Patents by Inventor Ho Sub Kim
Ho Sub Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240135556Abstract: Provided are a device and method for tagging training data. The method includes detecting and tracking one or more objects included in a video using artificial intelligence (AI), when there is an object to be split in a result of tracking the detected objects, splitting the object in object units, and when there are identical objects to be merged among split objects, merging the objects.Type: ApplicationFiled: October 18, 2023Publication date: April 25, 2024Applicant: Electronics and Telecommunications Research InstituteInventors: Ho Sub YOON, Jae Hong KIM, Jong Won MOON, Jae Yoon JANG
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Publication number: 20230348666Abstract: The present invention provides a novel catalyst material used to produce polyester having improved molecular weight and color from a dicarboxylic acid aromatic heterocyclic compound or a derivative thereof.Type: ApplicationFiled: September 13, 2021Publication date: November 2, 2023Inventors: Ho Sub KIM, Kyung Gyu NOH, Young Sung SUH, Choong Hee HONG, Ki Hyun PARK, No Woo PARK
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Publication number: 20230348664Abstract: The present invention provides a polyester polymer having improved heat discoloration and at the same time, having a high molecular weight.Type: ApplicationFiled: September 1, 2021Publication date: November 2, 2023Inventors: Young Sung SUH, No Woo PARK, Ho Sub KIM, Choong Hee HONG, Kyung Gyu NOH, Ki Hyun PARK
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Patent number: 11608542Abstract: The austenitic stainless steel containing niobium according to an exemplary embodiment of the present invention includes: 16 to 26 wt. % of chromium (Cr), 8 to 22 wt. % of nickel (Ni), 0.02 to 0.1 wt. % of carbon (C), 0.2 to 1 wt. % of niobium (Nb), 0.015 to 0.025 wt. % of titanium (Ti), 0.004 to 0.01 wt. % of nitrogen (N), and 0.5 to 2 wt. % of manganese (Mn), wherein the austenitic stainless steel containing niobium has an austenitic matrix structure, a fine niobium carbide and a fine titanium nitride are precipitated in the austenitic matrix structure, and the fine niobium carbide is uniformly dispersed in the austenitic matrix structure.Type: GrantFiled: November 30, 2021Date of Patent: March 21, 2023Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Chang-Heui Jang, Ji Ho Shin, Byeong Seo Kong, Ho-Sub Kim, Hyeon Bae Lee
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Patent number: 11326222Abstract: The austenitic stainless steel containing niobium according to an exemplary embodiment of the present invention includes: 16 to 26 wt. % of chromium (Cr), 8 to 22 wt. % of nickel (Ni), 0.02 to 0.1 wt. % of carbon (C), 0.2 to 1 wt. % of niobium (Nb), 0.015 to 0.025 wt. % of titanium (Ti), 0.004 to 0.01 wt. % of nitrogen (N), and 0.5 to 2 wt. % of manganese (Mn), wherein the austenitic stainless steel containing niobium has an austenitic matrix structure, a fine niobium carbide and a fine titanium nitride are precipitated in the austenitic matrix structure, and the fine niobium carbide is uniformly dispersed in the austenitic matrix structure.Type: GrantFiled: November 28, 2018Date of Patent: May 10, 2022Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Chang-Heui Jang, Ji Ho Shin, Byeong Seo Kong, Ho-Sub Kim, Hyeon Bae Lee
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Publication number: 20220090229Abstract: The austenitic stainless steel containing niobium according to an exemplary embodiment of the present invention includes: 16 to 26 wt. % of chromium (Cr), 8 to 22 wt. % of nickel (Ni), 0.02 to 0.1 wt. % of carbon (C), 0.2 to 1 wt. % of niobium (Nb), 0.015 to 0.025 wt. % of titanium (Ti), 0.004 to 0.01 wt. % of nitrogen (N), and 0.5 to 2 wt. % of manganese (Mn), wherein the austenitic stainless steel containing niobium has an austenitic matrix structure, a fine niobium carbide and a fine titanium nitride are precipitated in the austenitic matrix structure, and the fine niobium carbide is uniformly dispersed in the austenitic matrix structure.Type: ApplicationFiled: November 30, 2021Publication date: March 24, 2022Inventors: Chang-Heui JANG, Ji Ho SHIN, Byeong Seo KONG, Ho-Sub KIM, Hyeon Bae LEE
