Patents by Inventor Hock Peng Lim

Hock Peng Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180109881
    Abstract: A hearing aid includes an acoustoelectric transducer, a signal processing device and an electroacoustic transducer. The signal processing device has a flexible printed circuit board provided with electronic components. The printed circuit board is bent to form an approximately G-shaped stacked configuration. The stacked configuration of the printed circuit board has three horizontal limbs disposed above one another along a stacking direction. The outer horizontal limbs are connected to one another by a first printed circuit board section and one of the outer limbs and the middle limb are connected to one another by a second printed circuit board section. The first printed circuit board section is reinforced along the stacking direction and the horizontal limbs in the stacked configuration are spaced apart from one another along the stacking direction.
    Type: Application
    Filed: October 18, 2017
    Publication date: April 19, 2018
    Inventors: ZHENG ZHONG CHEW, HOCK PENG LIM, MENG KIANG LIM, SITI HAJAR RAHMAN, WEE LENG TAN, HONG CHING TAY
  • Patent number: 8461693
    Abstract: In an embodiment, a substrate arrangement is provided. The substrate arrangement may include a semiconductor substrate including a first contact portion and a second contact portion on a first surface of the semiconductor substrate, wherein the semiconductor substrate is arranged such that the first contact portion and the second contact portion face each other. The substrate arrangement may further include an electrical connector configured to connect the first contact portion and the second contact portion.
    Type: Grant
    Filed: August 26, 2008
    Date of Patent: June 11, 2013
    Assignee: Siemens Medical Instruments Pte. Ltd.
    Inventors: Hock Peng Lim, Meng Kiang Lim
  • Publication number: 20110233783
    Abstract: In an embodiment, a substrate arrangement is provided. The substrate arrangement may include a semiconductor substrate including a first contact portion and a second contact portion on a first surface of the semiconductor substrate, wherein the semiconductor substrate is arranged such that the first contact portion and the second contact portion face each other. The substrate arrangement may further include an electrical connector configured to connect the first contact portion and the second contact portion.
    Type: Application
    Filed: August 26, 2008
    Publication date: September 29, 2011
    Applicant: SIEMENS MEDICAL INSTRUMENTS PTE. LTD.
    Inventors: Hock Peng Lim, Meng Kiang Lim
  • Publication number: 20100054514
    Abstract: An electrical circuit has a printed circuit board which is lengthened at the side in the form of at least one longitudinal contact projection having at least one electrical conductor track and a solder point disposed at the end of the conductor track. Because of its mechanical flexibility, the contact projection allows flexible contact to be made with other electronic components, with little effort. An electrical circuit such as this is particularly highly suitable for electrical small appliances, in particular for a hearing aid.
    Type: Application
    Filed: August 27, 2009
    Publication date: March 4, 2010
    Applicant: SIEMENS MEDICAL INSTRUMENTS PTE. LTD.
    Inventors: Chor Fan Chan, Leep Foong Chew, Cher Huat Lim, Hock Peng Lim, Meng Kiang Lim, Chow Lan Stella Yap