Patents by Inventor Hoc Khiem Trieu

Hoc Khiem Trieu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090066347
    Abstract: A biosensor for measuring a concentration of an analyte within a medium includes an electrical charge storage and a resistive layer including an electrical resistance which changes upon contact with the analyte. The electrical charge storage includes a sensor electrode, and the resistive layer may be contacted with the medium and is arranged between the medium and the sensor electrode such that during contact with the medium, a number of the electrical charges stored in the electrical charge storage pass the resistive layer.
    Type: Application
    Filed: September 11, 2008
    Publication date: March 12, 2009
    Applicant: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Sinan UENLUEBAYIR, Hoc-Khiem TRIEU
  • Publication number: 20080299013
    Abstract: A chip-holder for holding a micro-fluidic chip has a fixer for detachably fixing the micro-fluidic chip in the chip-holder and at least one process control device configured to support control or monitoring of a chemical process in the micro-fluidic chip, wherein the chip-holder is configured such that the process control device and the micro-fluidic chip are directly and detachably coupled when the micro-fluidic chip is fixed in the chip-holder. Such a chip-holder brings along the advantage that the micro-fluidic chip can easily be removed and exchanged while the process control device can be reused. This reduces running costs of a chemical microreactor system drastically and allows for a very flexible usage of a chemical microreactor system.
    Type: Application
    Filed: July 25, 2005
    Publication date: December 4, 2008
    Applicant: Frakunhofer-Gesellschaft zur Forderung der angewandten Forschung e. V.
    Inventors: Hoc Khiem Trieu, Michael Bollerott, Martin Kemmerling, Robert Hildebrand, Jan Van Hest, Kaspar Koch, Pieter Nieuwland, Teris A. Van Beek, Ernst J.R. Sudholter, Remko M. Boom, Anja E.M. Janssen, Floris Rutjes
  • Publication number: 20080282808
    Abstract: A measurer for measuring a flow rate of a medium which may be multi-component or heterogeneous, independently of the medium, a signal-generating unit generating a transmit signal on the basis of a reference signal of a signal generator and transmitting same by means of a stimulator via the flowing medium. This signal is received by a sensor and passed on to an evaluating unit which is implemented to determine a signal transfer time based on a plurality of mutually corresponding locations of a waveform of the receive signal and the waveform corresponding to the reference signal and the flow rate of the medium based on the signal transfer time and the certain distance between the stimulator and the sensor.
    Type: Application
    Filed: July 21, 2005
    Publication date: November 20, 2008
    Applicant: Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e. V.
    Inventors: Hoc Khiem Trieu, Thomas Van Den Boom, Dirk Weiler, Niels Christoffers
  • Patent number: 6479890
    Abstract: A microsystem comprises a flexible foil, a plurality of semiconductor elements embedded in said flexible foil, and a connection line arranged substantially on said flexible foil and used for electrically connecting at least two semiconductor elements. For producing the microsystem, electronic components are first integrated in a semiconductor layer provided on a wafer. Subsequently, the semiconductor areas which are not required between the electronic components are etched away, whereupon the flexible foil is applied. A connection line is then applied to the flexible foil so as to interconnect the individual semiconductor elements. Finally, the semiconductor is etched away from the back so as to obtain the microsystem in the case of which the individual semiconductor elements are mechanically connected only by the flexible foil but no longer by the semiconductor substrate.
    Type: Grant
    Filed: August 31, 2000
    Date of Patent: November 12, 2002
    Assignee: Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.
    Inventors: Hoc Khiem Trieu, Wilfried Mokwa, Lutz Ewe