Abstract: A heat dissipating module is adapted for dissipating thermal energy from an electronic element mounted on a circuit board, and includes a heat sink, a heat conductive board including a plurality of tube portions that extend through the circuit board, a heat conductive tube that interconnects the heat sink and the circuit board, and a plurality of fixing elements. Each fixing elements includes a first end part be secured to the heat conductive board, a second end part exposed from an end opening of a respective tube portion, and a pair of interference parts that extend resiliently, respectively and outwardly through lateral openings of the respective the tube portion for abutting against the circuit board. The heat dissipating module further includes a resilient unit disposed between and connected resiliently to the circuit board and the heat conductive board.

Abstract: This invention provides a mounting device and an electronic system. The electronic system includes an electronic device and a mounting device. The mounting device includes a mounting bracket, a rail member, and a sliding member. The mounting bracket is mounted to the electronic device. The rail member is rotatably and pivotally connected to the mounting bracket. The rail member has a rail, and the rail has a first end and a second end. The sliding member is slidably disposed at the mounting bracket and has a protrusion portion capable of sliding along the rail. When the rail member rotates relative to the mounting bracket and the rail pushes the protrusion portion to move from the first end to the second end, the sliding member is inserted into a fastening hole of the electronic system.

Abstract: A heat dissipating module is adapted for dissipating thermal energy from an electronic element mounted on a circuit board, and includes a heat sink, a heat conductive board including a plurality of tube portions that extend through the circuit board, a heat conductive tube that interconnects the heat sink and the circuit board, and a plurality of fixing elements. Each fixing elements includes a first end part be secured to the heat conductive board, a second end part exposed from an end opening of a respective tube portion, and a pair of interference parts that extend resiliently, respectively and outwardly through lateral openings of the respective the tube portion for abutting against the circuit board. The heat dissipating module further includes a resilient unit disposed between and connected resiliently to the circuit board and the heat conductive board.

Abstract: This invention provides a mounting device and an electronic system. The electronic system includes an electronic device and a mounting device. The mounting device includes a mounting bracket, a rail member, and a sliding member. The mounting bracket is mounted to the electronic device. The rail member is rotatably and pivotally connected to the mounting bracket. The rail member has a rail, and the rail has a first end and a second end. The sliding member is slidably disposed at the mounting bracket and has a protrusion portion capable of sliding along the rail. When the rail member rotates relative to the mounting bracket and the rail pushes the protrusion portion to move from the first end to the second end, the sliding member is inserted into a fastening hole of the electronic system.

Abstract: The invention discloses a damper including a damping portion, a first pillar-shaped portion, a second pillar-shaped portion and a first block portion. The damping portion has a first end and a second end. The first pillar-shaped portion protrudes from the first end of the damping portion, and the second pillar-shaped portion protrudes from the second end of the damping portion. The first pillar-shaped portion has a third end away from the first end of the damping portion, and the first block portion protrudes from the third end. In the invention, the damper can fix a speaker to a base directly without screws.