Patents by Inventor Hoa Thanh Phan
Hoa Thanh Phan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7479796Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.Type: GrantFiled: May 10, 2007Date of Patent: January 20, 2009Assignee: International Business Machines CorporationInventors: John Saunders Corbin, Jr., Jose Arturo Garza, Dales Morrison Kent, Kenneth Carl Larsen, Howard Victor Mahaney, Jr., Hoa Thanh Phan, John Joseph Salazar
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Patent number: 7466155Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.Type: GrantFiled: May 10, 2007Date of Patent: December 16, 2008Assignee: International Business Machines CorporationInventors: John Saunders Corbin, Jr., Jose Arturo Garza, Dales Morrison Kent, Kenneth Carl Larsen, Howard Victor Mahaney, Jr., Hoa Thanh Phan, John Joseph Salazar
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Patent number: 7463017Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.Type: GrantFiled: May 10, 2007Date of Patent: December 9, 2008Assignee: International Business Machines CorporationInventors: John Saunders Corbin, Jr., Jose Arturo Garza, Dales Morrison Kent, Kenneth Carl Larsen, Howard Victor Mahaney, Jr., Hoa Thanh Phan, John Joseph Salazar
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Patent number: 7456644Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.Type: GrantFiled: May 10, 2007Date of Patent: November 25, 2008Assignee: International Business Machines CorporationInventors: John Saunders Corbin, Jr., Jose Arturo Garza, Dales Morrison Kent, Kenneth Carl Larsen, Howard Victor Mahaney, Jr., Hoa Thanh Phan, John Joseph Salazar
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Patent number: 7453279Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.Type: GrantFiled: May 10, 2007Date of Patent: November 18, 2008Assignee: International Business Machines CorporationInventors: John Saunders Corbin, Jr., Jose Arturo Garza, Dales Morrison Kent, Kenneth Carl Larsen, Howard Victor Mahaney, Jr., Hoa Thanh Phan, John Joseph Salazar
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Patent number: 7425822Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.Type: GrantFiled: May 10, 2007Date of Patent: September 16, 2008Assignee: International Business Machines CorporationInventors: John Saunders Corbin, Jr., Jose Arturo Garza, Dales Morrison Kent, Kenneth Carl Larsen, Howard Victor Mahaney, Jr., Hoa Thanh Phan, John Joseph Salazar
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Patent number: 7423440Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.Type: GrantFiled: May 10, 2007Date of Patent: September 9, 2008Assignee: International Business Machines CorporationInventors: John Saunders Corbin, Jr., Jose Arturo Garza, Dales Morrison Kent, Kenneth Carl Larsen, Howard Victor Mahaney, Jr., Hoa Thanh Phan, John Joseph Salazar
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Publication number: 20080186043Abstract: An innovative chip testing system and method includes controlling temperature and condensation during testing. Coarse temperature is controlled by providing a desired fluid flow rate and fluid temperature to a cold plate. Fine temperature control is provided by a feedback loop which controls the power dissipation of cartridge heaters installed within the cold plate. Condensation control is provided by insulating various components of the system, manipulation of dry compressed air in enclosures to reduce surface dew point temperatures, usage of cartridge heaters in a card backside stiffener plate, and by providing a heatsink assembly which prevents condensation on the insulation.Type: ApplicationFiled: August 17, 2006Publication date: August 7, 2008Inventors: Daniel Paul Beaman, John Saunders Carbin, Dales Morrison Kent, Howard Victor Mahaney, Hoa Thanh Phan, Frederic William Wright
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Patent number: 7405583Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.Type: GrantFiled: May 10, 2007Date of Patent: July 29, 2008Assignee: International Business Machines CorporationInventors: John Saunders Corbin, Jr., Jose Arturo Garza, Dales Morrison Kent, Kenneth Carl Larsen, Howard Victor Mahaney, Jr., Hoa Thanh Phan, John Joseph Salazar
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Patent number: 7352200Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.Type: GrantFiled: January 12, 2005Date of Patent: April 1, 2008Assignee: International Business Machines CorporationInventors: John Saunders Corbin, Jr., Jose Arturo Garza, Dales Morrison Kent, Kenneth Carl Larsen, Howard Victor Mahaney, Jr., Hoa Thanh Phan, John Joseph Salazar
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Patent number: 7135877Abstract: An innovative chip testing system and method includes controlling temperature and condensation during testing. Coarse temperature is controlled by providing a desired fluid flow rate and fluid temperature to a cold plate. Fine temperature control is provided by a feedback loop which controls the power dissipation of cartridge heaters installed within the cold plate. Condensation control is provided by insulating various components of the system, manipulation of dry compressed air in enclosures to reduce surface dew point temperatures, usage of cartridge heaters in a card backside stiffener plate, and by providing a heatsink assembly which prevents condensation on the insulation.Type: GrantFiled: August 20, 2004Date of Patent: November 14, 2006Assignee: International Business Machines CorporationInventors: Daniel Paul Beaman, John Saunders Corbin, Jr., Dales Morrison Kent, Howard Victor Mahaney, Jr., Hoa Thanh Phan, Frederic William Wright, IV