Abstract: A battery module is disclosed. The battery module may comprise a plurality of battery cells stacked in a first direction, wherein each of the plurality of battery cells includes a cell body and an electrode lead protruding from the cell body; a busbar including a busbar body in which a plurality of busbar slits are formed, the electrode leads of the plurality of battery cells passing through the plurality of busbar slits, wherein the electrodes of the plurality of battery cells are respectively inserted into the plurality of busbar slits and are bent in the first direction to overlap with each other; and a first weld bead formed by melting and joining a portion of the busbar body and a portion of the electrode lead, the first weld bead extending in the first direction.

Abstract: Disclosed are a laser processing method for cutting a semiconductor wafer having a metal layer formed thereon and a laser processing device. The disclosed laser processing method transmits a plurality of laser beams, which propagate coaxially, to the semiconductor wafer, thereby forming focusing points in positions adjacent to a surface of the metal layer, which constitutes a boundary with the semiconductor wafer, and to one surface of the semiconductor wafer, respectively.

Abstract: Disclosed are a laser processing method for cutting a semiconductor wafer having a metal layer formed thereon and a laser processing device. The disclosed laser processing method transmits a plurality of laser beams, which propagate coaxially, to the semiconductor wafer, thereby forming focusing points in positions adjacent to a surface of the metal layer, which constitutes a boundary with the semiconductor wafer, and to one surface of the semiconductor wafer, respectively.