Patents by Inventor Hoan Vu

Hoan Vu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260096462
    Abstract: A clip-bonded semiconductor package including: a semiconductor die including a bond pad on a top side of the semiconductor die, the bond pad is arranged to receive a bond clip, the bond clip is also arranged to provide electrical connection to the bond pad via a connection part of the bond clip, the bond clip further includes a buffer layer provided to at least the connection part. A hardness of a material of the buffer layer is lower than a hardness of a material of the bond clip.
    Type: Application
    Filed: September 30, 2025
    Publication date: April 2, 2026
    Applicant: NEXPERIA B.V.
    Inventors: Tim Böttcher, Hoan Vu, Haibo Fan, Khairul Ikhsan Yahaya, Wai Keung Ho, To Kam Ng, Dirk Bernhardt
  • Publication number: 20130045803
    Abstract: Cross-platform gaming between multiple devices of multiple types, including: determining, by a cross-platform gaming server, the device type of a first gaming device; sending, in dependence upon the device type of the first gaming device, a gaming application from the cross-platform gaming server to the first gaming device; determining, by the cross-platform gaming server, the device type of the second gaming device; sending, in dependence upon the device type of the second gaming device, a gaming application from the cross-platform gaming server to the second gaming device; and communicating, in real-time, between the gaming application on the first gaming device and the gaming application on the second gaming device.
    Type: Application
    Filed: August 21, 2011
    Publication date: February 21, 2013
    Applicant: DIGITAL HARMONY GAMES, INC.
    Inventors: Keren Kang, Jeff Lujan, Hoan Vu