Abstract: A clamping apparatus capable of clamping various semiconductor substrates is provided. The clamping apparatus includes includes a main body, and a support plate partially coupled to the main body. The support plate is movable vertically. In addition, the clamping apparatus further includes a fixed gripper coupled and fixed onto the main body and a movable gripper disposed on the main body. The movable gripper is movable horizontally.

Abstract: A molding apparatus for semiconductor package includes: a lower mold supporting a first semiconductor chip; a middle mold positioned over the lower mold and supporting a second semiconductor chip, and having a first cavity for molding the first semiconductor chip on a lower surface facing the lower mold; an upper mold positioned over the middle mold and having a second cavity for molding the second semiconductor chip on a lower surface facing the middle mold; a first supply port penetrating the lower mold and connected to the first cavity; a second supply port penetrating the lower and middle molds and connected to the second cavity; and a pressure unit positioned under the lower mold and including first and second transfer rams provided respectively in the first and second supply ports to pressure molding compound therein to supply the molding compound into the first and second cavities.

Abstract: A package cutting apparatus includes at least two spindles installed at a sawing robot and cutting a frame including a plurality of packages into packages using cutting bits; a frame loading jig loading the frame so that the frame is cut; and a frame-and-unit picker installed at an orthogonal robot to load and unload the frame on and from the frame loading jig, wherein a state of the cutting bit installed at the spindle is checked.

Abstract: Provided are a device and method for molding a compound. The device for molding a compound may include a lower mold, an upper mold, and a cull degating unit. The lower mold may be configured to support a substrate and attach to a compound injector and the upper mold may be configured to cover the lower mold to form a space between the lower mold and the upper mold for receiving a compound from the compound injector. The cull degating unit may be in the upper mold and the cull degating unit may be configured to separate a cull of the compound in an injection passage from the compound molded on the substrate. The compound injector may be configured to inject a compound into the device such that a least a portion of the compound is molded on the substrate.

Abstract: A clamping apparatus capable of clamping various semiconductor substrates is provided. The clamping apparatus includes includes a main body, and a support plate partially coupled to the main body. The support plate is movable vertically. In addition, the clamping apparatus further includes a fixed gripper coupled and fixed onto the main body and a movable gripper disposed on the main body. The movable gripper is movable horizontally.

Abstract: A package cutting apparatus includes at least two spindles installed at a sawing robot and cutting a frame including a plurality of packages into packages using cutting bits; a frame loading jig loading the frame so that the frame is cut; and a frame-and-unit picker installed at an orthogonal robot to load and unload the frame on and from the frame loading jig, wherein a state of the cutting bit installed at the spindle is checked.