Patents by Inventor Ho Wei
Ho Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250010390Abstract: An active metal brazing substrate material and a method for producing the same are provided. The active metal brazing substrate material includes a ceramic substrate layer, a first brazing layer, a second brazing layer, and a conductive metal layer that are sequentially stacked. The first brazing layer includes a first metal composite material, which includes silver (Ag), copper (Cu), and a first active metal element. Based on a total weight of the first metal composite material being 100 parts by weight, a silver content is not less than 50 parts by weight. The second brazing layer includes a second metal composite material. The second metal composite material includes a low melting point metal element (e.g., Sn), copper (Cu), and a second active metal element, but does not include silver. A melting point of the low melting metal element is between 130° C. and 350° C.Type: ApplicationFiled: October 13, 2023Publication date: January 9, 2025Inventors: CHIH-WEI MAO, TSUNG-YING CHANG, CHUNG-HO WEI, MING-YI HSU, CHI-WEN HUANG
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Publication number: 20250010408Abstract: An active metal brazing substrate material and a method for producing the same are provided. The active metal brazing substrate material includes a ceramic substrate layer, a first brazing layer, a second brazing layer, and a conductive metal layer that are sequentially stacked. The first brazing layer includes a first metal composite material, which includes silver (Ag), copper (Cu), and a first active metal element. Based on a total weight of the first metal composite material being 100 parts by weight, a silver content is not less than 50 parts by weight. The second brazing layer includes a second metal composite material, which includes aluminum (Al), copper (Cu), and a second active metal element, but does not contain silver. Based on a total weight of the second metal composite material being 100 parts by weight, an aluminum content is not less than 40 parts by weight.Type: ApplicationFiled: October 12, 2023Publication date: January 9, 2025Inventors: CHIH-WEI MAO, TSUNG-YING CHANG, CHUNG-HO WEI, MING-YI HSU, CHI-WEN HUANG
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Publication number: 20250013307Abstract: Embodiments described herein relate to systems and methods for a multisensory digital interaction experience to create simulated in-person experiences of apparel and material, such as garments and fabric. The system generates digital output for an online web application or device hosted application. In one embodiment, the system provides the multisensory digital interaction experience that matches device capacity, experience context, and the best interaction type for the tactile representation values associated with manufactured apparel.Type: ApplicationFiled: November 24, 2022Publication date: January 9, 2025Inventors: Ellisa Kathleen CALDER, Timothy Ryan MCGEE, Daniel Patrick RYDER, Sarah Renee PARNES ROGOWSKY, Piengpatou Clarissa JUNCHAYA, Charles YUST, Tammy BAIRD, Ho-Wei HSU, Antonello CRIMI, Hidekazu SAEGUSA
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Patent number: 10580957Abstract: A thermoelectric material structure includes a substrate, at least one spacing layer, and at least one two-dimensional (2D) material layer. The substrate has a surface. The 2D material layer and the spacing layer are overlapped and disposed on the surface of the substrate. The thermal conductivity of the 2D material layer along the direction perpendicular to the surface of the substrate is less than 10 W/mK.Type: GrantFiled: September 11, 2017Date of Patent: March 3, 2020Assignee: SULFURSCIENCE TECHNOLOGY CO., LTD.Inventors: Zhen-Yu Juang, Ho-Wei Wang, Sung-Yen Wei
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Publication number: 20180138388Abstract: A thermoelectric material structure includes a substrate, at least one spacing layer, and at least one two-dimensional (2D) material layer. The substrate has a surface. The 2D material layer and the spacing layer are overlapped and disposed on the surface of the substrate. The thermal conductivity of the 2D material layer along the direction perpendicular to the surface of the substrate is less than 10 W/mK.Type: ApplicationFiled: September 11, 2017Publication date: May 17, 2018Inventors: Zhen-Yu JUANG, Ho-Wei WANG
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Publication number: 20160274455Abstract: A method of optimizing a semiconductor mask layout is provided. The method includes accessing a digital file comprising the semiconductor mask layout, accessing processing condition parameters describing process conditions, receiving a request from a user of a mask layout system to initiate a semiconductor mask layout optimization process, applying a set of rules to insert an array of assist features into the semiconductor mask layout, and updating the digital file. The semiconductor mask layout includes a plurality of parallel mask features, wherein pairs of the parallel mask features share an end-to-end region between the parallel mask features of each pair, with an imaginary axis bisecting the end-to-end regions. Each assist feature is located proximate to at least one end-to-end region, and the imaginary axis intersects each assist feature. Related photomasks, design layout systems, and computer-readable media are also provided.Type: ApplicationFiled: March 16, 2015Publication date: September 22, 2016Inventors: Ho Wei-De, Chi-Yuan Sun, Ya Hui Chang, Hung-Chang Hsieh
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Patent number: 9236267Abstract: A method for patterning a plurality of features in a non-rectangular pattern, such as on an integrated circuit device, includes providing a substrate including a surface with a plurality of elongated protrusions, the elongated protrusions extending in a first direction. A first layer is formed above the surface and above the plurality of elongated protrusions, and patterned with an end cutting mask. The end cutting mask includes two nearly-adjacent patterns with a sub-resolution feature positioned and configured such that when the resulting pattern on the first layer includes the two nearly adjacent patterns and a connection there between. The method further includes cutting ends of the elongated protrusions using the pattern on the first layer.Type: GrantFiled: February 9, 2012Date of Patent: January 12, 2016Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ho Wei De, Kuei-Liang Lu, Ming-Feng Shieh, Ching-Yu Chang