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Publication number: 20210348248Abstract: The austenitic stainless steel containing niobium according to an exemplary embodiment of the present invention includes: 16 to 26 wt. % of chromium (Cr), 8 to 22 wt. % of nickel (Ni), 0.02 to 0.1 wt. % of carbon (C), 0.2 to 1 wt. % of niobium (Nb), 0.015 to 0.025 wt. % of titanium (Ti), 0.004 to 0.01 wt. % of nitrogen (N), and 0.5 to 2 wt. % of manganese (Mn), wherein the austenitic stainless steel containing niobium has an austenitic matrix structure, a fine niobium carbide and a fine titanium nitride are precipitated in the austenitic matrix structure, and the fine niobium carbide is uniformly dispersed in the austenitic matrix structure.Type: ApplicationFiled: November 28, 2018Publication date: November 11, 2021Inventors: Chang-Heui JANG, Ji Ho SHIN, Byeong Seo KONG, Ho-Sub KIM, Hyeon Bae LEE
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Patent number: 10645805Abstract: Provided are a multi-layer flexible metal-clad laminate, and a manufacturing method thereof, and more particularly, a multi-layer flexible metal-clad laminate in which at the time of manufacturing a multi-layer polyimide film on a surface of a metal-clad having a predetermined surface roughness value (Rz, Ra) and having roughening particles having a predetermined size or less attached thereon, a multi-coating scheme is used to form each polyimide mixed layer, such that a light reflection on a surface of the polyimide film and a light reflection generated at an interlayer interface of the polyimide in the multi-layer polyimide film are decreased to have an improved light transmittance of a polyimide laminate film after the metal-clad is removed, and a manufacturing method thereof.Type: GrantFiled: December 19, 2013Date of Patent: May 5, 2020Assignee: NEXFLEX CO., LTD.Inventors: Ho Sub Kim, Byoung Wook Jo, Young Do Kim, Weon Jung Choi, Dae Nyoun Kim, Seung Jeong Kook
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Patent number: 9970617Abstract: A flexible copper-clad laminate for a vehicle LED lamp is provided and includes a copper-clad layer and a composite layer that are laminated. The composite layer includes a polyimide layer and thermoplastic polyimide layers. An outermost layer of the composite layer is formed as a thermoplastic polyimide layer. A total thickness of the thermoplastic polyimide layers and an entire thickness of the polyimide layer with respect to a total thickness of the composite layer is about 10 to 50% and 50 to 90%, respectively. The total thickness of the thermoplastic polyimide layers and the entire thickness of the polyimide layer with respect to the thickness of the composite layer is about 20 to 40% and 60 to 80%, respectively. A thickness of the copper-clad layer is about 30 to 80 ?m, and the total thickness of the composite layer is about 10 to 15 ?m.Type: GrantFiled: June 14, 2016Date of Patent: May 15, 2018Assignees: Hyundai Motor Company, Kia Motors CorporationInventors: Seung Woo Choi, Ho Sub Kim, Young Do Kim, Cheol Ho Kim
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Copper clad laminate, printed circuit board including the same, and manufacturing method of the same
Patent number: 9872385Abstract: Disclosed is a flexible copper clad laminate including a first copper foil layer, a composite layer, and a second copper foil layer. Preferably, the composite layer includes a polyimide layer and a plurality of thermoplastic polyimide layers as an outermost layer thereof being the thermoplastic polyimide layers. In particular, with respect to a total thickness of the composite layer, a total thickness of the plurality of thermoplastic polyimide layers is in a range of from about 15 to about 50%, and a total thickness of the polyimide layer is in a range of from about 50 to about 85%. Each thickness of the first copper foil layer and the second copper foil layer is in a range of from about 30 to about 80 ?m, and the total thickness of the composite layer is in a range of from about 40 to about 60 ?m.Type: GrantFiled: June 13, 2016Date of Patent: January 16, 2018Assignees: Hyundai Motor Company, Kia Motors CorporationInventors: Seung Woo Choi, Sung Cheul Jeong, Ho Sub Kim, Young Do Kim, Cheol Ho Kim -
Publication number: 20170241604Abstract: A flexible copper-clad laminate for a vehicle LED lamp is provided and includes a copper-clad layer and a composite layer that are laminated. The composite layer includes a polyimide layer and thermoplastic polyimide layers. An outermost layer of the composite layer is formed as a thermoplastic polyimide layer. A total thickness of the thermoplastic polyimide layers and an entire thickness of the polyimide layer with respect to a total thickness of the composite layer is about 10 to 50% and 50 to 90%, respectively. The total thickness of the thermoplastic polyimide layers and the entire thickness of the polyimide layer with respect to the thickness of the composite layer is about 20 to 40% and 60 to 80%, respectively. A thickness of the copper-clad layer is about 30 to 80 ?m, and the total thickness of the composite layer is about 10 to 15 ?m.Type: ApplicationFiled: June 14, 2016Publication date: August 24, 2017Inventors: Seung Woo Choi, Ho Sub Kim, Young Do Kim, Cheol Ho Kim
