Patents by Inventor Ho-Wei WANG

Ho-Wei WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermoelectric material structure
    Patent number: 10580957
    Abstract: A thermoelectric material structure includes a substrate, at least one spacing layer, and at least one two-dimensional (2D) material layer. The substrate has a surface. The 2D material layer and the spacing layer are overlapped and disposed on the surface of the substrate. The thermal conductivity of the 2D material layer along the direction perpendicular to the surface of the substrate is less than 10 W/mK.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: March 3, 2020
    Assignee: SULFURSCIENCE TECHNOLOGY CO., LTD.
    Inventors: Zhen-Yu Juang, Ho-Wei Wang, Sung-Yen Wei
  • THERMOELECTRIC MATERIAL STRUCTURE
    Publication number: 20180138388
    Abstract: A thermoelectric material structure includes a substrate, at least one spacing layer, and at least one two-dimensional (2D) material layer. The substrate has a surface. The 2D material layer and the spacing layer are overlapped and disposed on the surface of the substrate. The thermal conductivity of the 2D material layer along the direction perpendicular to the surface of the substrate is less than 10 W/mK.
    Type: Application
    Filed: September 11, 2017
    Publication date: May 17, 2018
    Inventors: Zhen-Yu JUANG, Ho-Wei WANG