Abstract: An example method includes detecting, using sensors, packets throughout a datacenter. The sensors can then send packet logs to various collectors which can then identify and summarize data flows in the datacenter. The collectors can then send flow logs to an analytics module which can identify the status of the datacenter and detect an attack.

Abstract: Systems, methods, and computer-readable media for gathering network intrusion counter-intelligence. A system can maintain a decoy network environment at one or more machines. The system can identify a malicious user accessing network services through the network environment. Further, the system can receive network service access requests from the user at one or more machines in the network environment and subsequently direct the network service access requests from the malicious user to the decoy network environment based on an identification of the malicious user. The network services access requests can be satisfied with network service access responses generated in the decoy network environment. Subsequently, the system can maintain malicious user analytics based on the network service access requests of the malicious user that are directed to the decoy network environment.

Abstract: An example method includes detecting, using sensors, packets throughout a datacenter. The sensors can then send packet logs to various collectors which can then identify and summarize data flows in the datacenter. The collectors can then send flow logs to an analytics module which can identify the status of the datacenter and detect an attack.

Abstract: An example method includes detecting, using sensors, packets throughout a datacenter. The sensors can then send packet logs to various collectors which can then identify and summarize data flows in the datacenter. The collectors can then send flow logs to an analytics module which can identify the status of the datacenter and detect an attack.

Abstract: An example method includes detecting, using sensors, packets throughout a datacenter. The sensors can then send packet logs to various collectors which can then identify and summarize data flows in the datacenter. The collectors can then send flow logs to an analytics module which can identify the status of the datacenter and detect an attack.

Abstract: An example method can include choosing a pattern or patterns of network traffic. This pattern can be representative of a certain type of traffic such as an attack. The pattern can be associated with various components of a network and can describe expected behavior of these various components. A system performing this method can then choose a nodes or nodes to generate traffic according to the pattern and send an instruction accordingly. After this synthetic traffic is generated, the system can compare the behavior of the components with the expected behavior. An alert can then be created to notify an administrator or otherwise remedy any problems.

Abstract: The present technology is directed to mapping flow data and overlaying it on a geographic map. Furthermore the geographical map can also display attacks and the flow of an attack from the source to a logical entity. The map additionally can be accompanied with a pie chart relating to the attacks and intensity of attacks. Normal flows can also be displayed on the map along with the attack flows.

Abstract: The invention relates to an arrangement of a chemical-mechanical polishing tool for chemical-mechanical polishing a surface on a wafer, comprising a polishing pad (4), a drive unit (9), pressing means (6), a wafer holder (5), first dispensing means (7) and second dispensing means (8); the wafer holder for holding a wafer (W) being arranged at a holder location (L0); the pressing means (6) being arranged to press the wafer holder (5) to the polishing pad (4); the first dispensing means (7) for dispensing a first fluid on the polishing pad (4) being arranged at a first dispensing means location (L1); the second dispensing means (8) for dispensing a second fluid on the polishing pad (4) being arranged at a second dispensing means location (L2); the polishing pad (4) comprising a polishing surface for polishing the wafer (W), and the polishing pad (4) further being connected to the drive unit (9) for moving the polishing surface in a first direction (&ohgr;1) relative to the holder location (L0);