Patents by Inventor Ho Wei

Ho Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12009222
    Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a first layer over a substrate. The method includes forming a stop layer over the first layer. The method includes forming a second layer over the stop layer. The second layer is in direct contact with the stop layer. The method includes partially removing the second layer. The method includes performing an etching process to partially remove the stop layer and an upper portion of the first layer, wherein protrusion structures are formed over a lower portion of the first layer after the etching process, and the protrusion structures include the stop layer and the upper portion of the first layer remaining after the etching process. The method includes removing the protrusion structures.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: June 11, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Chen Wei, Chun-Chieh Chan, Chun-Jui Chu, Jen-Chieh Lai, Shih-Ho Lin
  • Patent number: 11993676
    Abstract: A non-fullerene acceptor polymer includes a structure represented by formula (I). Formula (I) is defined as in the specification. The non-fullerene acceptor polymer has an electron donating unit and an electron attracting end group. The non-fullerene acceptor polymer uses phenyl or its derivatives as the linker to form the polymer.
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: May 28, 2024
    Assignee: National Tsing Hua University
    Inventors: Ho-Hsiu Chou, Mohamed Hammad Elsayed, Chih-Wei Juan, Tse-Fu Huang
  • Patent number: 11990787
    Abstract: A flexible charging pad and a manufacturing method thereof are provided. The manufacturing method of the flexible charging pad includes: providing a double-sided tape to form an adhesion layer, one of two isolation papers is attached on the first adhesion surface, and another of the two isolation papers is attached on the second adhesion surface; removing the isolation paper attached on the first adhesion surface, and attaching a conductor on the first adhesion surface; attaching a first pad layer on the first adhesion surface to cover the conductor, the conductor is disposed between the first pad layer and the adhesion layer; disposing an adhesive to cover the conductor and the first pad layer, and to form a molded layer.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: May 21, 2024
    Assignee: DEXIN CORPORATION
    Inventors: Ho-Lung Lu, Shih-Wei Pan
  • Patent number: 10580957
    Abstract: A thermoelectric material structure includes a substrate, at least one spacing layer, and at least one two-dimensional (2D) material layer. The substrate has a surface. The 2D material layer and the spacing layer are overlapped and disposed on the surface of the substrate. The thermal conductivity of the 2D material layer along the direction perpendicular to the surface of the substrate is less than 10 W/mK.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: March 3, 2020
    Assignee: SULFURSCIENCE TECHNOLOGY CO., LTD.
    Inventors: Zhen-Yu Juang, Ho-Wei Wang, Sung-Yen Wei
  • Publication number: 20180138388
    Abstract: A thermoelectric material structure includes a substrate, at least one spacing layer, and at least one two-dimensional (2D) material layer. The substrate has a surface. The 2D material layer and the spacing layer are overlapped and disposed on the surface of the substrate. The thermal conductivity of the 2D material layer along the direction perpendicular to the surface of the substrate is less than 10 W/mK.
    Type: Application
    Filed: September 11, 2017
    Publication date: May 17, 2018
    Inventors: Zhen-Yu JUANG, Ho-Wei WANG
  • Publication number: 20160274455
    Abstract: A method of optimizing a semiconductor mask layout is provided. The method includes accessing a digital file comprising the semiconductor mask layout, accessing processing condition parameters describing process conditions, receiving a request from a user of a mask layout system to initiate a semiconductor mask layout optimization process, applying a set of rules to insert an array of assist features into the semiconductor mask layout, and updating the digital file. The semiconductor mask layout includes a plurality of parallel mask features, wherein pairs of the parallel mask features share an end-to-end region between the parallel mask features of each pair, with an imaginary axis bisecting the end-to-end regions. Each assist feature is located proximate to at least one end-to-end region, and the imaginary axis intersects each assist feature. Related photomasks, design layout systems, and computer-readable media are also provided.
    Type: Application
    Filed: March 16, 2015
    Publication date: September 22, 2016
    Inventors: Ho Wei-De, Chi-Yuan Sun, Ya Hui Chang, Hung-Chang Hsieh
  • Patent number: 9236267
    Abstract: A method for patterning a plurality of features in a non-rectangular pattern, such as on an integrated circuit device, includes providing a substrate including a surface with a plurality of elongated protrusions, the elongated protrusions extending in a first direction. A first layer is formed above the surface and above the plurality of elongated protrusions, and patterned with an end cutting mask. The end cutting mask includes two nearly-adjacent patterns with a sub-resolution feature positioned and configured such that when the resulting pattern on the first layer includes the two nearly adjacent patterns and a connection there between. The method further includes cutting ends of the elongated protrusions using the pattern on the first layer.
