Abstract: An intumescent strip includes a first material layer and an opposing second material layer. A third material layer, formed from an intumescent material, is positioned between the first and second layers. The intumescent material includes a combination of intumescent particles suspended within a thermoplastic material. The intumescent particles have an activation temperature and are expandable when exposed to temperatures above the activation temperature. The thermoplastic material has a melting temperature that is lower than the activation temperature.

Abstract: An intumescent strip includes a first material layer and an opposing second material layer. A third material layer, formed from an intumescent material, is positioned between the first and second layers. The intumescent material includes a combination of intumescent particles suspended within a thermoplastic material. The intumescent particles have an activation temperature and are expandable when exposed to temperatures above the activation temperature. The thermoplastic material has a melting temperature that is lower than the activation temperature.

Abstract: An semiconductor device including logic circuitry, a plurality of pins, and an interface unit coupling the logic circuitry to the plurality of pins, wherein the interface unit permits any of the pins to be coupled to any portion of the logic circuitry. The semiconductor device provides a template by which many different types of semiconductor devices, with varied pin assignments, can be manufactured, without the need for changing production masks.

Abstract: An semiconductor device including logic circuitry, a plurality of pins, and an interface unit coupling the logic circuitry to the plurality of pins, wherein the interface unit permits any of the pins to be coupled to any portion of the logic circuitry. The semiconductor device provides a template by which many different types of semiconductor devices, with varied pin assignments, can be manufactured, without the need for changing production masks.

Abstract: An semiconductor device including logic circuitry, a plurality of pins, and an interface unit coupling the logic circuitry to the plurality of pins, wherein the interface unit permits any of the pins to be coupled to any portion of the logic circuitry. The semiconductor device provides a template by which many different types of semiconductor devices, with varied pin assignments, can be manufactured, without the need for changing production masks.

Abstract: The invention provides an input/output (I/O) signaling voltage range discriminator (and corresponding method) which is used to control a configurable logic device such as a configurable I/O buffer in a second electronic circuit in response to a detected signaling voltage range of a first electronic circuit. The discriminator outputs an indication of the signaling voltage range of the first electronic circuit to a configurable I/O buffer enabling it to adapt to the signaling levels used by the first electronic circuit. The I/O buffer, based on the indication provided by the discriminator, can then configure its logic to become tolerant and/or compatible with digital signals transferred to and from the first electronic circuit.

Abstract: A programmable logic device, such as an FPGA, is implemented using logic cells that have configurable connection schemes between routing resources and logic element input pins. For example, in one embodiment, each logic cell in the device has a flexible input structure that supports two or more different connection schemes, which may or may not involve input sharing, where each logic cell can be individually programmed for any of the available connection schemes when the device is configured. As such, the device can be efficiently programmed to implement the user's specific circuitry. The invention balances the competing goals of (1) reducing routing requirements by limiting the number of connections between routing resources and logic element input pins and (2) providing minimally constrained programming of logic elements.

Abstract: A single integrated circuit (IC) having one or more regions of mask-programmed device (MPD) logic for implementing permanent functions and one or more regions of field-programmable gate-array (FPGA) logic for implementing user-specified functions. The FPGA-type logic provides programming flexibility, while the MPD-type logic provides size, speed, functionality, and dollar cost advantages. In one embodiment, a hybrid IC has an array of programmable logic cells (PLCs) implemented using FPGA-type logic, an application-specific block (ASB) implemented using MPD-type logic, and a ring of pads. Fast interface switch hierarchy (FISH) cells provide the interface between the PLC array and the pads, between the PLC array and the ASB, and between the ASB and the pad ring.

Abstract: The bi-directional (BI-DI) buffers and supplemental logic and interconnect (SLIC) cells are designed to be programmed to operate in different modes in order to implement different kinds of logic circuits. In particular, BI-DI buffers of the present invention support at least five different operational modes. In a first mode (Mode A), the BI-DI buffer generates a logic "1" output, for any input value. In a second mode (Mode B), the BI-DI buffer generates a logic "0" output, for any input value. In a third mode (Mode C), the BI-DI buffer buffers the input signal and generates an output signal equal to the input signal. In a fourth mode (Mode D), the BI-DI buffer buffers the input signal and generates an output signal equal to the inverse of the input signal. In a fifth mode, (Mode E), the BI-DI buffer operates as a conventional tri-state driver. Two or more of the BI-DI buffers can be configured to form more complex logic circuits having two or more inputs.