Patents by Inventor Ho Sub Kim

Ho Sub Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240135556
    Abstract: Provided are a device and method for tagging training data. The method includes detecting and tracking one or more objects included in a video using artificial intelligence (AI), when there is an object to be split in a result of tracking the detected objects, splitting the object in object units, and when there are identical objects to be merged among split objects, merging the objects.
    Type: Application
    Filed: October 18, 2023
    Publication date: April 25, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Ho Sub YOON, Jae Hong KIM, Jong Won MOON, Jae Yoon JANG
  • Publication number: 20230348666
    Abstract: The present invention provides a novel catalyst material used to produce polyester having improved molecular weight and color from a dicarboxylic acid aromatic heterocyclic compound or a derivative thereof.
    Type: Application
    Filed: September 13, 2021
    Publication date: November 2, 2023
    Inventors: Ho Sub KIM, Kyung Gyu NOH, Young Sung SUH, Choong Hee HONG, Ki Hyun PARK, No Woo PARK
  • Publication number: 20230348664
    Abstract: The present invention provides a polyester polymer having improved heat discoloration and at the same time, having a high molecular weight.
    Type: Application
    Filed: September 1, 2021
    Publication date: November 2, 2023
    Inventors: Young Sung SUH, No Woo PARK, Ho Sub KIM, Choong Hee HONG, Kyung Gyu NOH, Ki Hyun PARK
  • Patent number: 11608542
    Abstract: The austenitic stainless steel containing niobium according to an exemplary embodiment of the present invention includes: 16 to 26 wt. % of chromium (Cr), 8 to 22 wt. % of nickel (Ni), 0.02 to 0.1 wt. % of carbon (C), 0.2 to 1 wt. % of niobium (Nb), 0.015 to 0.025 wt. % of titanium (Ti), 0.004 to 0.01 wt. % of nitrogen (N), and 0.5 to 2 wt. % of manganese (Mn), wherein the austenitic stainless steel containing niobium has an austenitic matrix structure, a fine niobium carbide and a fine titanium nitride are precipitated in the austenitic matrix structure, and the fine niobium carbide is uniformly dispersed in the austenitic matrix structure.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: March 21, 2023
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Chang-Heui Jang, Ji Ho Shin, Byeong Seo Kong, Ho-Sub Kim, Hyeon Bae Lee
  • Patent number: 11326222
    Abstract: The austenitic stainless steel containing niobium according to an exemplary embodiment of the present invention includes: 16 to 26 wt. % of chromium (Cr), 8 to 22 wt. % of nickel (Ni), 0.02 to 0.1 wt. % of carbon (C), 0.2 to 1 wt. % of niobium (Nb), 0.015 to 0.025 wt. % of titanium (Ti), 0.004 to 0.01 wt. % of nitrogen (N), and 0.5 to 2 wt. % of manganese (Mn), wherein the austenitic stainless steel containing niobium has an austenitic matrix structure, a fine niobium carbide and a fine titanium nitride are precipitated in the austenitic matrix structure, and the fine niobium carbide is uniformly dispersed in the austenitic matrix structure.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: May 10, 2022
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Chang-Heui Jang, Ji Ho Shin, Byeong Seo Kong, Ho-Sub Kim, Hyeon Bae Lee
  • Publication number: 20220090229
    Abstract: The austenitic stainless steel containing niobium according to an exemplary embodiment of the present invention includes: 16 to 26 wt. % of chromium (Cr), 8 to 22 wt. % of nickel (Ni), 0.02 to 0.1 wt. % of carbon (C), 0.2 to 1 wt. % of niobium (Nb), 0.015 to 0.025 wt. % of titanium (Ti), 0.004 to 0.01 wt. % of nitrogen (N), and 0.5 to 2 wt. % of manganese (Mn), wherein the austenitic stainless steel containing niobium has an austenitic matrix structure, a fine niobium carbide and a fine titanium nitride are precipitated in the austenitic matrix structure, and the fine niobium carbide is uniformly dispersed in the austenitic matrix structure.
