Patents by Inventor Hobin Jeong

Hobin Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11156914
    Abstract: Methods of fabricating a damascene template for electrophoretic assembly and transfer of patterned nanoelements are provided which do not require chemical mechanical polishing to achieve a uniform surface area. The methods include conductive layer fabrication using a combination of precision lithography techniques using etching or building up the conductive layer to form raised conductive features separated by an insulating layer of equal height.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: October 26, 2021
    Assignee: Northeastern University
    Inventors: Hobin Jeong, Ahmed Busnaina
  • Publication number: 20190384168
    Abstract: Methods of fabricating a damascene template for electrophoretic assembly and transfer of patterned nanoelements are provided which do not require chemical mechanical polishing to achieve a uniform surface area. The methods include conductive layer fabrication using a combination of precision lithography techniques using etching or building up the conductive layer to form raised conductive features separated by an insulating layer of equal height.
    Type: Application
    Filed: February 12, 2018
    Publication date: December 19, 2019
    Inventors: Hobin Jeong, Ahmed Busnaina