Abstract: A power amplifier having a stack structure comprises a first driver stage that receives a power voltage from a power supply and receives and amplifies an input signal; a second driver stage that receives the power voltage from the power supply, has an input terminal connected with an output terminal of the first driver stage, and receives and amplifies an output signal from the first driver stage; and a power stage that has a power input terminal connected with a ground terminal of the first driver stage and a ground terminal of the second driver stage and receives a virtual ground voltage, and has an input terminal connected with an output terminal of the second driver stage and receives and amplifies an output signal from the second driver stage.

Abstract: A power amplifier having a stack structure comprises a first driver stage that receives a power voltage from a power supply and receives and amplifies an input signal; a second driver stage that receives the power voltage from the power supply, has an input terminal connected with an output terminal of the first driver stage, and receives and amplifies an output signal from the first driver stage; and a power stage that has a power input terminal connected with a ground terminal of the first driver stage and a ground terminal of the second driver stage and receives a virtual ground voltage, and has an input terminal connected with an output terminal of the second driver stage and receives and amplifies an output signal from the second driver stage.

Abstract: A power amplifier having a stack structure, including: a first driver stage that receives a power voltage from a power supply and receives and amplifies an input signal; a second driver stage that has a power input terminal connected with a ground terminal of the first driver stage and receiving a virtual power voltage and an input terminal connected with an output terminal of the first driver stage, and receives and amplifies an output signal from the first driver stage; and a power stage that receives the power voltage from the power supply, has an input terminal connected with an output terminal of the second driver stage, and receives and amplifies an output signal from the second driver stage.

Abstract: A power amplifier having a stack structure, including: a first driver stage that receives a power voltage from a power supply and receives and amplifies an input signal; a second driver stage that has a power input terminal connected with a ground terminal of the first driver stage and receiving a virtual power voltage and an input terminal connected with an output terminal of the first driver stage, and receives and amplifies an output signal from the first driver stage; and a power stage that receives the power voltage from the power supply, has an input terminal connected with an output terminal of the second driver stage, and receives and amplifies an output signal from the second driver stage.

Abstract: Disclosed is a transformer using a symmetrical printing pattern which includes: a substrate; a plurality of first printing lines printed at predetermined distances on the substrate; a plurality of second printing lines printed at predetermined distances on the substrate; first bonding wires connecting the first printing lines; and second bonding wires connecting the second printing lines, in which the first printing lines and the second printing lines are printed in a symmetrical printing pattern, respectively, on the substrate, and the first bonding wires and the second bonding wires are formed symmetrically, respectively.

Abstract: Provided is a power voltage supply apparatus of a 3-dimensional (3D) semiconductor. The power voltage supply apparatus includes a plurality of integrated circuits (ICs) which each include a first through silicon via (TSV) and a second TSV, are stacked such that the first TSVs are connected and second TSVs are connected, and are mounted on a printed circuit board (PCB), wherein a first PCB line formed on the PCB and supplying a first voltage is connected to a bottom of a first TSV of a bottom IC from among the plurality of ICs, and a second PCB line formed on the PCB and supplying a second voltage is connected to a top of a second TSV of a top IC.

Abstract: Provided is an integrated circuit (IC) having a stacked structure. The IC includes: a first IC having a power input terminal to which a power supply voltage is applied; and a second IC having a power input terminal connected to a ground terminal of the first IC, having a central node formed as the power input terminal of the second IC and the ground terminal of the first IC are connected to each other and to which a voltage is applied, and having a ground terminal connected to a ground source, wherein the power supply voltage is divided into first and second voltages that are respectively applied to the first and second ICs.

Abstract: Disclosed is a transformer using a symmetrical printing pattern which includes: a substrate; a plurality of first printing lines printed at predetermined distances on the substrate; a plurality of second printing lines printed at predetermined distances on the substrate; first bonding wires connecting the first printing lines; and second bonding wires connecting the second printing lines, in which the first printing lines and the second printing lines are printed in a symmetrical printing pattern, respectively, on the substrate, and the first bonding wires and the second bonding wires are formed symmetrically, respectively.

Abstract: Provided is an integrated circuit (IC) having a stacked structure. The IC includes: a first IC having a power input terminal to which a power supply voltage is applied; and a second IC having a power input terminal connected to a ground terminal of the first IC, having a central node formed as the power input terminal of the second IC and the ground terminal of the first IC are connected to each other and to which a voltage is applied, and having a ground terminal connected to a ground source, wherein the power supply voltage is divided into first and second voltages that are respectively applied to the first and second ICs.

Abstract: Provided is a power voltage supply apparatus of a 3-dimensional (3D) semiconductor. The power voltage supply apparatus includes a plurality of integrated circuits (ICs) which each include a first through silicon via (TSV) and a second TSV, are stacked such that the first TSVs are connected and second TSVs are connected, and are mounted on a printed circuit board (PCB), wherein a first PCB line formed on the PCB and supplying a first voltage is connected to a bottom of a first TSV of a bottom IC from among the plurality of ICs, and a second PCB line formed on the PCB and supplying a second voltage is connected to a top of a second TSV of a top IC.