Abstract: A battery module includes a sub-module stack formed by stacking a plurality of sub-modules including a cooling member having a coolant flow path and a plurality of battery cells disposed on both surfaces of the cooling member; and a pair of bus bar frame assemblies coupled to one side and the other side of the sub-module stack to electrically connect the plurality of battery cells.

Abstract: Disclosed is a cushion tip-up type seat for a vehicle. The cushion tip-up type seat for a vehicle is configured to perform a tip-up function of a cushion part, and to move a seat leftward and rightward to adjust an interval between left and right seats, whereby left and right spacing between occupants seated in the seats is sufficiently secured and the convenience of the occupants is improved.

Abstract: The present invention relates to a heteroaryl derivative compound and a use thereof. Since the heteroaryl derivative of the present invention exhibits excellent inhibitory activity against EGFR, the heteroaryl derivative can be usefully used as a therapeutic agent for EGFR-associated diseases.

Abstract: Provided is a semiconductor package. The semiconductor package includes an image sensor chip including a first surface and a second surface opposite to each other in a first direction; a transparent substrate spaced apart from the second surface of the image sensor chip in a second direction, wherein the transparent substrate includes a first part and a second part with a width different from the first part; an adhesive layer disposed between the second surface of the image sensor chip and the first part of the transparent substrate; and a mold layer on the second part of the transparent substrate, wherein the mold layer comprises side surfaces that extend along the first part of the transparent substrate, and further extend along side surfaces of the adhesive layer and side surfaces of the image sensor chip, and not extending along the first surface of the image sensor chip.

Abstract: An electronic device having a plurality of human-machine operation modules is disclosed. The electronic device is internally provided with at least one I/O module and a plurality of human-machine operation modules disposed in the electronic device, several human-machine operation modules being connected with the I/O module respectively.

Abstract: A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.

Abstract: An electronic device having multiple human-machine interfaces and a method for running multiple human-machine interfaces are provided. The electronic device includes a host and a plurality of human-machine interfaces. The host has a processor, and each of the human-machine interfaces is disposed in the host and includes a power setting module. The processor analyzes all the human-machine interfaces to determine a target interface in which the enabled power setting module is included, so as to perform message input and output operations of the target interface.

Abstract: A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.

Abstract: A complex type supporting frame used to allow an electronic device to stand on or to be hung on a mounting surface. The complex type supporting frame includes a supporting part and a fixing part disposed surrounding the peripheral of the supporting part. The supporting part includes a device connection structure to support the electronic device. A positioning structure is disposed at the peripheral of the fixing part.

Abstract: A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.

Abstract: A camera module includes an image sensor chip including a substrate having first and second opposite surfaces and a ground pad on the first surface, a housing surrounding the sides of the image sensor chip but which leaves the second surface of the image sensor chip exposed, an electromagnetic wave-shielding film united with the housing, and an electrical conductor electrically connected to the ground pad. The camera module also has an optical unit disposed on the first surface of the image sensor chip in the housing to guide light from an object to the image sensor chip. The electrical conductor extends through a side of the housing. The conductor also contacts the electromagnetic wave-shielding film to electrically connect the ground pad and the electromagnetic wave-shielding film.

Abstract: A method for receiving common control information from a base station to a plurality of subscriber stations in a wireless communication is provided. The common control information includes first information that all of the plurality of subscriber stations commonly receive and second information that the plurality of subscriber stations separately receive according to channel states of the plurality of subscriber stations. The first information is decoded by demodulating and decoding the common control information according to a modulation scheme and a coding scheme corresponding to an MCS (Modulation and Coding Scheme) level applied to the first information in the base station. The second information is decoded by demodulating and decoding the common control information according to a modulation scheme and a coding scheme corresponding to MCS levels applied to the second information in the base station.

Abstract: In a computer system, a random access memory of an interrupt router is programmed to store data as bit patterns at a plurality of memory locations. Each bit pattern correspond to a specific routing from a plurality of sources to a fixed number of interrupt input lines. The number of bits in each bit pattern equivalent to the number of interrupt input lines. The addresses of the memory, during operation, being selected by the interrupt signals generated by a plurality of interrupt sources.