Patents by Inventor Hoa Thanh LE

Hoa Thanh LE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing a hollow MEMS structure
    Patent number: 10442686
    Abstract: The present invention relates to a method for manufacturing an at least partly hollow MEMS structure. In a first step one or more through-going openings is/are provided in core material. The one or more through-going openings is/are then covered by an etch-stop layer. After this step, a bottom electrically conducting layer, one or more electrically conducting vias and a top electrically conducting layer are created. The bottom layer is connected to the vias and vias are connected to the top layer. The vias are formed by filling at least one of the one or more through-going openings. The method further comprises the step of creating bottom and top conductors in the respective bottom and top layers. Finally, excess core material is removed in order to create the at least partly hollow MEMS structure which may include a MEMS inductor.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: October 15, 2019
    Assignee: Danmarks Tekniske Universitet
    Inventors: Hoa Thanh Le, Anpan Han, Karen Birkelund, Anders Michael Jorgensen, Flemming Jensen
  • A METHOD FOR MANUFACTURING A HOLLOW MEMS STRUCTURE
    Publication number: 20180370792
    Abstract: The present invention relates to a method for manufacturing an at least partly hollow MEMS structure. In a first step one or more through-going openings is/are provided in core material. The one or more through-going openings is/are then covered by an etch-stop layer. After this step, a bottom electrically conducting layer, one or more electrically conducting vias and a top electrically conducting layer are created. The bottom layer is connected to the vias and vias are connected to the top layer. The vias are formed by filling at least one of the one or more through-going openings. The method further comprises the step of creating bottom and top conductors in the respective bottom and top layers. Finally, excess core material is removed in order to create the at least partly hollow MEMS structure which may include a MEMS inductor.
    Type: Application
    Filed: September 19, 2016
    Publication date: December 27, 2018
    Applicant: Danmarks Tekniske Universitet
    Inventors: Hoa Thanh LE, Anpan HAN, Karen BIRKELUND, Anders Michael JORGENSEN, Flemming JENSEN