Patents by Inventor HO-YUAN LIN

HO-YUAN LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088027
    Abstract: An integrated circuit includes an inductor that includes a first set of conductors in at least a first metal layer, and a guard ring enclosing the inductor. The guard ring includes a first conductor extending in a first direction, a second conductor extending in a second direction, and a first set of staggered conductors coupled to a first end of the first conductor and a first end of the second conductor. The first set of staggered conductors includes a second set of conductors in a second metal layer, a third set of conductors in a third metal layer and a first set of vias coupling the second set of conductors with the third set of conductors. The third metal layer is above the second metal layer. All metal lines in the second metal layer that are part of the guard ring extend in the first direction.
    Type: Application
    Filed: November 14, 2023
    Publication date: March 14, 2024
    Inventors: Chiao-Han LEE, Chi-Hsien LIN, Ho-Hsiang CHEN, Hsien-Yuan LIAO, Tzu-Jin YEH, Ying-Ta LU
  • Publication number: 20120097681
    Abstract: A waterproofing method and structure are applicable to an electronic device having a first casing and a second casing, the first casing having a first adjoining-brim peripherally disposed thereon, and the second casing having a peripheral second adjoining-brim for adjoining the first adjoining-brim. The method includes forming a convex portion circumferentially along the first adjoining-brim; forming a concave portion circumferentially along the second adjoining-brim, the concave portion corresponding in position to the convex portion; disposing a resilient unit in the concave portion, the resilient unit including a body and a soft interfering element protruding therefrom; coupling the first and second adjoining-brims together such that the convex portion presses against the soft interfering element to enable deformation thereof, thereby forming a first interfering structure.
    Type: Application
    Filed: December 1, 2010
    Publication date: April 26, 2012
    Applicant: ASKEY COMPUTER CORP.
    Inventors: HO-YUAN LIN, CHING-FENG HSIEH
  • Publication number: 20120087722
    Abstract: A coupling mechanism for coupling together a first body and a second body of an electronic device includes a first engagement module and a second engagement module. The first engagement module is disposed at the first body and has an engagement groove and a first guiding slope connected thereto. The second engagement module is disposed in a receiving space of the second body and includes an engaging member and a resilient element. The engaging member has a pressing portion and an engaging portion. The pressing portion protrudes from the second body so as to be pressed. The engaging portion is slidable relative to the first guiding slope to thereby lift/lower the engaging member, and is engageable with the engagement groove to couple the first and second bodies together. The resilient element exerts a resilient force upon the engaging member according to the lifted/lowered state of the engaging member.
    Type: Application
    Filed: December 1, 2010
    Publication date: April 12, 2012
    Applicant: ASKEY COMPUTER CORP.
    Inventors: HO-YUAN LIN, CHING-FENG HSIEH