    Type: Grant
    Filed: February 9, 2012
    Date of Patent: January 12, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ho Wei De, Kuei-Liang Lu, Ming-Feng Shieh, Ching-Yu Chang
  • Publication number: 20150214161
    Abstract: A semiconductor structure comprising a tray, a chip, a first grounding wire and a second grounding wire is provided. The tray has a first surface and a second surface, and there is a height difference existing between the first surface and the second surface. The chip is disposed on the first surface of the tray and has an active surface. The first grounding wire connects the active surface and the second surface. The second grounding wire connects the first surface and the second surface.
    Type: Application
    Filed: May 28, 2014
    Publication date: July 30, 2015
    Applicant: ALi Corporation
    Inventor: Ho-Wei CHANG
  • Publication number: 20150181716
    Abstract: A method for manufacturing a touch panel includes the following procedures. A base plate is provided. An indium tin oxide film is formed on the base plate. The indium tin oxide film is etched to form a plurality of first and second electrodes which are alternatively arranged according to columns on the base plate and insulated from each other, and the first electrodes in a column along a first direction are electrically coupled to each other. A plurality of insulated layers is formed on the first and second electrodes. A plurality of conductive connectors are formed on the plurality of insulated layers via an ink jet printing method to electrically interconnect with the second electrodes in a column along the second direction intersecting the first direction. The widths of the conductive connectors are reduced below 10 ?m via a laser processing method.
    Type: Application
    Filed: December 19, 2014
    Publication date: June 25, 2015
    Inventors: TEN-HSING JAW, CHIN-YANG WU, SZU-WEI SUNG, CHING-HO WEI
  • Patent number: 9001805
    Abstract: An electronic device having network connection function includes a receiving unit and a control unit, where the electronic device and an access point support a plurality of connection modes. The receiving unit is utilized for receiving a signal from the access point. The control unit is utilized for selecting a specific connection mode from the plurality of connection modes according to a determination result generated by determining whether the signal satisfies a predetermined condition, and starting to connect to the access point by using the specific connection mode, where a data rate of the specific connection mode is not a highest data rate among that of the plurality of connection modes.
    Type: Grant
    Filed: January 3, 2012
    Date of Patent: April 7, 2015
    Assignee: Realtek Semiconductor Corp.
    Inventors: Hsin-I Chou, Kuang-Yu Yen, San-Ho Wei
  • Patent number: 8741776
    Abstract: A method for patterning a plurality of features in a non-rectangular pattern on an integrated circuit device includes providing a substrate including a surface with a first layer and a second layer. Forming a plurality of elongated protrusions in a third layer above the first and second layers. Forming a first patterned layer over the plurality of elongated protrusions. The plurality of elongated protrusions are etched to form a first pattern of the elongated protrusions, the first pattern including at least one inside corner. Forming a second patterned layer over the first pattern of elongated protrusions and forming a third patterned layer over the first pattern of elongated protrusions. The plurality of elongated protrusions are etched using the second and third patterned layers to form a second pattern of the elongated protrusions, the second pattern including at least one inside corner.
    Type: Grant
    Filed: February 7, 2012
    Date of Patent: June 3, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ho Wei De, Ming-Feng Shieh, Ching-Yu Chang
  • Publication number: 20140139666
    Abstract: An electronic viewer for peephole contains an image capture unit for shooting images; a main circuit board including an application specific integrated circuit electrically connected with the image capture unit so as to control the image capture unit to shoot the images; a flat panel display unit electrically connected with the main circuit board so as to display the images shot by the image capture unit; an ambient light sensor electrically coupled with the main circuit board so as to sense a change of an ambient light source. Thereby, when the ambient light source changes, an electronic viewer is driven to operate the application specific integrated circuit, and the application specific integrated circuit controls the image capture unit to shoot the images so that the flat panel display unit displays the images.
    Type: Application
    Filed: November 18, 2013
    Publication date: May 22, 2014
    Applicant: Brinno Incorporated
    Inventor: Tien-Ho WEI
  • Patent number: 8511782
    Abstract: A method for printing on a curved surface includes determining if a surface of a workpiece is curved, cutting an image to be printed into at least two printing areas if the surface is curved, and printing the printing area of the image on each surface of the workpiece. If the surfaces of the workpiece are not curved, the printing system directly prints the image on the workpiece. The printing system includes a rotating mechanism and a printer including an inkjet head having a plurality of nozzles. The workpiece is positioned on the rotating mechanism. The rotating mechanism rotates each surface of the workpiece to face the inkjet head and the inkjet head prints each printing area on it.
