Patents by Inventor Hoi Le

Hoi Le has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low bonding temperature and pressure ultrasonic bonding process for making a microfluid device
    Publication number: 20060050109
    Abstract: A piezoelectric ceramic inkjet print head is made by an ultrasonic bonding process. Specifically, there are disclosed several improved features of ink jet print heads, including a more cost-effective bonding process using an ultrasonic bonding technique, an improved piezoelectric ceramic crystal pattern, and improved print head-piezoelectric electrical contacts. Further, there is disclosed an ultrasonic bonding process joining metallic objects with ultrasonic energy.
    Type: Application
    Filed: August 16, 2005
    Publication date: March 9, 2006
    Inventors: Hue Le, Hoi Le, David Elder, Thanh Le