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Publication number: 20150214161Abstract: A semiconductor structure comprising a tray, a chip, a first grounding wire and a second grounding wire is provided. The tray has a first surface and a second surface, and there is a height difference existing between the first surface and the second surface. The chip is disposed on the first surface of the tray and has an active surface. The first grounding wire connects the active surface and the second surface. The second grounding wire connects the first surface and the second surface.Type: ApplicationFiled: May 28, 2014Publication date: July 30, 2015Applicant: ALi CorporationInventor: Ho-Wei CHANG
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Publication number: 20150181716Abstract: A method for manufacturing a touch panel includes the following procedures. A base plate is provided. An indium tin oxide film is formed on the base plate. The indium tin oxide film is etched to form a plurality of first and second electrodes which are alternatively arranged according to columns on the base plate and insulated from each other, and the first electrodes in a column along a first direction are electrically coupled to each other. A plurality of insulated layers is formed on the first and second electrodes. A plurality of conductive connectors are formed on the plurality of insulated layers via an ink jet printing method to electrically interconnect with the second electrodes in a column along the second direction intersecting the first direction. The widths of the conductive connectors are reduced below 10 ?m via a laser processing method.Type: ApplicationFiled: December 19, 2014Publication date: June 25, 2015Inventors: TEN-HSING JAW, CHIN-YANG WU, SZU-WEI SUNG, CHING-HO WEI
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Patent number: 9001805Abstract: An electronic device having network connection function includes a receiving unit and a control unit, where the electronic device and an access point support a plurality of connection modes. The receiving unit is utilized for receiving a signal from the access point. The control unit is utilized for selecting a specific connection mode from the plurality of connection modes according to a determination result generated by determining whether the signal satisfies a predetermined condition, and starting to connect to the access point by using the specific connection mode, where a data rate of the specific connection mode is not a highest data rate among that of the plurality of connection modes.Type: GrantFiled: January 3, 2012Date of Patent: April 7, 2015Assignee: Realtek Semiconductor Corp.Inventors: Hsin-I Chou, Kuang-Yu Yen, San-Ho Wei
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Patent number: 8741776Abstract: A method for patterning a plurality of features in a non-rectangular pattern on an integrated circuit device includes providing a substrate including a surface with a first layer and a second layer. Forming a plurality of elongated protrusions in a third layer above the first and second layers. Forming a first patterned layer over the plurality of elongated protrusions. The plurality of elongated protrusions are etched to form a first pattern of the elongated protrusions, the first pattern including at least one inside corner. Forming a second patterned layer over the first pattern of elongated protrusions and forming a third patterned layer over the first pattern of elongated protrusions. The plurality of elongated protrusions are etched using the second and third patterned layers to form a second pattern of the elongated protrusions, the second pattern including at least one inside corner.Type: GrantFiled: February 7, 2012Date of Patent: June 3, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ho Wei De, Ming-Feng Shieh, Ching-Yu Chang
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Publication number: 20140139666Abstract: An electronic viewer for peephole contains an image capture unit for shooting images; a main circuit board including an application specific integrated circuit electrically connected with the image capture unit so as to control the image capture unit to shoot the images; a flat panel display unit electrically connected with the main circuit board so as to display the images shot by the image capture unit; an ambient light sensor electrically coupled with the main circuit board so as to sense a change of an ambient light source. Thereby, when the ambient light source changes, an electronic viewer is driven to operate the application specific integrated circuit, and the application specific integrated circuit controls the image capture unit to shoot the images so that the flat panel display unit displays the images.Type: ApplicationFiled: November 18, 2013Publication date: May 22, 2014Applicant: Brinno IncorporatedInventor: Tien-Ho WEI
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Patent number: 8511782Abstract: A method for printing on a curved surface includes determining if a surface of a workpiece is curved, cutting an image to be printed into at least two printing areas if the surface is curved, and printing the printing area of the image on each surface of the workpiece. If the surfaces of the workpiece are not curved, the printing system directly prints the image on the workpiece. The printing system includes a rotating mechanism and a printer including an inkjet head having a plurality of nozzles. The workpiece is positioned on the rotating mechanism. The rotating mechanism rotates each surface of the workpiece to face the inkjet head and the inkjet head prints each printing area on it.Type: GrantFiled: January 7, 2010Date of Patent: August 20, 2013Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Yuan-Ping Chang, Ching-Ho Wei, Li-Chi Pai, Chang-Chin Wu
