Patents by Inventor Hoi Fung Tsang

Hoi Fung Tsang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7190446
    Abstract: A system is provided for processing electronic devices, and in particular for handling, inspecting, sorting and offloading the same. An apparatus for inspecting an electronic device comprises a holder for supporting the electronic device and a driving mechanism for moving the electronic device between an onloading position where the electronic device is placed onto the holder and an offloading position where the electronic device is removed from the holder. A first optical system between the onloading and offloading positions is configured to inspect a first surface of the electronic device while it is supported by the holder, Concurrently or subsequently, a second optical system between the onloading and offloading positions is configured to inspect a second surface of the electronic device that is opposite to the first surface while it is supported by the holder.
    Type: Grant
    Filed: December 19, 2003
    Date of Patent: March 13, 2007
    Assignee: ASM Assembly Automation Ltd.
    Inventors: Chi Wah Cheng, Hoi Fung Tsang, Chi Yat Yeung, Wang Lung Alan Tse
  • Patent number: 6711873
    Abstract: Packages of varying dimensions are loaded into a plurality of electrical package tubes. A guide arrangement is provided, which is programmable to receive the electrical packages by automatically configuring to accommodate the varying dimensions of the electrical packages, the configuring being performed without manual intervention, and a receiving arrangement is provided to receive the electrical package tubes and configured to individually align the electrical package tubes with the guide arrangement to receive the electrical packages. Upon application of a feeding force to the electrical packages, the guide arrangement guides the electrical packages into the electrical package tubes.
    Type: Grant
    Filed: November 7, 2001
    Date of Patent: March 30, 2004
    Assignee: ASM Assembly Automation Ltd.
    Inventors: Yiu Ming Cheung, Hoi Fung Tsang, Yui Ko Wong
  • Publication number: 20030084642
    Abstract: The invention relates to an apparatus for off-loading items of varying size such as electronic packages into receptacles such as tubes, there being means automatically to adjust dimension parameters of the apparatus whereby to accommodate packages of different size and load same into a tube therefor. The apparatus also has means for stacking a plurality of tubes for loading a bottom one of the stack, ejecting that one when loaded, and providing a subsequent tube from the stack for loading.
    Type: Application
    Filed: November 7, 2001
    Publication date: May 8, 2003
    Applicant: ASM Assembly Automation Ltd.
    Inventors: Yiu Ming Cheung, Hoi Fung Tsang, Yui Ko Wong