Patents by Inventor Ho Yoon KIM
Ho Yoon KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11562858Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and first and second internal electrodes; first and second external electrodes; and an insulator disposed on a first surface of the capacitor body. The capacitor body includes an active region in which first and second internal electrodes overlap each other in a first direction, and upper and lower covers disposed above and below the active region in the first direction. A length of the active region in the second direction is defined as ‘La’, a length of one margin of the capacitor body in the second direction is defined as ‘Lm’, a height of the active region in the first direction is defined as ‘Ta’, a thickness of the lower cover of the capacitor body is defined as ‘Tc’, and a thickness of the insulator is defined as ‘Te’. A relative displacement index, ((La/Lm)?(Ta/Tc))/Te)2, ranges from 0.003 to 0.055.Type: GrantFiled: June 3, 2021Date of Patent: January 24, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ho Yoon Kim, Man Su Byun
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Publication number: 20220189695Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and first and second internal electrodes; first and second external electrodes; and an insulator disposed on a first surface of the capacitor body. The capacitor body includes an active region in which first and second internal electrodes overlap each other in a first direction, and upper and lower covers disposed above and below the active region in the first direction. A length of the active region in the second direction is defined as ‘La’, a length of one margin of the capacitor body in the second direction is defined as ‘Lm’, a height of the active region in the first direction is defined as ‘Ta’, a thickness of the lower cover of the capacitor body is defined as ‘Tc’, and a thickness of the insulator is defined as ‘Te’. A relative displacement index, ((La/Lm)?(Ta/Tc))/Te)2, ranges from 0.003 to 0.055.Type: ApplicationFiled: June 3, 2021Publication date: June 16, 2022Inventors: Ho Yoon Kim, Man Su Byun
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Publication number: 20220181084Abstract: The present disclosure provides a multilayer capacitor and a board component having the same. The multilayer capacitor includes: a capacitor body including dielectric layers, and first and second internal electrodes that are alternately disposed with the dielectric layers interposed therebetween, and having first to sixth surfaces; first and second external electrodes disposed on opposite end portions of the capacitor body in a direction perpendicular to the third and fourth surfaces, and connected to the first and second internal electrodes, respectively; an insulator disposed on the first surface of the capacitor body; a first conductive resin layer covering the first external electrode and one end portion of the insulator in the direction; and a second conductive resin layer covering the second external electrode and the other end portion of the insulator in the direction.Type: ApplicationFiled: November 23, 2021Publication date: June 9, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Man Su BYUN, Ho Yoon KIM, Min Kyoung CHEON, Soo Hwan SON, Won Chul SIM
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Patent number: 11328870Abstract: An electronic component includes a multilayer capacitor including a capacitor body having first to sixth surfaces, and first and second external electrodes; and an interposer including an interposer body and first and second external terminals; and the capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes, the first and second internal electrodes are exposed through the third and fourth surfaces of the capacitor body, respectively, and the interposer further includes first and second solder fillet limiting layers disposed on upper sides of both surfaces of each of the first and second external terminals in the first direction, respectively.Type: GrantFiled: April 20, 2020Date of Patent: May 10, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ho Yoon Kim, Yeong Lim Kwon
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Patent number: 11289273Abstract: An electronic component includes a multilayer capacitor and an interposer. First and second internal electrodes of the multilayer capacitor are such that 0.95?{(Wm1+Wm2)/Wa}/{(Lm1+Lm2)/La}?4.93, in which Lm2 is a distance between a first internal electrode and a fourth surface of a capacitor body, Lm1 is a distance between a second internal electrode and a third surface of the capacitor body opposite the fourth surface in a first direction, Wm1 is a distance between the first or second internal electrode and a second surface of the capacitor body, Wm2 is a distance between the first or second internal electrode and a first surface of the capacitor body opposite the second surface in a third direction, La is a length in the first direction of a region of overlap of the first and second internal electrodes, and Wa is a length in the third direction of the region of overlap.Type: GrantFiled: April 16, 2020Date of Patent: March 29, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Ho Yoon Kim
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Patent number: 11276528Abstract: An electronic component includes a multilayer capacitor, including a capacitor body and first and second external electrodes disposed on both ends of the capacitor body, respectively, in a first direction, and a interposer including an interposer body and first and second external terminals in a second direction. The capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes exposed through the both ends of the capacitor body, respectively. The first and second external terminals each include a first layer including CuNi, a second layer covering the first layer and including copper (Cu), a third layer covering the second layer and including nickel (Ni), and a fourth layer covering the third layer and including tin (Sn), which are sequentially disposed from a respective inner side of the first and second external terminals.Type: GrantFiled: April 15, 2020Date of Patent: March 15, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Man Su Byun, Ho Yoon Kim, Soo Hwan Son
