Patents by Inventor Hoe-Chul KIM

Hoe-Chul KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor laser device
    Patent number: 11283235
    Abstract: A semiconductor laser device may include a first cladding on a substrate, an optical waveguide on the first cladding, a laser light source chip on the optical waveguide to generate a laser beam, a first adhesive layer between the optical waveguide and the laser light source chip, and a second adhesive layer covering a sidewall of the laser light source chip.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: March 22, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Pil-Kyu Kang, Seok-Ho Kim, Tae-Yeong Kim, Hoe-Chul Kim, Hoon-Joo Na
  • Wafer bonding apparatus for directly bonding wafers and a wafer bonding system having the same
    Patent number: 10906283
    Abstract: A wafer bonding apparatus including: a lower chuck to which a lower wafer is secured at a peripheral portion of the lower chuck; an upper chuck to which an upper wafer is secured; a bonding initiator for pressuring a central portion of the upper wafer until the central portion of the upper wafer reaches a central portion of the lower wafer, thereby initiating a bonding process of the upper and the lower wafers by deforming the upper wafer; and a bonding controller for controlling a bonding speed between a peripheral portion of the upper wafer and a peripheral portion of the lower wafer such that the upper wafer becomes un-deformed prior to bonding the peripheral portion of the upper wafer and the peripheral portion of the lower wafer.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: February 2, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Tae-Yeong Kim, Jun-Hyung Kim, Hoe-Chul Kim, Hoon-Joo Na, Kwang-Jin Moon
  • SEMICONDUCTOR LASER DEVICE
    Publication number: 20200136341
    Abstract: A semiconductor laser device may include a first cladding on a substrate, an optical waveguide on the first cladding, a laser light source chip on the optical waveguide to generate a laser beam, a first adhesive layer between the optical waveguide and the laser light source chip, and a second adhesive layer covering a sidewall of the laser light source chip.
    Type: Application
    Filed: August 12, 2019
    Publication date: April 30, 2020
    Inventors: Pil-Kyu KANG, Seok-Ho KIM, Tae-Yeong KIM, Hoe-Chul KIM, Hoon-Joo NA
  • WAFER BONDING APPARATUS FOR DIRECTLY BONDING WAFERS AND A WAFER BONDING SYSTEM HAVING THE SAME
    Publication number: 20200055296
    Abstract: A wafer bonding apparatus including: a lower chuck to which a lower wafer is secured at a peripheral portion of the lower chuck; an upper chuck to which an upper wafer is secured; a bonding initiator for pressuring a central portion of the upper wafer until the central portion of the upper wafer reaches a central portion of the lower wafer, thereby initiating a bonding process of the upper and the lower wafers by deforming the upper wafer; and a bonding controller for controlling a bonding speed between a peripheral portion of the upper wafer and a peripheral portion of the lower wafer such that the upper wafer becomes un-deformed prior to bonding the peripheral portion of the upper wafer and the peripheral portion of the lower wafer.
    Type: Application
    Filed: April 17, 2019
    Publication date: February 20, 2020
    Inventors: Tae-Yeong KIM, Jun-Hyung KIM, Hoe-Chul KIM, Hoon-Joo NA, Kwang-Jin MOON