Patents by Inventor Hoe Min CHEONG

Hoe Min CHEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laser processing method for cutting semiconductor wafer having metal layer formed thereon and laser processing device
    Patent number: 10134681
    Abstract: Disclosed are a laser processing method for cutting a semiconductor wafer having a metal layer formed thereon and a laser processing device. The disclosed laser processing method transmits a plurality of laser beams, which propagate coaxially, to the semiconductor wafer, thereby forming focusing points in positions adjacent to a surface of the metal layer, which constitutes a boundary with the semiconductor wafer, and to one surface of the semiconductor wafer, respectively.
    Type: Grant
    Filed: April 14, 2015
    Date of Patent: November 20, 2018
    Assignee: EO TECHNICS CO., LTD.
    Inventors: Hoe Min Cheong, Sang Young Park
  • LASER PROCESSING METHOD FOR CUTTING SEMICONDUCTOR WAFER HAVING METAL LAYER FORMED THEREON AND LASER PROCESSING DEVICE
    Publication number: 20170084546
    Abstract: Disclosed are a laser processing method for cutting a semiconductor wafer having a metal layer formed thereon and a laser processing device. The disclosed laser processing method transmits a plurality of laser beams, which propagate coaxially, to the semiconductor wafer, thereby forming focusing points in positions adjacent to a surface of the metal layer, which constitutes a boundary with the semiconductor wafer, and to one surface of the semiconductor wafer, respectively.
    Type: Application
    Filed: April 14, 2015
    Publication date: March 23, 2017
    Applicant: EO TECHNICS CO., LTD.
    Inventors: Hoe Min CHEONG, Sang Young PARK