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Patent number: 11206737Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.Type: GrantFiled: April 23, 2020Date of Patent: December 21, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Man Su Byun, Ho Yoon Kim, Kyung Hwa Yu, Dae Heon Jeong, Min Kyoung Cheon, Soo Hwan Son
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Patent number: 11166375Abstract: A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.Type: GrantFiled: November 22, 2019Date of Patent: November 2, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Man Su Byun, Ho Yoon Kim, Kyung Hwa Yu, Dae Heon Jeong, Min Kyoung Cheon, Soo Hwan Son
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Patent number: 11094461Abstract: A composite electronic component includes a composite body that includes a multilayer ceramic capacitor and a ceramic chip coupled to each other. The multilayer ceramic capacitor includes a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes are disposed on both end portions of the first ceramic body. The ceramic chip is disposed on a lower portion of the multilayer ceramic capacitor and includes a second ceramic body and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes, respectively. A plurality of electrodes are disposed in the second ceramic body.Type: GrantFiled: March 9, 2020Date of Patent: August 17, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soo Hwan Son, Jong Duck Kim, Dae Heon Jeong, Ho Yoon Kim
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Publication number: 20210202174Abstract: An electronic component includes a multilayer capacitor including a capacitor body having first to sixth surfaces, and first and second external electrodes; and an interposer including an interposer body and first and second external terminals; and the capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes, the first and second internal electrodes are exposed through the third and fourth surfaces of the capacitor body, respectively, and the interposer further includes first and second solder fillet limiting layers disposed on upper sides of both surfaces of each of the first and second external terminals in the first direction, respectively.Type: ApplicationFiled: April 20, 2020Publication date: July 1, 2021Inventors: Ho Yoon KIM, Yeong Lim KWON
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Patent number: 11043333Abstract: A composite electronic component includes: a composite body including a multilayer ceramic capacitor coupled to a ceramic chip, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween are stacked and first and second external electrodes disposed on opposite end portions of the first ceramic body in a length direction, respectively, and the ceramic chip including a second ceramic body including ceramic and first and second terminal electrodes, wherein a ratio of a length of the ceramic chip to a length of the multilayer ceramic capacitor is 0.7 to 1.0, and a ratio of a sum of a length of the first terminal electrode and a length of the second terminal electrode to the length of the ceramic chip is 0.3 to 0.6.Type: GrantFiled: November 20, 2018Date of Patent: June 22, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soo Hwan Son, Ho Yoon Kim, Sang Soo Park, Woo Chul Shin
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Patent number: 11037730Abstract: An electronic component includes a body; first and second external electrodes including first and second connection portions and first and second band portions, respectively; and first and second metal frames connected to the first and second external electrodes, respectively, wherein the first and second metal frames include first and second support portions bonded to the first and second connection portions, and first and second mounting portions extended in the first direction from lower ends of the first and second support portions and spaced apart from the body and the first and second external electrodes, and further include first and second insulating layers formed on external surfaces of the first and second support portions.Type: GrantFiled: November 26, 2018Date of Patent: June 15, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ho Yoon Kim, Woo Chul Shin, Sang Soo Park
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Publication number: 20210175019Abstract: An electronic component includes a multilayer capacitor, including a capacitor body and first and second external electrodes disposed on both ends of the capacitor body, respectively, in a first direction, and a interposer including an interposer body and first and second external terminals in a second direction. The capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes exposed through the both ends of the capacitor body, respectively. The first and second external terminals each include a first layer including CuNi, a second layer covering the first layer and including copper (Cu), a third layer covering the second layer and including nickel (Ni), and a fourth layer covering the third layer and including tin (Sn), which are sequentially disposed from a respective inner side of the first and second external terminals.Type: ApplicationFiled: April 15, 2020Publication date: June 10, 2021Inventors: Man Su Byun, Ho Yoon Kim, Soo Hwan Son
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Publication number: 20210175018Abstract: An electronic component includes a multilayer capacitor and an interposer. First and second internal electrodes of the multilayer capacitor are such that 0.95?{(Wm1+Wm2)/Wa}/{(Lm1+Lm2)/La}?4.93, in which Lm2 is a distance between a first internal electrode and a fourth surface of a capacitor body, Lm1 is a distance between a second internal electrode and a third surface of the capacitor body opposite the fourth surface in a first direction, Wm1 is a distance between the first or second internal electrode and a second surface of the capacitor body, Wm2 is a distance between the first or second internal electrode and a first surface of the capacitor body opposite the second surface in a third direction, La is a length in the first direction of a region of overlap of the first and second internal electrodes, and Wa is a length in the third direction of the region of overlap.Type: ApplicationFiled: April 16, 2020Publication date: June 10, 2021Inventor: Ho Yoon KIM
