Patents by Inventor Hoe Jun KIM

Hoe Jun KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11329097
    Abstract: An embodiment provides a semiconductor device including a light-emitting structure including a plurality of light-emitting portions disposed at a side and a plurality of second light-emitting portions disposed at another side, a plurality of first connection electrodes configured to electrically connect the plurality of first light-emitting portions, a plurality of second connection electrodes configured to electrically connect the plurality of second light-emitting portions, a first pad disposed on the plurality of first light-emitting portions, and a second pad disposed on the plurality of second light-emitting portions. The first pad includes a plurality of 1-2 pads extending toward the second pad. The second pad includes a plurality of 2-2 pads extending toward the first pad. The first connection electrode includes a region between the plurality of 1-2 pads in a thickness direction of the light-emitting structure.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: May 10, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Woo Sik Lim, Jae Won Seo, Jin Kyung Choi, Youn Joon Sung, Jong Hyun Kim, Hoe Jun Kim
  • Publication number: 20200105825
    Abstract: An embodiment provides a semiconductor device including a light-emitting structure including a plurality of light-emitting portions disposed at a side and a plurality of second light-emitting portions disposed at another side, a plurality of first connection electrodes configured to electrically connect the plurality of first light-emitting portions, a plurality of second connection electrodes configured to electrically connect the plurality of second light-emitting portions, a first pad disposed on the plurality of first light-emitting portions, and a second pad disposed on the plurality of second light-emitting portions. The first pad includes a plurality of 1-2 pads extending toward the second pad. The second pad includes a plurality of 2-2 pads extending toward the first pad. The first connection electrode includes a region between the plurality of 1-2 pads in a thickness direction of the light-emitting structure.
    Type: Application
    Filed: March 27, 2018
    Publication date: April 2, 2020
    Inventors: Woo Sik LIM, Jae Won SEO, Jin Kyung CHOI, Youn Joon SUNG, Jong Hyun KIM, Hoe Jun KIM
  • Patent number: 10586892
    Abstract: One embodiment relates to a light emitting device which is free from electrostatic discharge by using an electrostatic discharge suppressing pattern including a resin having particles conductive and dispersed therein, the light emitting device comprising: a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a first electrode connected with the first conductive semiconductor layer; a second electrode connected with the second conductive semiconductor layer; and an electrostatic discharge suppressing pattern, which is overlapped with the first electrode and the second electrode, and of which first particles are dispersed in the resin so as to cover a gap between the first electrode and the second electrode.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: March 10, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jun Hee Hong, Deok Ki Hwang, Hoe Jun Kim, Woo Sik Lim
  • Patent number: 10418523
    Abstract: A light-emitting device in an embodiment includes a substrate, a light-emitting structure which is disposed on the substrate and includes a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, first and second electrodes which are respectively connected to the first and second conductive semiconductor layers, first and second bonding pads respectively connected to the first and second electrodes, and an insulating layer disposed between the first bonding pad and the second electrode, and between the second bonding pad and the first electrode. The first thickness of the first electrode may be ? or less of the second thickness of the insulating layer disposed between the second bonding pad and the first electrode.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: September 17, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sang Youl Lee, Hoe Jun Kim, Sung Ho Jung
  • Patent number: 10381519
    Abstract: A light emitting device package, according to an embodiment, includes: a substrate; a light emitting structure that is disposed below the substrate and includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a first bonding pad connected with the first conductive type semiconductor layer while being embedded in a through-hole exposed the first conductive type semiconductor layer by passing through the active layer and the second conductive type semiconductor layer; a second bonding pad that is disposed below the second conductive type semiconductor layer while being spaced apart from the first bonding pad and is connected with the second conductive type semiconductor layer; a first insulation layer disposed on the lateral portion of the light emitting structure in the through-hole and on the lower inner edge of the light emitting structure; and a second insulation layer disposed between the first insulation layer and the first bonding pad in the
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: August 13, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jae Won Seo, Hoe Jun Kim, Bum Jin Yim, Jun Hee Hong
  • Publication number: 20180309026
    Abstract: One embodiment relates to a light emitting device which is free from electrostatic discharge by using an electrostatic discharge suppressing pattern including a resin having particles conductive and dispersed therein, the light emitting device comprising: a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a first electrode connected with the first conductive semiconductor layer; a second electrode connected with the second conductive semiconductor layer; and an electrostatic discharge suppressing pattern, which is overlapped with the first electrode and the second electrode, and of which first particles are dispersed in the resin so as to cover a gap between the first electrode and the second electrode.
    Type: Application
    Filed: October 21, 2016
    Publication date: October 25, 2018
    Inventors: Jun Hee HONG, Deok Ki HWANG, Hoe Jun KIM, Woo Sik LIM
  • Publication number: 20180122991
    Abstract: A light-emitting device in an embodiment includes a substrate, a light-emitting structure which is disposed on the substrate and includes a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, first and second electrodes which are respectively connected to the first and second conductive semiconductor layers, first and second bonding pads respectively connected to the first and second electrodes, and an insulating layer disposed between the first bonding pad and the second electrode, and between the second bonding pad and the first electrode. The first thickness of the first electrode may be ? or less of the second thickness of the insulating layer disposed between the second bonding pad and the first electrode.
    Type: Application
    Filed: March 16, 2016
    Publication date: May 3, 2018
    Applicant: LG Innotek Co., Ltd.
    Inventors: Sang Youl LEE, Hoe Jun KIM, Sung Ho JUNG
  • Publication number: 20180026163
    Abstract: A light emitting device package, according to an embodiment, includes: a substrate; a light emitting structure that is disposed below the substrate and includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a first bonding pad connected with the first conductive type semiconductor layer while being embedded in a through-hole exposed the first conductive type semiconductor layer by passing through the active layer and the second conductive type semiconductor layer; a second bonding pad that is disposed below the second conductive type semiconductor layer while being spaced apart from the first bonding pad and is connected with the second conductive type semiconductor layer; a first insulation layer disposed on the lateral portion of the light emitting structure in the through-hole and on the lower inner edge of the light emitting structure; and a second insulation layer disposed between the first insulation layer and the first bonding pad in the
    Type: Application
    Filed: March 16, 2016
    Publication date: January 25, 2018
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Jae Won SEO, Hoe Jun KIM, Bum Jin YIM, Jun Hee HONG