    Type: Grant
    Filed: January 7, 2010
    Date of Patent: August 20, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yuan-Ping Chang, Ching-Ho Wei, Li-Chi Pai, Chang-Chin Wu
  • Publication number: 20130210232
    Abstract: A method for patterning a plurality of features in a non-rectangular pattern, such as on an integrated circuit device, includes providing a substrate including a surface with a plurality of elongated protrusions, the elongated protrusions extending in a first direction. A first layer is formed above the surface and above the plurality of elongated protrusions, and patterned with an end cutting mask. The end cutting mask includes two nearly-adjacent patterns with a sub-resolution feature positioned and configured such that when the resulting pattern on the first layer includes the two nearly adjacent patterns and a connection there between. The method further includes cutting ends of the elongated protrusions using the pattern on the first layer.
    Type: Application
    Filed: February 9, 2012
    Publication date: August 15, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ho Wei De, Kuei-Liang Lu, Ming-Feng Shieh, Ching-Yu Chang
  • Publication number: 20130203257
    Abstract: A method for patterning a plurality of features in a non-rectangular pattern on an integrated circuit device includes providing a substrate including a surface with a first layer and a second layer, forming a plurality of elongated protrusions in a third layer above the first and second layers, and forming a first patterned layer over the plurality of elongated protrusions. The plurality of elongated protrusions are etched to form a first pattern of the elongated protrusions, the first pattern including at least one inside corner. The method also includes forming a second patterned layer over the first pattern of elongated protrusions and forming a third patterned layer over the first pattern of elongated protrusions. The plurality of elongated protrusions are etched using the second and third patterned layers to form a second pattern of the elongated protrusions, the second pattern including at least one inside corner.
    Type: Application
    Filed: February 7, 2012
    Publication date: August 8, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ho Wei De, Ming-Feng Shieh, Ching-Yu Chang
  • Patent number: 8483681
    Abstract: A channel scanning method applied to a wireless communication system for scanning a plurality of channels to select target channels capable of establishing corresponding connections is disclosed. The channel scanning method includes scanning a plurality of channels for determining if any of the channels is capable of establishing a corresponding connection; setting the channels capable of establishing corresponding connections to be a plurality of target channels; and scanning the target channels for determining if the target channels are capable of establishing corresponding connections, respectively.
    Type: Grant
    Filed: November 5, 2006
    Date of Patent: July 9, 2013
    Assignee: Realtek Semiconductor Corp.
    Inventors: Ying-Zhe Hun, Kuo-Chuan Wu, San-Ho Wei
  • Patent number: 8246131
    Abstract: An inkjet printer includes an inkjet cartridge, an inkjet head, a controller, a viscosity adjustment device and a viscometer. The inkjet cartridge is filled with ink. The inkjet head is connected to the inkjet cartridge. The catcher plate is opposite to the inkjet head, and connected to the cartridge. The viscometer is configured for determining a viscosity of ink in the inkjet cartridge. The viscosity adjustment device is configured for adjusting viscosity of ink in the inkjet cartridge. The controller is electrically connected to the inkjet head, the viscometer, and the viscosity adjustment device, respectively.
    Type: Grant
    Filed: December 29, 2009
    Date of Patent: August 21, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chen-Hsing Cheng, Tsung-Yu Hung, Ching-Ho Wei, Chang-Chin Wu
  • Publication number: 20120177020
    Abstract: An electronic device having network connection function includes a receiving unit and a control unit, where the electronic device and an access point support a plurality of connection modes. The receiving unit is utilized for receiving a signal from the access point. The control unit is utilized for selecting a specific connection mode from the plurality of connection modes according to a determination result generated by determining whether the signal satisfies a predetermined condition, and starting to connect to the access point by using the specific connection mode, where a data rate of the specific connection mode is not a highest data rate among that of the plurality of connection modes.
    Type: Application
    Filed: January 3, 2012
    Publication date: July 12, 2012
    Inventors: Hsin-I Chou, Kuang-Yu Yen, San-Ho Wei
  • Patent number: 8170747
    Abstract: A fleet maintenance method for generating a suggested speed for each vehicle in a fleet to maintain the vehicle in the fleet is provided. In the fleet maintenance method, vehicles are clustered into a plurality of sub-fleets, and in each sub-fleet, one vehicle is selected as a leader vehicle and the other vehicles are considered as member vehicles. Besides, a position coordinate and a speed of each vehicle in each sub-fleet are obtained, and the position coordinate is converted into a corresponding linear coordinate. In addition, a sub-fleet gravity center of each sub-fleet and a fleet gravity center of the entire fleet are calculated according to the linear coordinates. Moreover, a suggested speed of each leader vehicle is generated according to a gravity center distance of the leader vehicle, and a suggested speed of each member vehicle is generated.
    Type: Grant
    Filed: August 10, 2009
    Date of Patent: May 1, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Chien Chen, Ho-Wei Tsai, Je-Wei Chang, Rong-Hong Jan, Hsia-Hsin Li
  • Patent number: D814064
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: March 27, 2018
    Inventor: Ho Wei Chon Alvin