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COPPER CLAD LAMINATE, PRINTED CIRCUIT BOARD INCLUDING THE SAME, AND MANUFACTURING METHOD OF THE SAME
Publication number: 20170245364Abstract: Disclosed is a flexible copper clad laminate including a first copper foil layer, a composite layer, and a second copper foil layer. Preferably, the composite layer includes a polyimide layer and a plurality of thermoplastic polyimide layers as an outermost layer thereof being the thermoplastic polyimide layers. In particular, with respect to a total thickness of the composite layer, a total thickness of the plurality of thermoplastic polyimide layers is in a range of from about 15 to about 50%, and a total thickness of the polyimide layer is in a range of from about 50 to about 85%. Each thickness of the first copper foil layer and the second copper foil layer is in a range of from about 30 to about 80 ?m, and the total thickness of the composite layer is in a range of from about 40 to about 60 ?m.Type: ApplicationFiled: June 13, 2016Publication date: August 24, 2017Inventors: Seung Woo Choi, Sung Cheul Jeong, Ho Sub Kim, Young Do Kim, Cheol Ho Kim -
Publication number: 20160176161Abstract: Provided is a flexible metal-clad laminate, comprising; a first metal layer; a first polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or less which is formed on the first metal layer and plasma-treated; a second polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or less which is formed on the first polyimide layer.Type: ApplicationFiled: February 29, 2016Publication date: June 23, 2016Inventors: BYOUNG WOOK JO, HO SUB KIM, YOUNG DO KIM, WEON JUNG CHOI, DAE NYOUN KIM
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Patent number: 9296015Abstract: Provided is a method for manufacturing a flexible metal-clad laminate using a casting method, including: (a) forming a first polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or less above a metal layer; (b) plasma-treating a surface of the first polyimide layer; and (c) forming a second polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or lower above the first polyimide layer. The flexible metal-clad laminate according to the present invention can have excellent adhesion between the polymer film and the metal conductive layer, a low dimensional change, and a low production cost, because of superior casting workability, even though the thickness of polyimide becomes increased.Type: GrantFiled: December 16, 2011Date of Patent: March 29, 2016Assignee: SK INNOVATION CO., LTD.Inventors: Byoung Wook Jo, Ho Sub Kim, Young Do Kim, Weon Jung Choi, Dae Nyoun Kim
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Patent number: 9232660Abstract: A flexible metal clad laminate includes a metal foil, and a multilayered polyimide film including a first polyimide layer having a glass transition temperature of 300° C. or less and disposed on the metal foil, a second polyimide layer disposed on the first polyimide layer and a third polyimide layer disposed on the second polyimide layer. According to the flexible metal clad laminate of the present invention, appearance defects such as blistering generated during curing process in a continuous curing machine using an infrared heat source may be solved, interlayer delamination may be prevented due to a good adhesion strength with a metal layer, and an ACF bonding strength and a dimensional stability may be good. The flexible metal clad laminate may be useful for the manufacturing of a flexible printed circuit boards.Type: GrantFiled: December 27, 2012Date of Patent: January 5, 2016Assignee: SK Innovation Co., Ltd.Inventors: Ho Sub Kim, Yong Seok Lee, Weon Jung Choi, Dae Nyoun Kim, Young Do Kim