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Patent number: 10937581Abstract: A hybrid inductor includes an inductor body having a core part in which a coil part is disposed, and first and second cover parts having the core part interposed therebetween. The core part includes magnetic metal layers, and the first and second cover parts include ferrite layers.Type: GrantFiled: February 4, 2019Date of Patent: March 2, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ho Yoon Kim, Yu Jin Choi, Soo Hwan Son, Min Kyoung Cheon
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Patent number: 10923282Abstract: An electronic component includes: a multilayer ceramic capacitor including a capacitor body and a pair of external electrodes, and an interposer including an interposer body having grooves and a pair of external terminals. Each of the external terminals includes a bonding portion, a mounting portion and a connection portion; and ?L=|A-A?|/2 in which A is a distance from one end portion of the interposer in a length direction to one end portion of the multilayer ceramic capacitor in the length direction, A? is a distance from the other end portion of the interposer in the length direction to the other end portion of the multilayer ceramic capacitor in the length direction, and ?L is an offset between the multilayer ceramic capacitor and the interposer in the length direction, and ?L/L?0.100 in which L is a length of the multilayer ceramic capacitor.Type: GrantFiled: April 28, 2020Date of Patent: February 16, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTDInventors: Ho Yoon Kim, Sang Soo Park, Woo Chul Shin
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Patent number: 10916376Abstract: An electronic component includes a multilayer capacitor including a capacitor body and an external electrode disposed at an end of the capacitor body, and an interposer including an interposer body and an external terminal disposed at an end of the interposer body. The external terminal includes a bonding portion disposed on a first surface of the interposer body and connected to the external electrode, a mounting portion disposed on a second surface of the interposer body opposing the first surface, and a connection portion disposed on an end surface of the interposer body to connect the bonding portion and the mounting portion and having an uneven surface, and a conductive bonding agent is disposed between the external electrode and the bonding portion of the external terminals, and an adhesive extends to a portion of the uneven surface.Type: GrantFiled: November 26, 2018Date of Patent: February 9, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Man Su Byun, Ho Yoon Kim, Sang Soo Park, Woo Chul Shin
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Patent number: 10910157Abstract: An electronic component includes a multilayer capacitor, including a capacitor body, and a pair of external electrodes disposed on both ends of the capacitor body, respectively, and an interposer, including an interposer body, and a pair of external terminals disposed on both ends of the interposer body, respectively. The external terminals include bonding portions, mounting portions, and connection portions disposed to connect the bonding portions and the mounting portions to each other. Adhesives are provided between the external electrodes and the bonding portion. A height at which the adhesives fall along the connection portions of the external terminals is defined as t and a height of the interposer is defined as T, t/T satisfies 0.04?t/T?0.80.Type: GrantFiled: November 19, 2018Date of Patent: February 2, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ho Yoon Kim, Sang Soo Park, Woo Chul Shin
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Patent number: 10910155Abstract: An electronic component includes a multilayer capacitor comprising a capacitor body, and an external electrode disposed on an end of the capacitor body, and an interposer comprising an interposer body, and an external terminal disposed on an end of the interposer body. The external terminal includes a connection portion disposed on a first surface of the interposer body and connected to the external electrode, a mounting portion disposed on a second surface of the interposer body opposing the first surface, and a side connection portion disposed on the first and second surfaces and a side surface of the interposer to connect the connection portion and the mounting portion. The side connection portion includes a cutting portion.Type: GrantFiled: November 27, 2018Date of Patent: February 2, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Won Chul Sim, Ho Yoon Kim, Sang Soo Park, Woo Chul Shin
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Patent number: 10910163Abstract: A multilayer electronic component include a multilayer capacitor including a capacitor body and first and second external electrodes disposed on ends of the capacitor body, respectively; an alumina chip including a chip body and first and second external terminals disposed on ends of the chip body, respectively, the first and second external terminals being in contact with the first and second external electrodes, respectively; a first plating layer covering the first external electrode and the first external terminal; and a second plating layer covering the second external electrode and the second external terminal. The first and second plating layers each include a nickel plating layer a tin plating layer disposed on the first external electrode and the first external terminal and on the second external electrode and the second external terminal, respectively.Type: GrantFiled: March 26, 2019Date of Patent: February 2, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Heon Jeong, Kyung Hwa Yu, Man Su Byun, Min Kyoung Cheon, Soo Hwan Son, Ho Yoon Kim