper portion of the floor support part toward the railing; and a mounting part which is coupled to the upper portion of the floor support part and has a top end on which an antenna device is mounted. Therefore, the present invention provides installation convenience and enables legal regulations to be met.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 18, 2024
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, In Ho KIM, Kyo Sung JI, Chi Back RYU, Hee KIM, Min Sik PARK
  • Publication number: 20240128630
    Abstract: The present invention relates to a support pole assembly for mounting an antenna and, particularly, to a support pole assembly for mounting an antenna, comprising: a support pole which is formed in a hollow structure and has an antenna device mounting hole formed at the circumferential surface thereof; an antenna device which is mounted to the support pole while passing through and covering the antenna device mounting hole and the rear portion of which is placed in the inner space of the support pole. Accordingly, the present invention provides an advantage in that the protrusion amount of the antenna device with respect to the support pole is reduced and thus the space required for mounting the antenna device can be reduced.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Chi Back RYU, Min Sik PARK, Kyo Sung JI, In Ho KIM, Sang Hyo KANG, Min Soo KIM, Hee KIM, Young Ji HONG
  • Publication number: 20240127722
    Abstract: A wireless communication device support assembly is disclosed, including a support pole comprising a hollow interior, a first frame having a polygonal shape disposed on top of the support pole, a plurality of wireless communication devices disposed inside the first frame, at least one or more rotational advertising apparatuses controllably elevated in a direction parallel to a longitudinal direction of the support pole, a drive unit configured to elevate or lower the rotational advertising apparatus, and a plurality of lift ropes having first ends connected with tops of the rotational advertising apparatuses and second ends connected with the drive unit.
    Type: Application
    Filed: December 25, 2023
    Publication date: April 18, 2024
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Chi Back RYU, Min Sik PARK, Kyo Sung JI, In Ho KIM, Sang Hyo KANG, Min Soo KIM, Hee KIM
  • Publication number: 20240120637
    Abstract: The present invention relates to a mounting apparatus for an antenna device on a support pole. Particularly, the apparatus comprises: a support clamp installed on a support pole; and a directivity adjustment part comprising a tilting means and a steering means, the tilting means, for two or more antenna devices coupled via the support clamp so as to be spaced apart in the vertical direction, tilting the two or more antenna devices at the same time or at different times in the front/rear direction via a left/right tilting axis, and the steering means steer-rotating the two or more antenna devices in the left/right direction with respect to a vertical axis, wherein, of the directivity adjustment part, the tilting means is provided so that tilt-rotation is manually adjusted by a worker or is automatically adjusted by a power supply, and thus the advantages of not only reducing costs but also easily adjusting the directivity of the antenna devices are provided.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, In Ho KIM, Kyo Sung JI, Chi Back RYU, Dae Myung PARK, Min Sik PARK
  • Publication number: 20240117211
    Abstract: A paint composition is prepared by mixing each of an acrylic resin, an acrylic polyol resin, a polycarbonate diol resin, a diisocyanate, a solvent, and an antibacterial agent in appropriate amounts. As a result, the paint composition has improved physical properties and effective antibacterial activities.
    Type: Application
    Filed: April 28, 2023
    Publication date: April 11, 2024
    Inventors: Hyun Jung Kim, Ho Tak Jeon, Jae Sik Seo, Ji Hwan Park, Dae Joung Cho
  • Patent number: 11940368
    Abstract: Disclosed is a method for pre-detecting a defective porous polymer substrate for a separator, including selecting a porous polymer substrate having a plurality of pores; observing the selected porous polymer substrate with a scanning electron microscope (SEM) to obtain an image of the porous polymer substrate; quantifying the average value of pore distribution index (PDI); correcting the quantified average value of pore distribution index to obtain the corrected average value of pore distribution index; determining whether or not the corrected average value of pore distribution index is 60 a.u. (arbitrary unit) or less; and classifying the porous polymer substrate as a good product, when the corrected average value of pore distribution index is determined to be 60 a.u. or less, and classifying the porous polymer substrate as a defective product, when the corrected average value of pore distribution index is determined to be larger than 60 a.u.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: March 26, 2024
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Won-Sik Bae, Joo-Sung Lee, Ho-Sung Kang, Yern-Seung Kim, Se-Jung Park, Je-Seob Park, Ji-Young Hwang
  • Publication number: 20240072428
    Abstract: The present disclosure in at least one embodiment provides a wireless communication device, comprising a lower case, an upper radome, coupled to the lower case, creating a storage space between the lower case and the upper radome, an antenna disposed in the storage space, and a plurality of internal substrates, disposed between the antenna and the lower case in the storage space, of which one of the plurality of internal substrates is connected to the antenna, wherein each internal substrate of the plurality of internal substrates is disposed along a first direction parallel to a surface of the lower case facing the plurality of internal substrates.
    Type: Application
    Filed: November 7, 2023
    Publication date: February 29, 2024
    Applicant: KMW INC.
    Inventors: Min Sik PARK, Jun Woo YANG, Bung Chul KIM, In Ho KIM
  • Patent number: 10779414
    Abstract: A printed circuit board and method thereof include an electronic component embedded in an insulation layer and comprising a connection terminal exposed on a surface of the insulation layer. The printed circuit board and method thereof also include a bump formed on the connection terminal of the electronic component and exposed on the surface of the insulation layer.
