Abstract: Provided herein are protective masks made with polymer-based materials and methods of forming the materials. Methods of forming the interlaced polymer-based materials comprise applying adhesive to a substrate, electrospinning a first polymer solution onto the substrate from a first group of spinning electrodes, electrospinning a second polymer solution onto the substrate from a second group of spinning electrodes, and applying hot air to dry the polymer-based materials electrospun from the first polymer solution and the second polymer solution to form the interlaced polymer-based materials.

Abstract: A lead frame assembly includes a first lead frame panel having a die receiving area for receiving a semiconductor die, the die having an upper surface having one or more die bond pads located thereon. A second lead frame panel includes integral leads, each integral lead including a terminal, a connecting element extending from the terminal, and a shaped contact located at an end of the connecting element. The second lead frame panel is adapted to be stacked on the first lead frame panel to position each terminal laterally of a respective die receiving area. The positioning of the terminals locates each shaped contact for contact with a respective die bond pad to establish an electrical connection between the die bond pad and the respective terminal when the semiconductor die is mounted on the respective die receiving area.

Abstract: A lead frame (10) for a semiconductor device includes a first row of terminals (12) surrounding a die receiving area (14) and a second row of terminals (16) spaced from and surrounding the first row of terminals (12). The first and second rows of terminals (12, 16) have a first height (H1). The terminals (12) of the first row include a step (26) that has a greater height (H2). Bond wires (36) connecting die pads (34) to the first row terminals (12) extend over the second height H2 part of the terminal (12) and are attached to the first height H1 part of the terminal (12). The step (26) insures that the bond wires (36) attached to the stepped terminals (12) have a high wire kink profile so that they are less susceptible to damage in later process steps.

Abstract: A method of packaging an integrated circuit die (12) includes the steps of providing a foil sheet (30) and forming a layer of solder (32) on a first side of the foil sheet. A first side of the integrated circuit die is attached to the solder on the foil sheet. The first side of the die has a layer of metal (34) on it and a second, opposing side of the die includes bonding pads (14). The bonding pads are electrically connected to the solder on the foil sheet with wires (16). The die, the electrical connections, and the first side of the foil sheet are encapsulated with a mold compound (20). The foil sheet is separated from the die and the wires, which forms a packaged integrated circuit (10).