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Publication number: 20150373843Abstract: Provided are a multi-layer flexible metal-clad laminate, and a manufacturing method thereof, and more particularly, a multi-layer flexible metal-clad laminate in which at the time of manufacturing a multi-layer polyimide film on a surface of a metal-clad having a predetermined surface roughness value (Rz, Ra) and having roughening particles having a predetermined size or less attached thereon, a multi-coating scheme is used to form each polyimide mixed layer, such that a light reflection on a surface of the polyimide film and a light reflection generated at an interlayer interface of the polyimide in the multi-layer polyimide film are decreased to have an improved light transmittance of a polyimide laminate film after the metal-clad is removed, and a manufacturing method thereof.Type: ApplicationFiled: December 19, 2013Publication date: December 24, 2015Inventors: Ho Sub KIM, Byoung Wook JO, Young Do KIM, Weon Jung CHOI, Dae Nyoun KIM, Seung Jeong KOOK
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Patent number: 9190576Abstract: A light emitting device comprising a photonic crystal structure having a crystal structure in which nanospheres are densely arranged in a 3D manner, wherein the nanospheres have phosphors excited by an excitation source to emit light of a wavelength longer than a pump photon of the excitation source, wherein the photonic crystal structure has at least a photonic bandgap (PBG) along a specific crystal orientation, and wherein the wavelength of the pump photon overlaps a photonic bandedge region.Type: GrantFiled: November 29, 2010Date of Patent: November 17, 2015Assignee: SNU R&DB FOUNDATIONInventors: Heon Su Jeon, Kook Heon Char, Yoon Kyung Choi, Ho Sub Kim, Kyungtaek Min
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Publication number: 20140342137Abstract: A flexible metal clad laminate includes a metal foil, and a multilayered polyimide film including a first polyimide layer having a glass transition temperature of 300° C. or less and disposed on the metal foil, a second polyimide layer disposed on the first polyimide layer and a third polyimide layer disposed on the second polyimide layer. According to the flexible metal clad laminate of the present invention, appearance defects such as blistering generated during curing process in a continuous curing machine using an infrared heat source may be solved, interlayer delamination may be prevented due to a good adhesion strength with a metal layer, and an ACF bonding strength and a dimensional stability may be good. The flexible metal clad laminate may be useful for the manufacturing of a flexible printed circuit boards.Type: ApplicationFiled: December 27, 2012Publication date: November 20, 2014Inventors: Ho Sub Kim, Yong Seok Lee, Weon Jung Choi, Dae Nyoun Kim, Young Do Kim
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Publication number: 20120156476Abstract: Provided is a method for manufacturing a flexible metal-clad laminate using a casting method, including: (a) forming a first polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or less above a metal layer; (b) plasma-treating a surface of the first polyimide layer; and (c) forming a second polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or lower above the first polyimide layer. The flexible metal-clad laminate according to the present invention can have excellent adhesion between the polymer film and the metal conductive layer, a low dimensional change, and a low production cost, because of superior casting workability, even though the thickness of polyimide becomes increased.Type: ApplicationFiled: December 16, 2011Publication date: June 21, 2012Applicant: SK INNOVATION CO., LTD.Inventors: Byoung Wook JO, Ho Sub KIM, Young Do KIM, Weon Jung CHOI, Dae Nyoun KIM
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Patent number: 8003815Abstract: The present invention provides a method of preparing a cross-condensed compound of an amino-acid derivative and (aminoalkyl)trialkoxysilane using microwave, including: irradiating and heating an amino-acid derivative and (aminoalkyl)trialkoxysilane in a microwave reactor to obtain a reaction product (step 1); and refining the reaction product obtained in the step 1 by removing an unreacted solid material from the reaction product and then leaving the reaction product at room temperature under vacuum to remove excess (aminoalkyl)trialkoxysilane therefrom (step 2). According to the method, since a cross-condensation reaction is performed using microwave, unlike a conventional condensation reaction, economic efficiency is increased due to no catalyst, short reaction time and no solvent. Further, the yield and selectivity of products is increased, and the condensation reaction can be environment-friendly performed because a solvent which can badly influence the environment may not be used.Type: GrantFiled: February 22, 2008Date of Patent: August 23, 2011Assignee: Inha-Industry Partnership InstituteInventors: Ik Mo Lee, Dong Hwan Lee, Ho Sub Kim, Sang Eon Park