    Type: Application
    Filed: November 30, 2021
    Publication date: March 24, 2022
    Inventors: Chang-Heui JANG, Ji Ho SHIN, Byeong Seo KONG, Ho-Sub KIM, Hyeon Bae LEE
  • Publication number: 20210348248
    Abstract: The austenitic stainless steel containing niobium according to an exemplary embodiment of the present invention includes: 16 to 26 wt. % of chromium (Cr), 8 to 22 wt. % of nickel (Ni), 0.02 to 0.1 wt. % of carbon (C), 0.2 to 1 wt. % of niobium (Nb), 0.015 to 0.025 wt. % of titanium (Ti), 0.004 to 0.01 wt. % of nitrogen (N), and 0.5 to 2 wt. % of manganese (Mn), wherein the austenitic stainless steel containing niobium has an austenitic matrix structure, a fine niobium carbide and a fine titanium nitride are precipitated in the austenitic matrix structure, and the fine niobium carbide is uniformly dispersed in the austenitic matrix structure.
    Type: Application
    Filed: November 28, 2018
    Publication date: November 11, 2021
    Inventors: Chang-Heui JANG, Ji Ho SHIN, Byeong Seo KONG, Ho-Sub KIM, Hyeon Bae LEE
  • Patent number: 10645805
    Abstract: Provided are a multi-layer flexible metal-clad laminate, and a manufacturing method thereof, and more particularly, a multi-layer flexible metal-clad laminate in which at the time of manufacturing a multi-layer polyimide film on a surface of a metal-clad having a predetermined surface roughness value (Rz, Ra) and having roughening particles having a predetermined size or less attached thereon, a multi-coating scheme is used to form each polyimide mixed layer, such that a light reflection on a surface of the polyimide film and a light reflection generated at an interlayer interface of the polyimide in the multi-layer polyimide film are decreased to have an improved light transmittance of a polyimide laminate film after the metal-clad is removed, and a manufacturing method thereof.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: May 5, 2020
    Assignee: NEXFLEX CO., LTD.
    Inventors: Ho Sub Kim, Byoung Wook Jo, Young Do Kim, Weon Jung Choi, Dae Nyoun Kim, Seung Jeong Kook
  • Patent number: 9970617
    Abstract: A flexible copper-clad laminate for a vehicle LED lamp is provided and includes a copper-clad layer and a composite layer that are laminated. The composite layer includes a polyimide layer and thermoplastic polyimide layers. An outermost layer of the composite layer is formed as a thermoplastic polyimide layer. A total thickness of the thermoplastic polyimide layers and an entire thickness of the polyimide layer with respect to a total thickness of the composite layer is about 10 to 50% and 50 to 90%, respectively. The total thickness of the thermoplastic polyimide layers and the entire thickness of the polyimide layer with respect to the thickness of the composite layer is about 20 to 40% and 60 to 80%, respectively. A thickness of the copper-clad layer is about 30 to 80 ?m, and the total thickness of the composite layer is about 10 to 15 ?m.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: May 15, 2018
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Seung Woo Choi, Ho Sub Kim, Young Do Kim, Cheol Ho Kim
  • Patent number: 9872385
    Abstract: Disclosed is a flexible copper clad laminate including a first copper foil layer, a composite layer, and a second copper foil layer. Preferably, the composite layer includes a polyimide layer and a plurality of thermoplastic polyimide layers as an outermost layer thereof being the thermoplastic polyimide layers. In particular, with respect to a total thickness of the composite layer, a total thickness of the plurality of thermoplastic polyimide layers is in a range of from about 15 to about 50%, and a total thickness of the polyimide layer is in a range of from about 50 to about 85%. Each thickness of the first copper foil layer and the second copper foil layer is in a range of from about 30 to about 80 ?m, and the total thickness of the composite layer is in a range of from about 40 to about 60 ?m.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: January 16, 2018
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Seung Woo Choi, Sung Cheul Jeong, Ho Sub Kim, Young Do Kim, Cheol Ho Kim
  • Publication number: 20170241604
    Abstract: A flexible copper-clad laminate for a vehicle LED lamp is provided and includes a copper-clad layer and a composite layer that are laminated. The composite layer includes a polyimide layer and thermoplastic polyimide layers. An outermost layer of the composite layer is formed as a thermoplastic polyimide layer. A total thickness of the thermoplastic polyimide layers and an entire thickness of the polyimide layer with respect to a total thickness of the composite layer is about 10 to 50% and 50 to 90%, respectively. The total thickness of the thermoplastic polyimide layers and the entire thickness of the polyimide layer with respect to the thickness of the composite layer is about 20 to 40% and 60 to 80%, respectively. A thickness of the copper-clad layer is about 30 to 80 ?m, and the total thickness of the composite layer is about 10 to 15 ?m.