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: September 15, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ho-Sik Park, Dong-Keun Lee, Jae-Hoon Choi, Sang-Jae Lee, Sung-Taek Lim
  • Patent number: 10529476
    Abstract: A coil component includes a body having a coil part disposed in the body. The coil part may include: a first coil pattern formed on one surface of the insulating layer; and a second coil pattern including an external pattern formed on the other surface of the insulating layer. The second coil pattern may further include an embedded pattern embedded in the insulating layer and the external pattern may be disposed on the embedded pattern. The coil component can have improved low direct current resistance characteristics and inductance.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: January 7, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ho Sik Park, Sang Jae Lee, Youn Soo Seo, Yong Sam Lee, Hye Yeon Cha, Jae Ha Kim
  • Publication number: 20180158584
    Abstract: A coil component includes a body having a coil part disposed in the body. The coil part may include: a first coil pattern formed on one surface of the insulating layer; and a second coil pattern including an external pattern formed on the other surface of the insulating layer. The second coil pattern may further include an embedded pattern embedded in the insulating layer and the external pattern may be disposed on the embedded pattern. The coil component can have improved low direct current resistance characteristics and inductance.
    Type: Application
    Filed: July 31, 2017
    Publication date: June 7, 2018
    Inventors: Ho Sik PARK, Sang Jae LEE, Youn Soo SEO, Yong Sam LEE, Hye Yeon CHA, Jae Ha KIM
  • Publication number: 20180137975
    Abstract: A thin film-type inductor includes a body including a support member, a coil disposed. on at least one surface of the support member, and a filler embedding the support member on which the coil is disposed, and an external electrode disposed. on an external surface of the body. An insulating layer is not disposed on an edge portion of the support member and the edge portion is in direct contact with a filler. The insulating layer is only disposed on an upper surface of the coil to conform to a surface of the coil.
    Type: Application
    Filed: August 10, 2017
    Publication date: May 17, 2018
    Inventors: Il Ho CHA, Sang Jae LEE, Ho Sik PARK, Hye Hun PARK, Kwang Jik LEE, Hye Yeon CHA, Jae Ha KIM
  • Patent number: 9674944
    Abstract: A printed circuit board and a method of manufacturing the same are provided. A printed circuit board having conductive patterns formed in multilayers on an insulating material laminated on both surfaces of a glass core is provided. The printed circuit board includes a first insulating material disposed on a first surface and a second surface of the glass core. and a second insulating material disposed on the first insulating material. The first insulating material surrounds a first portion of a side surface of the glass core and the second insulating material surrounds a second portion of the side surface of the glass core, the second portion being a portion of the glass core not surrounded by the first insulating material.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: June 6, 2017
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Byung-Moon Kim, Ho-Sik Park, Dong-Keun Lee, Sung-Jun Lee
  • Publication number: 20170006700
    Abstract: A printed circuit board and a method of manufacturing the same are provided. A printed circuit board having conductive patterns formed in multilayers on an insulating material laminated on both surfaces of a glass core is provided. The printed circuit board includes a first insulating material disposed on a first surface and a second surface of the glass core. and a second insulating material disposed on the first insulating material. The first insulating material surrounds a first portion of a side surface of the glass core and the second insulating material surrounds a second portion of the side surface of the glass core, the second portion being a portion of the glass core not surrounded by the first insulating material.
    Type: Application
    Filed: May 18, 2016
    Publication date: January 5, 2017
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byung-Moon KIM, Ho-Sik PARK, Dong-Keun LEE, Sung-Jun LEE
  • Publication number: 20160219710
    Abstract: A printed circuit board and method thereof include an electronic component embedded in an insulation layer and comprising a connection terminal exposed on a surface of the insulation layer. The printed circuit board and method thereof also include a bump formed on the connection terminal of the electronic component and exposed on the surface of the insulation layer.
    Type: Application
    Filed: January 21, 2016
    Publication date: July 28, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ho-Sik PARK, Dong-Keun LEE, Jae-Hoon CHOI, Sang-Jae LEE, Sung-Taek LIM
  • Publication number: 20150351219
    Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a base substrate having a via hole for signal transfer and a via hole for heat radiation formed therein and having circuit layers formed on both surfaces thereof, the circuit layers including connection pads; a signal via formed in an inner portion of the via hole for signal transfer by performing a plating process using a conductive metal; and a heat radiation via formed in an inner portion of the via hole for heat radiation by performing a plating process using a conductive metal, wherein the heat radiation via is formed to have a diameter larger than that of the signal via.
    Type: Application
    Filed: July 28, 2015
    Publication date: December 3, 2015
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Gun Oh, Tae Kyun Bae, Ho Sik Park
  • Patent number: 8997340
    Abstract: A method of manufacturing an insulating sheet, the method including providing a reinforcement material having a thermoplastic resin layer stacked thereon; stacking the thermoplastic resin layer stacked on the reinforcement material over a core substrate; and hot pressing the reinforcement material and the thermoplastic resin layer onto the core substrate.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: April 7, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Keungjin Sohn, Nobuyuki Ikeguchi, Joung-Gul Ryu, Ho-Sik Park, Sang-Youp Lee, Joon-Sik Shin, Jung-Hwan Park
  • Publication number: 20140174793
    Abstract: Disclosed herein are a printed circuit board and a method for manfuacturing the same, the printed circuit board including: a base substrate having circuit patterns; and heat radiating vias having a donut shape, formed in the base substrate, so that the heat radiation efficiency may be improved by increasing the area of the heat radiating via.
    Type: Application
    Filed: September 26, 2013
    Publication date: June 26, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Gun Oh, Ho Sik Park, Hwa Sub Oh