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Publication number: 20130210232Abstract: A method for patterning a plurality of features in a non-rectangular pattern, such as on an integrated circuit device, includes providing a substrate including a surface with a plurality of elongated protrusions, the elongated protrusions extending in a first direction. A first layer is formed above the surface and above the plurality of elongated protrusions, and patterned with an end cutting mask. The end cutting mask includes two nearly-adjacent patterns with a sub-resolution feature positioned and configured such that when the resulting pattern on the first layer includes the two nearly adjacent patterns and a connection there between. The method further includes cutting ends of the elongated protrusions using the pattern on the first layer.Type: ApplicationFiled: February 9, 2012Publication date: August 15, 2013Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Ho Wei De, Kuei-Liang Lu, Ming-Feng Shieh, Ching-Yu Chang
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Publication number: 20130203257Abstract: A method for patterning a plurality of features in a non-rectangular pattern on an integrated circuit device includes providing a substrate including a surface with a first layer and a second layer, forming a plurality of elongated protrusions in a third layer above the first and second layers, and forming a first patterned layer over the plurality of elongated protrusions. The plurality of elongated protrusions are etched to form a first pattern of the elongated protrusions, the first pattern including at least one inside corner. The method also includes forming a second patterned layer over the first pattern of elongated protrusions and forming a third patterned layer over the first pattern of elongated protrusions. The plurality of elongated protrusions are etched using the second and third patterned layers to form a second pattern of the elongated protrusions, the second pattern including at least one inside corner.Type: ApplicationFiled: February 7, 2012Publication date: August 8, 2013Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Ho Wei De, Ming-Feng Shieh, Ching-Yu Chang
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Patent number: 8483681Abstract: A channel scanning method applied to a wireless communication system for scanning a plurality of channels to select target channels capable of establishing corresponding connections is disclosed. The channel scanning method includes scanning a plurality of channels for determining if any of the channels is capable of establishing a corresponding connection; setting the channels capable of establishing corresponding connections to be a plurality of target channels; and scanning the target channels for determining if the target channels are capable of establishing corresponding connections, respectively.Type: GrantFiled: November 5, 2006Date of Patent: July 9, 2013Assignee: Realtek Semiconductor Corp.Inventors: Ying-Zhe Hun, Kuo-Chuan Wu, San-Ho Wei
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Patent number: 8246131Abstract: An inkjet printer includes an inkjet cartridge, an inkjet head, a controller, a viscosity adjustment device and a viscometer. The inkjet cartridge is filled with ink. The inkjet head is connected to the inkjet cartridge. The catcher plate is opposite to the inkjet head, and connected to the cartridge. The viscometer is configured for determining a viscosity of ink in the inkjet cartridge. The viscosity adjustment device is configured for adjusting viscosity of ink in the inkjet cartridge. The controller is electrically connected to the inkjet head, the viscometer, and the viscosity adjustment device, respectively.Type: GrantFiled: December 29, 2009Date of Patent: August 21, 2012Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Chen-Hsing Cheng, Tsung-Yu Hung, Ching-Ho Wei, Chang-Chin Wu
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Publication number: 20120177020Abstract: An electronic device having network connection function includes a receiving unit and a control unit, where the electronic device and an access point support a plurality of connection modes. The receiving unit is utilized for receiving a signal from the access point. The control unit is utilized for selecting a specific connection mode from the plurality of connection modes according to a determination result generated by determining whether the signal satisfies a predetermined condition, and starting to connect to the access point by using the specific connection mode, where a data rate of the specific connection mode is not a highest data rate among that of the plurality of connection modes.Type: ApplicationFiled: January 3, 2012Publication date: July 12, 2012Inventors: Hsin-I Chou, Kuang-Yu Yen, San-Ho Wei
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Patent number: 8170747Abstract: A fleet maintenance method for generating a suggested speed for each vehicle in a fleet to maintain the vehicle in the fleet is provided. In the fleet maintenance method, vehicles are clustered into a plurality of sub-fleets, and in each sub-fleet, one vehicle is selected as a leader vehicle and the other vehicles are considered as member vehicles. Besides, a position coordinate and a speed of each vehicle in each sub-fleet are obtained, and the position coordinate is converted into a corresponding linear coordinate. In addition, a sub-fleet gravity center of each sub-fleet and a fleet gravity center of the entire fleet are calculated according to the linear coordinates. Moreover, a suggested speed of each leader vehicle is generated according to a gravity center distance of the leader vehicle, and a suggested speed of each member vehicle is generated.Type: GrantFiled: August 10, 2009Date of Patent: May 1, 2012Assignee: Industrial Technology Research InstituteInventors: Chien Chen, Ho-Wei Tsai, Je-Wei Chang, Rong-Hong Jan, Hsia-Hsin Li
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Patent number: D814064Type: GrantFiled: March 22, 2016Date of Patent: March 27, 2018Inventor: Ho Wei Chon Alvin