    Type: Application
    Filed: June 14, 2016
    Publication date: August 24, 2017
    Inventors: Seung Woo Choi, Ho Sub Kim, Young Do Kim, Cheol Ho Kim
  • Publication number: 20170245364
    Abstract: Disclosed is a flexible copper clad laminate including a first copper foil layer, a composite layer, and a second copper foil layer. Preferably, the composite layer includes a polyimide layer and a plurality of thermoplastic polyimide layers as an outermost layer thereof being the thermoplastic polyimide layers. In particular, with respect to a total thickness of the composite layer, a total thickness of the plurality of thermoplastic polyimide layers is in a range of from about 15 to about 50%, and a total thickness of the polyimide layer is in a range of from about 50 to about 85%. Each thickness of the first copper foil layer and the second copper foil layer is in a range of from about 30 to about 80 ?m, and the total thickness of the composite layer is in a range of from about 40 to about 60 ?m.
    Type: Application
    Filed: June 13, 2016
    Publication date: August 24, 2017
    Inventors: Seung Woo Choi, Sung Cheul Jeong, Ho Sub Kim, Young Do Kim, Cheol Ho Kim
  • Publication number: 20160176161
    Abstract: Provided is a flexible metal-clad laminate, comprising; a first metal layer; a first polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or less which is formed on the first metal layer and plasma-treated; a second polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or less which is formed on the first polyimide layer.
    Type: Application
    Filed: February 29, 2016
    Publication date: June 23, 2016
    Inventors: BYOUNG WOOK JO, HO SUB KIM, YOUNG DO KIM, WEON JUNG CHOI, DAE NYOUN KIM
  • Patent number: 9296015
    Abstract: Provided is a method for manufacturing a flexible metal-clad laminate using a casting method, including: (a) forming a first polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or less above a metal layer; (b) plasma-treating a surface of the first polyimide layer; and (c) forming a second polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or lower above the first polyimide layer. The flexible metal-clad laminate according to the present invention can have excellent adhesion between the polymer film and the metal conductive layer, a low dimensional change, and a low production cost, because of superior casting workability, even though the thickness of polyimide becomes increased.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: March 29, 2016
    Assignee: SK INNOVATION CO., LTD.
    Inventors: Byoung Wook Jo, Ho Sub Kim, Young Do Kim, Weon Jung Choi, Dae Nyoun Kim
  • Patent number: 9232660
    Abstract: A flexible metal clad laminate includes a metal foil, and a multilayered polyimide film including a first polyimide layer having a glass transition temperature of 300° C. or less and disposed on the metal foil, a second polyimide layer disposed on the first polyimide layer and a third polyimide layer disposed on the second polyimide layer. According to the flexible metal clad laminate of the present invention, appearance defects such as blistering generated during curing process in a continuous curing machine using an infrared heat source may be solved, interlayer delamination may be prevented due to a good adhesion strength with a metal layer, and an ACF bonding strength and a dimensional stability may be good. The flexible metal clad laminate may be useful for the manufacturing of a flexible printed circuit boards.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: January 5, 2016
    Assignee: SK Innovation Co., Ltd.
    Inventors: Ho Sub Kim, Yong Seok Lee, Weon Jung Choi, Dae Nyoun Kim, Young Do Kim
  • Publication number: 20150373843
    Abstract: Provided are a multi-layer flexible metal-clad laminate, and a manufacturing method thereof, and more particularly, a multi-layer flexible metal-clad laminate in which at the time of manufacturing a multi-layer polyimide film on a surface of a metal-clad having a predetermined surface roughness value (Rz, Ra) and having roughening particles having a predetermined size or less attached thereon, a multi-coating scheme is used to form each polyimide mixed layer, such that a light reflection on a surface of the polyimide film and a light reflection generated at an interlayer interface of the polyimide in the multi-layer polyimide film are decreased to have an improved light transmittance of a polyimide laminate film after the metal-clad is removed, and a manufacturing method thereof.
    Type: Application
    Filed: December 19, 2013
    Publication date: December 24, 2015
    Inventors: Ho Sub KIM, Byoung Wook JO, Young Do KIM, Weon Jung CHOI, Dae Nyoun KIM, Seung Jeong KOOK
  • Patent number: 9190576
    Abstract: A light emitting device comprising a photonic crystal structure having a crystal structure in which nanospheres are densely arranged in a 3D manner, wherein the nanospheres have phosphors excited by an excitation source to emit light of a wavelength longer than a pump photon of the excitation source, wherein the photonic crystal structure has at least a photonic bandgap (PBG) along a specific crystal orientation, and wherein the wavelength of the pump photon overlaps a photonic bandedge region.
    Type: Grant
    Filed: November 29, 2010
    Date of Patent: November 17, 2015
    Assignee: SNU R&DB FOUNDATION
    Inventors: Heon Su Jeon, Kook Heon Char, Yoon Kyung Choi, Ho Sub Kim, Kyungtaek Min
  • Publication number: 20140342137
    Abstract: A flexible metal clad laminate includes a metal foil, and a multilayered polyimide film including a first polyimide layer having a glass transition temperature of 300° C. or less and disposed on the metal foil, a second polyimide layer disposed on the first polyimide layer and a third polyimide layer disposed on the second polyimide layer. According to the flexible metal clad laminate of the present invention, appearance defects such as blistering generated during curing process in a continuous curing machine using an infrared heat source may be solved, interlayer delamination may be prevented due to a good adhesion strength with a metal layer, and an ACF bonding strength and a dimensional stability may be good. The flexible metal clad laminate may be useful for the manufacturing of a flexible printed circuit boards.
    Type: Application
    Filed: December 27, 2012
    Publication date: November 20, 2014
    Inventors: Ho Sub Kim, Yong Seok Lee, Weon Jung Choi, Dae Nyoun Kim, Young Do Kim
  • Publication number: 20120156476
    Abstract: Provided is a method for manufacturing a flexible metal-clad laminate using a casting method, including: (a) forming a first polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or less above a metal layer; (b) plasma-treating a surface of the first polyimide layer; and (c) forming a second polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or lower above the first polyimide layer. The flexible metal-clad laminate according to the present invention can have excellent adhesion between the polymer film and the metal conductive layer, a low dimensional change, and a low production cost, because of superior casting workability, even though the thickness of polyimide becomes increased.
    Type: Application
    Filed: December 16, 2011
    Publication date: June 21, 2012
    Applicant: SK INNOVATION CO., LTD.
    Inventors: Byoung Wook JO, Ho Sub KIM, Young Do KIM, Weon Jung CHOI, Dae Nyoun KIM
  • Patent number: 8003815
    Abstract: The present invention provides a method of preparing a cross-condensed compound of an amino-acid derivative and (aminoalkyl)trialkoxysilane using microwave, including: irradiating and heating an amino-acid derivative and (aminoalkyl)trialkoxysilane in a microwave reactor to obtain a reaction product (step 1); and refining the reaction product obtained in the step 1 by removing an unreacted solid material from the reaction product and then leaving the reaction product at room temperature under vacuum to remove excess (aminoalkyl)trialkoxysilane therefrom (step 2). According to the method, since a cross-condensation reaction is performed using microwave, unlike a conventional condensation reaction, economic efficiency is increased due to no catalyst, short reaction time and no solvent. Further, the yield and selectivity of products is increased, and the condensation reaction can be environment-friendly performed because a solvent which can badly influence the environment may not be used.
    Type: Grant
    Filed: February 22, 2008
    Date of Patent: August 23, 2011
    Assignee: Inha-Industry Partnership Institute
    Inventors: Ik Mo Lee, Dong Hwan Lee, Ho Sub Kim, Sang Eon Park